At the 2026 Chiplet Summit, Synopsys presented a bold vision for the future of semiconductor innovation: AI-driven multi-die design powered by agentic intelligence. As the semiconductor industry shifts rapidly toward chiplet-based architectures and 3D stacking, the complexity of design, verification, and system integration… Read More
Author: Daniel Nenni
Siemens to Deliver Industry-Leading PCB Test Engineering Solutions
Siemens has strengthened its position in EDA and manufacturing by acquiring ASTER Technologies, a specialist in test and reliability solutions for printed circuit boards. The acquisition represents a strategic step in Siemens’ broader vision to deliver a fully integrated, end-to-end digital thread for electronics design,… Read More
Smarter ECOs: Inside Easy-Logic’s ASIC Optimization Engine
TSMC Process Simplification for Advanced Nodes
In the modern world, the semiconductor industry stands at the heart of technological innovation. From smartphones and laptops to advanced medical devices and artificial intelligence systems, nearly every piece of contemporary electronics depends on increasingly sophisticated microchips. Among the leading companies … Read More
CEO Interview with Juniyali Nauriyal of Photonect
Juniyali Nauriyal is the CEO and Co-Founder of Photonect, a photonics startup focused on commercializing advanced fiber-to-chip attachment technologies. Juniyali is the co-inventor of Photonect’s core technology, which forms the foundation of the company. As CEO, she leads Photonect in translating cutting-edge photonic… Read More
CEO Interview with Aftkhar Aslam of yieldWerx
Aftkhar Aslam is the Co-Founder and Chief Executive Officer of yieldWerx and a semiconductor industry veteran with more than 30 years of experience spanning manufacturing, test engineering, yield management, IP strategy, and enterprise digital transformation.
Under his leadership, yieldWerx has become a trusted data and… Read More
Intelligent Networks: Power, Reliability, and Maintenance in Telecom — Webinar Preview
The upcoming webinar “Intelligent Networks: Power, Reliability, and Maintenance in Telecom” will focus on how telecommunications networks are adapting to growing demands for efficiency, resilience, and scalability. As telecom operators expand 5G deployments, integrate cloud-native architectures, and prepare for AI-driven… Read More
SiFive’s AI’s Next Chapter: RISC-V and Custom Silicon
In the rapidly evolving world of artificial intelligence and semiconductor design, open-standard processor architectures are gaining unprecedented traction. At the center of this shift is SiFive, a company founded by the original creators of the RISC-V ISA, which champions an open, extensible, and license-free alternative… Read More
Ceva IP: Powering the Era of Physical AI
Artificial intelligence is rapidly moving beyond the digital domain and into the physical world. From autonomous robots and smart factories to intelligent vehicles and connected consumer devices, AI systems are increasingly expected to perceive their surroundings, make real-time decisions, and act on them instantly. This… Read More
A Century of Miracles: From the FET’s Inception to the Horizons Ahead
The Field-Effect Transistor (FET), a cornerstone of modern electronics, marks its centennial in 2025, tracing back to Julius Edgar Lilienfeld’s groundbreaking invention in 1925. Born in 1882 in what is now Lviv, Ukraine, Lilienfeld was a prolific physicist who earned his PhD from Berlin University in 1905. His early … Read More










ASML High-NA EUV is Not Ready for High-Volume Production