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Verification Trends: 2016

Verification Trends: 2016
by Bernard Murphy on 09-26-2017 at 7:00 am

Periodically Mentor does us all a big favor by commissioning a survey of verification engineers across the world to illuminate trends in verification. This is valuable not only to satisfy our intellectual curiosity but also to help convince managers and finance mandarins that our enthusiasm to invest in new methods and tools is supported by broad industry trends.

I always find these surveys fascinating, as much for how they align (or not) with conventional wisdom as for new or evolving insights. So let’s dive in, starting with design sizes. Not including memory, ~31% of projects in 2016 were at 80M gates or more and ~20% were at 500M gates or more. Nearly 75% of all surveyed designs had at least one embedded processor, half had 2 or more processors and 16% had eight or more. They also note that “it is not uncommon” (no percentage provided) to find 150 or more IP blocks in a design.

On time spent in verification, the survey shows an average of 55% in 2016, though I see a fairly flat top to the distribution, from 50% to 70%. In 2012 more projects were between 60% and 70%, though the average was barely higher than in 2016. Perhaps growing verification teams contributed to flattening the peak. That would be thanks to the compound annual growth rate (CAGR) in verification heads over this period, at over 10%, versus CAGR in design heads at 3-4%. Also of note is that design engineers are spending half their time in verification, and that this hasn’t changed significantly since 2007.

Where do verification engineers spend their time? Unsurprisingly, nearly 40% in debug, 22% each in creating tests/running simulations and testbench development and 14% in test planning. I doubt much has changed here.

In dynamic verification, well over half of all projects are using code coverage and functional coverage metrics, along with assertions A slightly smaller number, apparently declining from earlier years, are using constrained random techniques, though Mentor note that this is skewed by an increased number of designs at under 100K gates (perhaps around sensor designs). They speculate that these teams may be less mature in digital verification methods. In general, the survey finds adoption of all these techniques leveling off, which they attribute to scaling limits in simulation – these methods are useful at the IP level, perhaps less so at the SoC level.

Some interesting results are shown around adoption of formal methods. In 2014, adoption of automatic formal methods (smart lint, connectivity checking, apps in general) was picking up fast and property checking (“classic formal”) grew very little. In 2016, automatic usage leveled off at around 20% of projects while property checking grew significantly to nearly 35% of projects. Mentor attribute this to teams having grown sufficiently comfortable with automatic methods to now branch out into property checking. This certainly suggests fertile territory for tool vendors to continue to grow adoption in both areas.

In hardware-assisted verification, 24% of projects are using emulation and 30% are using FPGA prototyping. For emulation, dominant usage is in hardware/chip verification, software development and HW/SW code-design and verification (I would guess the software here would be bare-metal), also system validation, though there is surprisingly significant (and growing) usage in IP development and validation.

In FPGA prototyping, dominant usage is in hardware/chip verification also with a significant component in IP design and verification. This is surprising for me since FPGA prototypes are not generally very good for hardware debug (thanks to lack of extensive internal visibility). However, they are much cheaper than emulators, so perhaps that’s the reason – trading off cost versus verification effort and cleverness. Less surprisingly, system validation, software design and HW/SW co-verification are leading use-models.

In verification languages and methodologies SystemVerilog still dominates at ~75%, Verilog (for verification) is still around but declining fast and the only other significant player is C/C++ at ~25% presumably for software-based verification. (By the way, the survey allows for multiple answers in many of these questions so don’t expect stats to add to 100%.) In testbench methodology UVM dominates at ~70% and everything else is in rapid decline. Equally SVA is massively preferred for assertions. No big surprises here.


The survey wraps up with an ever-interesting survey (anonymous of course) of design schedules – what goes wrong and why. The peak of the distribution in 2016 is at on-schedule completion (funny how that happens) but there’s a long and fat tail out to a 30% overrun, with an average of 69% of projects behind schedule. This seems to be worse than in previous years (61% behind in 2014 for example), not an encouraging direction.

Only 30% of designs were able to get to success on first silicon, ~40% required at least one and ~20% two respins. I have recently come to think of this as a routine need primarily to handle software and analog problems, but I was wrong. Logic/functional problems remain the leading cause (~50%) and power consumption problems grew rapidly as a contender (~30%). Root causes were led by design errors (70%!) and spec problems (incorrect/incomplete at 50%, change in spec at nearly 40%).

Hats off again to Mentor for sponsoring and summarizing the results of these surveys. This is real value for all of us in the industry. You can access the survey HERE.


