1. To be responsible for driving leading edge process/device/advanced packaging development and optimization of CMOS/Flash/Specialty devices in order to meet scaling, performance, reliability, and manufacturability requirements.
2. Identify and solve IC process and device problems.
Job Qualifications
1. Master’s degree or above in Electrical Engineering, Physics, Materials Science, Chemistry or Chemical Engineering.
2. Semiconductor internship experience is preferred.
3. Exhibit good and open communication skills and be able to work within cross-functional teams.
4. Fluent in English.
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