In September, ClioSoft gave a SemiWiki webinar titled, Reusing Your IPs & PDKs Successfully With Cadence® Virtuoso®. I was happy to be the moderator of this webinar, having had the chance to work with ClioSoft’s team over many years. The webinar was informative while also being very time efficient. I think it is important for… Read More
Author: Daniel Nenni
WEBINAR: PAVE360 Validating Autonomous Vehicle Behavior
Siemens Mentor recently announced PAVE360™, a very cool comprehensive pre silicon simulation environment. Autonomous cars are very popular here in Silicon Valley and quite safe on the highways since the average speed is 25mph (horrible traffic). In the city you need autonomous parking unless you want to waste precious time … Read More
The New Silvaco CEO is SURGING!
One of my great pleasures in the semiconductor industry is meeting the people who have brought us to where we are today, at the forefront of modern life. One of those people is Babak Taheri, now CEO of Silvaco who I spent time with yesterday. Babak started in semiconductors around the same time I did 30+ years ago. He has a PhD in EECS and… Read More
Response to IP’s Growing Impact On Yield And Reliability
One of the reasons I founded SemiWiki nine years ago was the lack of EDA, IP and Foundry content in the media. The problem is that unless you work in the industry it is very difficult to write about it in competent technical detail. Most media outlets only know what vendors tell them which is how the semiconductor industry worked before… Read More
WEBINAR: Generating and Measuring IP Security Threat Levels For Your SoCs
IPs have an attack surface that indicates how they can be compromised in real world scenarios. Some portions of the attack surfaces are well known, others are discovered during analysis, testing or out in the field. SoCs that use large collections of IPs need a systematic and reliable way to determine the various security vulnerabilities… Read More
A Future Vision for 3D Heterogeneous Packaging
At the recent Open Innovation Platform® Ecosystem Forum in Santa Clara, TSMC provided an enlightening look into the future of heterogeneous packaging technology. Although the term chiplet packaging is often used to describe the integration of multiple silicon die of potentially widely-varying functionality, this article… Read More
A Review of TSMC’s OIP Ecosystem
Each year, TSMC conducts two events – the Technology symposium in the Spring and the Open Innovation Platform (OIP) ® Ecosystem Forum in the Fall. Yet, what is the OIP ecosystem? What does it encompass? And, how does the program differentiate TSMC from other foundries? At the recent OIP Forum in Santa Clara, Suk Lee, Senior Director,… Read More
Webinar: OCV and Timing Closure Sign-off by Silvaco on Oct 10 at 10AM
The old adage that goes the one constant thing you can always count on is change, could easily be reworded for semiconductor design to say the one constant thing you can count on is variation. This is doubly true. Not only is variation, in all its forms, a constant factor in design, additionally the methods of analyzing and dealing … Read More
Micron Mired in Murky Memory Market – Cutting Capex 30%- 2020 Challenging
- Solid Quarter but soft Outlook
- Recovery Slow- Future Cost Downs Harder
- Demand slightly ahead of supply-Shelf Stuffed?
- Bouncing along the Bottom of the Cycle
Results ahead of expectation but guide behind expectation
Quarterly results were slightly better than street expectations at $0.56 EPS and $4.87B in revenues however … Read More
GLOBALFOUNDRIES Ready for IPO in 2022?
Hard to believe but it’s the 10th anniversary of Globalfoundries. What a journey this has been. It truly has been an honor to work with GF over the years as they invested many billions of dollars in the fabless semiconductor ecosystem and added a colorful chapter in semiconductor history, absolutely.
We have written hundreds of … Read More










The Name Changes but the Vision Remains the Same – ESD Alliance Through the Years