Robust NVM Solutions for Specialty and Advanced FinFET Technologies Webinar

Robust NVM Solutions for Specialty and Advanced FinFET Technologies Webinar
by Daniel Nenni on 09-25-2017 at 12:00 pm

Webinars are a very effective communications channel in a fast paced industry like semiconductor design. If you sign-up in advance and you can’t make the live version, you will be automatically notified when the replay is available so you can watch it at your leisure. I’m guilty of this for sure, because of my hectic schedule I watch many replays. The next webinar that I will no doubt watch the replay of is from Sidense featuring Betina Hold, Sidense R&D Director . If you are designing mobile, automotive, industrial or consumer IoT devices Non Volatile Memory is in there somewhere so this is your chance to see the latest and greatest NVM technology, absolutely.

REGISTER HERE

Abstract
The rapid progress in new Smart Connected ICs is driving the deployment of new specialty processes and smaller advanced technology nodes. Sidense 1T-NVM memory macros support the stringent requirements for a wide range of Smart Connected devices: operation from low-voltage sources with limited energy budgets, operation in harsh environments and robust, high-reliability operation over extended temperature ranges. Today I will discuss how the latest 1T-NVM developments from Sidense address Smart Connected requirements with designs for specialty processes and 3D bit-cell designs for advanced process nodes.

The Smart Connected universe comprises devices and systems that are networked, usually wirelessly, and have some compute power. These include edge nodes (commonly called smart sensors when they are coupled), hub nodes that aggregate data from edge nodes, and central computation, usually in the Cloud, that performs analytics on the aggregated edge-node data and controls resultant actions. The Smart Connected universe encompasses several markets including mobile computing/communication, automotive, industrial, IoT wearables and medical.

The demands of Smart Connected devices vary. While the importance of each requirement changes depending on the application, some of the more universal demands are: broad process and variant coverage, low-voltage operation, ability to function in harsh environments, highly reliable and robust operation over extended temperatures, and very high security.

Sidense’s split-channel 1T-Fuse bit cell, the heart of all 1T-NVM products, works with all specialty and advanced processes and is optimized for various operational and fabrication requirements. The 1T-NVM macros have been designed to take full advantage of key process features.

Sidense supports a wide range of TSMC BCD and HV processes and is in volume production in many PMIC and sensor designs. We are an acknowledged leader in term of area advantage in these technologies. Sidense 1T-NVM macros meet the stringent AEC-Q100 Grade 1 requirements for high temperature (125°C) operation for all of these processes and Grade 0 (150°C) for selected processes.

Sidense’s 1T-NVM products have been certified to IS0-9001, which defines the requirements of a quality management system to provide products and services that meet customer and applicable statutory and regulatory requirements. Our 1T-NVM macros go through many phases of high-reliability testing and meet AEC-Q100 Grade 1 and, for products targeting automotive and industrial applications, Grade 0 requirements. All 1T-NVM products are designed for over 10 years of operation at 100% read duty cycles. We are also developing our memory macros to meet the trend to elevated temperature operation, 185°C and even higher.

REGISTER HERE

About Sidense Corp.
Sidense Corp. provides very dense, highly reliable, and secure Logic Non-Volatile Memory (LNVM) IP for one-time programmable (OTP) and emulated Multi-time Programmable (eMTP) use in standard-logic CMOS processes. The Company, with over 120 patents granted or pending, licenses OTP memory IP based on its innovative one-transistor 1T-Fuse™ bit cell, which does not require extra masks or process steps to manufacture. Sidense 1T-NVM macros provide a better field-programmable, reliable and cost-effective solution than flash, mask ROM, eFuse and other embedded and off-chip NVM technologies for many code storage, encryption key, analog trimming, and device configuration uses.

Over 150 companies, including many of the top fabless semiconductor manufacturers and IDMs, have adopted Sidense 1T-NVM as their embedded non-volatile memory solution for more than 500 designs. Customers are realizing outstanding savings in solution cost and power consumption along with better security and reliability for applications ranging from mobile and consumer devices to high-temperature, high-reliability automotive and industrial electronics. The IP is offered at and supported by all top-tier semiconductor foundries and selected IDMs. Sidense is headquartered in Ottawa, Canada with sales offices worldwide. For more information, please visit www.sidense.com.

Also read: Making Sensors of the World


Semiconductor and EDA 2017 Update!

Semiconductor and EDA 2017 Update!
by Daniel Nenni on 09-25-2017 at 7:00 am

It really is an exciting time in semiconductors. The benchmarks on the new Apple A11 SoC and the Nvidia GPU are simply amazing. Even though Moore’s Law is slowing, the resulting chips are improving well above and beyond expectations, absolutely.

