WP_Term Object
(
    [term_id] => 19519
    [name] => Xpeedic
    [slug] => xpeedic
    [term_group] => 0
    [term_taxonomy_id] => 19519
    [taxonomy] => category
    [description] => 
    [parent] => 157
    [count] => 1
    [filter] => raw
    [cat_ID] => 19519
    [category_count] => 1
    [category_description] => 
    [cat_name] => Xpeedic
    [category_nicename] => xpeedic
    [category_parent] => 157
    [is_post] => 
)
            
Xpeedic Banner SemiWiki 1
WP_Term Object
(
    [term_id] => 19519
    [name] => Xpeedic
    [slug] => xpeedic
    [term_group] => 0
    [term_taxonomy_id] => 19519
    [taxonomy] => category
    [description] => 
    [parent] => 157
    [count] => 1
    [filter] => raw
    [cat_ID] => 19519
    [category_count] => 1
    [category_description] => 
    [cat_name] => Xpeedic
    [category_nicename] => xpeedic
    [category_parent] => 157
    [is_post] => 
)

Advanced Packaging Analysis at DesignCon

Advanced Packaging Analysis at DesignCon
by Tom Dillinger on 06-07-2022 at 10:00 am

meshing

The slogan for the DesignCon conference has been “where the chip meets the board”.  Traditionally, the conference has provided a breadth of technical presentations covering the design and analysis of high-speed communication interfaces and power integrity evaluations between chip, board, and system.

The recent DesignCon… Read More