Having just completed a cloud evaluation for SemiWiki I can tell you why eSilicon chose Google. Simply put, they are working harder to get cloud business. Google ($4B) is the number five cloud provider behind Microsoft ($21.2B), Amazon ($20.4B), IBM ($10.3B) and Oracle ($6.08B). There is a lot of money in the cloud and a lot more … Read More
Author: Daniel Nenni
The Evolution of the Extension Implant Part III
The problem of traditional FinFET Extension Implant doping concerns the awkward 3-dimensional structure of the fin. Because the Extension Implant defines the conductive electrical pathway between the Source/Drains and the undoped channel portion of the fin, it is essential that the fin be uniformly doped all three of its surfaces… Read More
The Evolution of the Extension Implant Part II
The use of hard masks instead of photoresist for the Extension implant is an effective way to optimize the amount of dopant that is retained along the fin sidewalls for those fins that border along photoresist edges (as discussed in Part 1 of this series).
However, hard masks do nothing to address the dominant problem driving steeper… Read More
A Brief History of Methodics
Methodics has been a key player in IP management for over 10 years. In this section, Methodics shares their history, technology, and their role in developing IP Lifecycle Management (IPLM) solutions for the electronics industry.
Methodics is recognized as a premier provider of IP Lifecycle Management (IPLM) and traceability… Read More
The Evolution of the Extension Implant Part I
The 3D character of FinFET transistor structures pose a range of unique fabrication problems that can make it challenging to get these devices to yield. This is especially true for the all-important Extension implant that is put in place just prior to the nitride spacer formation.
The Extension implant is a central component of… Read More
EDA Update 2019
Over the last six years EDA has experienced yet another disruption not unlike the Synopsys acquisition of Avant! in 2001 which positioned Synopsys for the EDA lead they still enjoy today. Or the hiring of famed venture capitalist Lip-Bu Tan in 2009 to be the CEO of struggling EDA pioneer Cadence Design Systems. Under Lip-Bu’s… Read More
A Quick TSMC 2019 Tech Symposium Overview
This year TSMC did a FinFET victory lap with the success of 16nm, 12nm, 10nm, and 7nm. It really is well deserved. Even though TSMC credits the ecosystem and customers, I credit TSMC and their relationship with Apple since it has pushed us all much harder than ever before. TSMC CEO C.C. Wei summed it up nicely in his keynote: Innovation,… Read More
A Brief History of IP Management
As RTL design started to increase in the late 1980’s and early 1990’s, it was becoming apparent that some amount of management was needed to keep track of all the design files and their associated versions. Because of the parallels to software development, design teams looked to the tools and methodologies that were in use by software… Read More
User2User Silicon Valley 2019
This will be one of the more interesting Mentor User Group Meetings now that the Siemens acquisition has fully taken effect and the new management team is in place. The Mentor User Conference is at the Santa Clara Marriott, Santa Clara, California on May 2, 2019 from 9:00 am to 6:00pm.
Remember, in 2017 Siemens acquired Mentor Graphics… Read More
TSMC Q1 2019 Earnings Call Discussion!
It’s no coincidence that the TSMC Symposium is right after the Q1 earnings call. This will allow TSMC to talk more freely and they certainly will, my opinion. It is a very interesting time in the semiconductor industry and TSMC, being the bellwether, can tell us what will happen the rest of the year and give us some 2020 insights.… Read More








AI RTL Generation versus AI RTL Verification