As I have mentioned before, non-traditional chip companies such as Apple, Amazon, Tesla, Google, and FaceBook are now driving the semiconductor industry in ways most would not have imagined. Mobile has been great but now with AI/AR/VR coming to our smartphones we should see another surge of silicon. Electric and autonomous cars and the need for exponentially more automotive grade silicon is also a significant challenge/opportunity and IoT is bringing in many more non-traditional chip companies. Connectivity is another big driver. Our cars, for example, will generate hundreds of gigabytes of data every day that will need to be transmitted to the cloud for processing. 4G may get us there but 5G will enable so much more.

Non-traditional chip companies continue to dominate SemiWiki traffic and the EDA executives are saying the same in regards to revenue. A big tell is the rapid growth of the emulation and FPGA prototyping systems business. The ability to develop software in parallel with an SOC is now required for leading edge system companies.

In the second quarter of 2017 semiconductor revenue hit a record $97.9B scoring a record 23.7% growth following an already strong 18.1% in Q1 2017. Semiconductor revenues for 2017 are expected to be over $401B with greater than 16% growth rate.


EDA generally lags the semiconductor industry as we can see by 2017 numbers. EDA reporting has also changed. Now that the #3 EDA company is part of Siemens (Mentor) reporting is based on the current EDA duopoly of Synopsys (SNPS) and Cadence (CDNS).


In Q2 2017 SNPS grew revenues 13% ($80.2M) vs Q2 2016 and CDNS grew Q2 by 5.7% ($26M). The comparable growth rates in Q1 were SNPS by 12.4% and CDNS by 6.5%. SNPS and CDNS both beat their mid-point revenue guidance for the quarter by $2.9M and $4M respectively.


Mid-point guidance for Q3 2017 for SNPS is 2.5% ($15.8M growth to $649.5M) and CDNS is 7.6% growth ($33.8M growth to $480.0M).

At the beginning of 2017 SNPS started at $60 per share and is now over $80. CDNS started at $25 and today is well over $38.

BOTTOM LINE: SNPS and CDNS are both pushing products up to the system level catering more to the non-traditional chip companies so moderate growth is expected to continue in 2017 and 2018.

* And thank you to Gerry Byrne, the founder of edalics, the only independent EDA Budget Management advisor to leading semiconductor companies, for the above data.


Walden Rhines on the Automotive Electronics Landscape

Walden Rhines on the Automotive Electronics Landscape
by Roger C. Lanctot on 09-23-2017 at 8:00 am

Mentor President and CEO Walden Rhines gave a comprehensive overview of the automotive electronics landscape at the Mentor Integrated Electrical Solutions Forum (IESF) in Plymouth, Mich., this week. A key focal point of Rhines’ comments was the twin industry disruptors: EVs and AVs.

A Texas Instruments alum, Rhines described the normal electronics industry technology adoption life-cycle as a ramp up, during which a market grows and attracts new players, followed by continued growth toward an ultimate plateau and consolidation. He pointed to the onset of electrification and automation as forces drawing in dozens of new entrants to the automotive industry.

Rhines counts 300 companies around the world developing electrically propelled cars and light trucks and,, separately, 96 companies with announced autonomous drive programs. Supporting the development of these systems is creating substantial demand for increased investments in greater in-vehicle processing capabilities and the need for new vehicle architectures.

These demands are not only extreme for the financial demands and opportunities they are creating but they are also reshaping and being reshaped by new virtual design requirements and thermal management priorities. One might argue that the shift toward the greater integration of vehicle systems is even testing prior philosophical underpinnings of vehicle design while introducing new concerns regarding cybersecurity and privacy.

Rhines’ presentation was a tour de force of automotive electronics developments and set the stage for the in-depth discussions that followed at the event on topics ranging from cybersecurity and infotainment to the twin disruptors previously noted. Following up Rhines’ insightful offering was industry curmudgeon, gadfly, visionary, bad boy and former senior GM, Chrysler, BMW executive and author, Bob Lutz, who described the “Future of Human Transportation.”

A self-described car guy and frequent Tesla Motors critic, Lutz lamented the anticipated demise of car driving by humans. Lutz described what he sees as a future dominated by “sausage-shaped” self-driving pods as governments and insurance companies wrest the steering wheels out of the hands of human drivers.

Lutz says his sausage-pod future driving scenario will erase the value of legacy automotive brands reducing today’s titans of vehicle production to contract manufacturers for the likes of Uber and Lyft or their ilk. He further postulated the end of vehicle ownership as there will be no point, in Lutz’s transportation “end state” vision, of owning your own sausage pod when the pod of your dreams will be available on demand.

Lutz gave no timeframe for his apocalyptic picture of human-less driving but he was careful to emphasize that in his unique view the internal combustion engine is likely to persist. While he allowed that the current enthusiasm for EVs – primarily on the part of governments (and perhaps Tesla owners) – will eventually reduce fossil fuel demand, he said that the reduced demand will drive down fossil fuel prices preserving and extending the delta between the operating costs of EVs vs. cheaper ICE-based vehicles.

Casting his eye to the distant transportation horizon, Lutz sees no breakthrough in energy density or cost reduction capable of giving EVs a serious cost advantage to ICE vehicles regardless of the other advantages in performance and emissions reduction. In the end, though, after car companies and car ownership have fallen by the wayside car enthusiasts like Lutz will be confined to automobile dude ranches, he says. And motorcycles, another Lutz passion, don’t have a chance (or a place on roads dominated by AVs) over the long run, in his estimation. (Hasn’t Lutz heard of autonomous motorcycles – or does he simply see no point in such a concept?)

It’s good to know that an 85-year-old can embrace new technology like automated driving, even if it threatens a favorite pass-time or two. But when it comes to Bob Lutz accepting pure EVs as the dominant mode of human transportation in the future, it looks like the old GM Vice Chairman simply has to draw the line – in spite of the 300 companies around the world chasing the dream. It seems that EVs will remain the burr in Bob Lutz’s saddle to the end. It’s worth noting that Lutz tipped his hat to the still-thriving horse-riding industry, valued north of $10B, before leaving the stage.


This is a Different GLOBALFOUNDRIES!

This is a Different GLOBALFOUNDRIES!
by Daniel Nenni on 09-22-2017 at 7:00 am

Having followed GF since its inception, I agree with CTO Gary Patton, what we are seeing today truly is a different GLOBALFOUNDRIES! Our first GF blog was published on 9/13/2009 and we have done a total of 173 GF related blogs that have collected more than 1.5M views thus far. 72 of those blogs were written by me so I have followed this story closely. It was always my hope that GF would bring serious competition back to the Pure-play foundry business and they have, absolutely.

The GLOBALFOUNDRIES Technical Conference theme this year is Enabling Connected Intelligence which is an umbrella for the current semiconductor market drivers: Mobile, Automotive, and IoT. The key ingredient of course is 5G. Per his keynote, GF CEO Sanjay Ja expects 5G to be as disruptive as the transition from voice to data which of course was the precursor to the internet and world wide web and I agree completely.

In looking at the onslaught of GF press releases at GTC you can see how 5G plays into their strategy:

GLOBALFOUNDRIES Introduces New 12nm FinFET Technology for High-Performance Applications

GLOBALFOUNDRIES Delivers Custom 14nm FinFET Technology for IBM Systems

GLOBALFOUNDRIES Unveils Vision and Roadmap for Next-Generation 5G Applications

GLOBALFOUNDRIES Delivers 8SW RF SOI Technology for Next-Generation Mobile and 5G Applications

GLOBALFOUNDRIES Announces Availability of Embedded MRAM on Leading 22FDX® FD-SOI Platform

GLOBALFOUNDRIES Announces Availability of mmWave and RF/Analog on Leading FDX™ FD-SOI Technology Platform

GLOBALFOUNDRIES and Soitec Enter Into Long-term Supply Agreement on FD-SOI Wafers

Remember, 5g is all about RF and GF has the famed IBM RF group that boasts top market share with 32B RF SOI chips and more than 5B SIGe chips shipped.

The second keynote was from Qualcomm’s EVP Cristiano Amon. I was quite happy to see his name on the agenda because Cristiano is a great speaker and I had always hoped that QCOM would throw their weight behind the GF foundry effort, especially when Sanjay Ja took over as CEO (Sanjay is from QCOM). Unfortunately that has not happened yet. QCOM left long term foundry partner TSMC for Samsung at 14nm and 10nm then went back to TSMC for 7nm and is now using Samsung for 11nm and 8nm.

This is not surprising as QCOM is historically a hard core foundry outsourcing company. I remember them using (4) different foundries for 40nm. It really was infuriating for TSMC to do all of the leading edge process work with Qualcomm only to lose the very profitable 2[SUP]nd[/SUP], 3[SUP]rd[/SUP], and 4[SUP]th[/SUP] source business to UMC, SMIC, and Chartered. But competition is the foundation of semiconductor manufacturing. QCOM is also not a big FD-SOI supporter which is a disappointment, especially when they are talking up automotive and IoT.

The third keynote was Gary Patton which covered the GF CMOS and FD-SOI roadmaps which included slides on Photonics, EUV, and of course Machine Learning. A couple of Gary’s FD-SOI slides caught my eye. 22FDX has a nice ecosystem developing with all of the top names. Currently, 22FDX has 15 confirmed tape-outs happening this year and next. I know several of those first hand so that number is easy to believe. Scott Jones attended the conference as well and spent time with Gary so expect much more detail from him next week.

All-in-all it really was a great conference, the food was excellent, the 500+ crowd included familiar faces amongst the semiconductor elite including Aart de Geus. If you want to stalk Aart get on the Legally Blue FaceBook page. Great music and you get to see Aart unload and set up his own equipment. Rumor has it his next gig is at Google to benefit animal rescue.

The only downside of the day was the EUV talk. GF was not as EUV positive as TSMC so that will be an interesting story to follow next year. After my last trip to Hsinchu I’m very confident TSMC will have 7nm (N7+) EUV out in time for the 2019 Apple products. I also believe current TSMC 7nm customers (just about every top semiconductor company) will move to N7+. It is easier to design to and you get a 1.2x density and a 10% performance or 20% power improvement so hopefully GF will up their EUV game.

I just scratched the surface here so hit me up in the comments section for a more detailed discussion. I have photos of the slides but they are a bit fuzzy. The event was recorded so it should be up on the GF website sometime soon.


Intrinsix Fields Ultra-Low Power Security IP for the IoT Market

Intrinsix Fields Ultra-Low Power Security IP for the IoT Market
by Mitch Heins on 09-21-2017 at 7:00 pm

As the Internet-of-Things (IoT) market continues to grow, the industry is coming to grips with the need to secure their IoT systems across the entire spectrum of IoT devices (edge, gateway, and cloud). One need only look back to the 2016 distributed denial-of-service (DDoS) attacks that caused internet outages for major portions of North America and Europe to realize how vulnerable the internet is to such attacks. Perpetrators, in that case, used tens of millions of addressable IoT devices to bombard Dyn, a DNS provider, with DNS lookup requests. Analysts predict that by the year 2020, there will be over 212 billion sensor-enabled objects available to be connected to the internet. That’s about 28 objects for each person on the planet. While the opportunity for disaster seems obvious, the opportunity to make a lot of money on IoT is even bigger, so the industry needs to urgently address the problem. How can you make your IoT SoC devices secure?

Recently I attended the CDN Live event in Burlington, MA where I had the chance to sit down with Mark Beal (CTO) and Steve Stecyk (Director of Engineering) of Intrinsix, a design services company, to find out how they are helping their clients deal with IoT device security. It was a fascinating conversation as they had just recently released a new drop-in ready IoT security sub-system IP that is NSA Suite-B compliant and they were demoing the system to prospective customers at CDN Live who use Cadence’s Tensilica cores. I’ve captured a few highlights from that conversation as I felt they address some points that all IoT devices engineers may find interesting.

First, the Intrinsix security sub-system is offered as synthesizable RTL IP that is CAD-tool and technology-platform agnostic. Intrinsix was obviously catering to Cadence users at CDN Live, but their IP can be readily ported to any standard CMOS platform and EDA toolset. Its claim-to-fame, other than being super easy to use, is its incredibly low power profile, typically 10X better than what is offered using standard CPU-based security methods. Intrinsix leveraged more than 1000 equivalent-years of design experience to create a specialized hardware and software cryptographic accelerator security sub-system that is responsible for providing a secure boot environment for ARM, RISC-V, and Tensilica-based IoT systems.

When one mentions dedicated security accelerators, it seems counter intuitive that this would make for a lower power system. Why would more hardware mean less power? First, remember that this dedicated hardware has one purpose and because of that, it is optimized for the task given it. That means no wasted cycles when it is doing its job.

Second, the real power savings comes when the IoT device is turned off (which for many IoT edge devices represent about 99% of their lifetime). However, this is a bit of a misnomer. To stay responsive, most IoT systems don’t fully power down. They instead go into a sleep state using the processor to monitor a wake-up pin. The memories of the device, however, remain fully up and running, consuming power. The reason for this is that if you power off the state of the system, you must go through the authentication process again to ensure a secure boot when it’s time to wake back up. This authentication process takes time, typically on the order of multiple seconds if you are using the system CPU to do the work and that cuts down on system responsiveness. By using accelerator technology, Intrinsix cuts this time from seconds down to milliseconds, regaining system responsivity. Being able to turn off 99% of the chip allows Intrinsix to reduce power consumption by up to 1000X and increase battery life by as much as 10X. All the while, the area consumed by the accelerator hardware is negligible, and even with the lower power consumption, they can still provide device security that meets NSA Secret level requirements.

The architecture of the security sub-system is self-contained and provides the secure boot environment for the SoC. This approach means that the sub-system has its own security processor, security ROM, and various engines needed for authentication, encryption/de-encryption, random number generation, and establishing secure tunnels for over-the-air updates (OTA). The system maintains control of the rest of the SoC until it can make sure the device is securely up and running, after which it turns control over to the SoC’s host processors. The security sub-system also contains a monotonic counter that is used to check the validity of updates coming in, ensuring that a nefarious actor cannot take the system back to a previously valid but possibly more susceptible version of the firmware.

In addition to the IP, Intrinsix also provides best practice design services to their clients to ensure their SoC takes full advantage of the security sub-system. One example of this is how they deal with design-for-test (DFT). DFT by its nature is meant to “open up” the system logic for manufacturing test. DFT can cause security problems when the SoC is in the field because the testability ports could be used for unauthorized access to registers that the security system protects. Intrinsix uses a strategy that enables SoC testability while the system is still unprovisioned. When the security sub-system’s one-time-programmable (OTP) memories are loaded with public keys and secure boot firmware, the provisioned system then has logic that detects that the OTPs have been written and disables the DFT ports from further use. Very slick.

There was a lot more to the conversation, and I’ll try to follow up with more information in later articles but suffice it to say, I found it refreshing to see that Intrinsix and the industry are indeed working hard to make IoT SoC designs secure.

If you want to learn more about Intrinsix and their IoT offerings, you can find them online at the link below, download their IoT eBook, or you can visit with them at the upcoming IoT Security Developers Conference being held in Santa Clara, CA on September 28th.

See also:
IoT Security Developers Conference
eBook: IoT Security The 4[SUP]th[/SUP] Element
Intrinsix website


Clock Gating Optimization

Clock Gating Optimization
by Bernard Murphy on 09-21-2017 at 7:00 am

You can save a lot of power in a design by gating clocks. For much of the time in a complex multi-function design, many (often most) of the clocks are toggling registers whose input values aren’t changing. Which means that those toggles are changing nothing functionally yet they are still burning power. Why not turn off those clock toggles at those registers when they’re not needed? That’s the reasoning behind clock gating.


Nice principle, but figuring out how best to apply it to your design in realistic use-cases takes some work. First, modifying the design to add clock gating definitely isn’t practical at layout or even pre-layout gate-level. You’re going to need to add logic and wiring and that’s best done at RTL. But then you worry about accuracy: to know where best to gate, you need to be able to run power estimates. At the layout/gate-level these can be pretty accurate (typically within 5% of silicon). But at RTL there’s more uncertainty so accuracy is more like ±15% of accuracy at layout.

Is this uncertainty too big to make power optimization useful at this level? Not at all but you have to think carefully about your approach and the choices you make. An important point is that, in this kind of analysis, relativeaccuracy is typically much better than absolute accuracy. If estimation shows that gating opportunity X will save twice as much power as gating opportunity Y, you can be pretty sure those two options would rank the same way in final implementation, irrespective of absolute predicted power reduction. And – engineering 101 – you want to focus on bigger savings. The error bars are still big enough you don’t want to waste time on 1% deltas. That said, if you want to delve into tweaking you can improve absolute accuracy in RTL power estimation through correlation with previous similar and implemented designs.

Building on that base you now have two objectives – figuring out where gating has most impact and then figuring out how you should drive that gating. The first takes careful analysis, across the design and across use-case scenarios. Synopsys’ SpyGlass Power has been tuned for many years to help with this task. It starts with a hierarchical spreadsheet view of power, leakage and dynamic, so you can figure out where you want to focus. It’s all neatly color-coded so you can easily spot priority problems then drill down through those to find top offenders and so on down. The tool provides more than 150 metrics so you can slice and dice this however you want.


Some of the metrics called out in the webinar look at efficiency of clock gating. SpyGlass looks at this through several metrics. One, clock gating ratio, is purely structural – how many register clocks (within a block) are actually gated, when you trace back to the root clock for that block? This may be a somewhat crude estimate but it provides a baseline.

Clock gating efficiency is a more refined estimate, requiring activity (simulation) data. Looking at all registers in the block, how many clock toggles occur on those registers versus clock toggles at the root clock? By this metric if a clock on a register toggles a few times versus the root clock, it is efficiently gated. Of course maybe the clock on a particular register has to toggle a lot because data is frequently changing, but this metric still provides a pointer to root cause for dynamic power.

The next two metrics, ROADE™ and ROADF™, are more refined. ROADF considers the number of Q pin toggles versus the number of clock toggles on a register. This is obviously much closer to a measure of ideal efficiency. If Q doesn’t change, in principle the clock didn’t need to toggle. ROADE considers the same measure across all registers sharing a common clock enable, so is a metric by enable signal.

Put these metrics together and you can build a pretty decent sense of where clock gating can have the biggest impact on power. But of course what you are seeing in the dynamic power analysis is metrics for one use-case/scenario; efficiency metrics could change significantly in different use cases.

The next step is how to drive those clock enables, once you have decided which clocks you want to gate. This step was illuminated by a question that came up in the Q&A. Why wouldn’t I just use automatic clock gating where a tool figures out formally or in some other way where best to gate clocks, figures out how to build the enable and maybe even inserts the logic for me? The answer was interesting. There are such tools available and they indeed work but there aren’t getting heavy traction. In practice designers seem to be much more interested in making their own decisions around enabling logic, often factoring in considerations (e.g. boundary use-cases not represented in the scenarios you ran) which simply aren’t visible to a tool.

You can get a lot more detail from the recorded Webinar HERE.


IoT SoCs Demand Good Data Management and Design Collaboration

IoT SoCs Demand Good Data Management and Design Collaboration
by Mitch Heins on 09-20-2017 at 12:00 pm

Design data management has always been important. Board designers have known this for decades as they had to have ways to keep all their discreet components organized and understood. Sourcing components is not easy as it means hours of reading and reviewing specifications, finding reliable sourcing partners and understanding the nuances of what the documentation isn’t telling you.

This was not a big problem for the custom / ASIC designers until the advent of 3[SUP]rd[/SUP] party intellectual property (IP) and system-on-chip (SoC) designs. Up until the early 2000’s most if not all of their design was built and controlled by the design team doing the IC. Since then however, there has been a literal explosion of 3[SUP]rd[/SUP] party IPs made available for IC design, and now with the advent of the Internet-of-Things (IoT), there seems to be a pull for even more.

IoT design, by its very nature implies a combination of multiple disciplines onto a single IoT SoC. SoCs must be power efficient while at the same time able to fuse data from a variety of sensors and sources some of which themselves will be on the same SoC. The fact that so many domains are being combined implies IP coming from multiple different sources. There is no one company that specializes in analog, digital, microelectromechanical (MEMs), chemical, photonics, memory, processors, graphics, neural nets, big data, RF communications etc. etc. IoT truly puts the term “system” into SoC and that means bringing together the best IP for the job at hand. The value-add for SoC design is how the system brings together different IP into something that creates a unique value proposition to the market place.

So, history repeats itself again. We are back to working out all the sourcing issues that the board designers have had over the last 40+ years. Fortunately for the IoT SoC designers, we’ve had some tool suites come along to help them manage this task. ClioSoft’s designHUB comes to mind. ClioSoft is best known for their data management tool SOS7. While SOS7 is a great tool for data management, it is designHUB that is meant to bring context and organization to the designer’s desktop.

The thing that makes tools like designHUB so necessary is the complexity of what IoT and SoC designs really imply. Many IP suppliers and design houses try to reduce complexity and risk by promoting configurable pre-designed platforms complete with processors and software stacks, interface IP, bus and network-on-chip (NoC) communications fabrics, encryption hardware, radio transceivers, and the like. That’s just the design IP. Then there is all the verification IP that goes with each piece along with prototype test boards, compilers, FPGA emulators etc.

And…since this is all going into an IC you also must remember packaging, design-for-test, design-for-manufacturing, and any qualification steps needed once the IC is manufactured. Needless to say, each one of these items is continually going through revisions and changes. That means the platform you used 6 months ago, and now want to use again has had hundreds of changes applied, some of which you want and some which you may not.

Platforms are great and the way to go, but it all implies a tremendous amount of information that must be obtained, consumed, applied, remembered and revised each time you make a revision to your IoT SoC design. So, while it’s like what the board guys have been doing for years, it’s also made more complex given the systems and designs are now orders of magnitude more complex.

ClioSoft’s designHUB is a design collaboration ecosystem where users can create, share and reuse design data and IP more easily. ClioSoft’s vision is that this is all encompassing and includes design IPs (internal and 3[SUP]rd[/SUP]party), verification IP, documents, user experiences, scripts, methodologies, libraries, ideas and even discussions. It’s ability to enable designers to collaborate, share and reuse all types of information is what makes it truly interesting for IoT SoC design. As already mentioned, IoT design is diverse and cuts across multiple engineering domains and it is designHUB’s crowd sourcing and dashboard social media capabilities that make it attractive for enabling engineers of disparate backgrounds to come together on design solutions.

As IoT moves into mission critical applications such as autonomous vehicles, electric grids, traffic control systems and the like, there will be a bigger and bigger demand for requirement traceability and IP tracking both to ensure quality before deployment but also to be able to service these systems once in the field. ClioSoft’s designHUB seems to be well positioned to address the IoT space and would look to be an important part of anyone’s IoT design environment.

About ClioSoft: ClioSoft was launched in 1997 as a self-funded company, with the SOS design collaboration platform as its first product. The objective was to help manage front end flows for SoC designs. The SOS platform was later extended to incorporate analog and mixed-signal design flows wherever Cadence Virtuoso[SUP]®[/SUP] was predominantly used. SOS is currently integrated with tools from Cadence[SUP]®[/SUP], Synopsys[SUP]®[/SUP], Mentor Graphics[SUP]®[/SUP] and Keysight Technologies[SUP]®[/SUP]. ClioSoft also provides an enterprise IP management platform for design companies to easily create, publish and reuse their design IPs.

See Also:
ClioSoft Products

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Open Silicon Delivers Silicon-Verified HBM2 IP-Subsystem on TSMC 16nm FF+

Open Silicon Delivers Silicon-Verified HBM2 IP-Subsystem on TSMC 16nm FF+
by Mitch Heins on 09-20-2017 at 12:00 pm

Open Silicon hosted a webinar today focusing on their High Bandwidth Memory (HBM) IP-subsystem product offering. Their IP-subsystem is based on the HBM2 standard and includes blocks for the memory controller, PHY and high-speed I/Os, all targeted to TSMC 16nm FF+ process. The IP-subsystem supports the full HBM2 standard with two 128-bit wide channels that can deliver up to a 256 GBps bandwidth memory access.

Open Silicon’s IP-subsystem has been verified with TSMC silicon, including the use of TSMC’s 65nm-based CoWoS (chip-on-wafer-on-substrate) interposer and silicon-measured results correlated well with predicted simulations before manufacturing. This bodes well for designers that plan to use the IP as it means that Open Silicon’s simulation and modeling strategy is working well. Open Silicon also characterized their IP over the commercial range with different supply voltages and showed results at the webinar with the IP-subsystem successfully delivering data rates of 1.6Gbps/pin from -10[SUP]0[/SUP]C to +85[SUP]0[/SUP]C over a supply voltage range of 1.14V to 1.26V and 2.0Gbps/pin over the same temperature range with supply voltages between 1.28V and 1.42V.

The HBM2 IP-subsystem is currently offered in two options. The first option is to license the IP-subsystem from Open Silicon, in which case the licensee gets RTL for the memory controller, hard IP for the PHY and high-speed I/Os in the form of GDS, Verilog models for the main subsystem blocks and subsystem documentation.

The second option is to use Open Silicon’s 2.5D HBM2 ASIC SiP (system-in-package) IP, that includes Open Silicon’s help to integrate the IP-subsystem into their customer’s ASIC, and to design and integrate the customer’s ASIC and chosen HBM2 memory into a SiP using the TSMC CoWoS interposer.

Customers also have access to Open Silicon’s validation/evaluation platform to perform early testing of the memory interface against expected system-level memory access patterns. The validation platform uses a FPGA-based reference board with a prefabricated version of the HBM2 IP-subsystem combined with HBM2 memory. The rest of the customer’s ASIC system is synthesized into the on-board FPGA where the logic can be used in conjunction with HBM2 IP-subsystem and HBM memory.

A USB connection is available to connect the evaluation board to a workstation where Open Silicon runs a software suite known as “HEAT”. HEAT stands for Hardware Enabled Algorithm Testing and combines the hardware portions of the evaluation board with design-for-test (DFT) JTAG and BIST logic that can be used to access, control and monitor CSR registers in the HBM controller IP and Test Chip registers. The HEAT software GUI allows designers to build customized generators to drive data traffic to mimic real system usage and to then monitor system bandwidth, latency, and data mismatch results. The software is capable of using fixed, or variable patterns using pseudo random binary sequences (PRBS) as well as standard increment, decrement, walking zero, and walking one addressing patterns.

The current HBM2 IP sub-system supports up to 2Gbps/pin data rates with up to 8 channels (or 16 pseudo channels) delivering up to a total of 256 GBps total bandwidth. It’s compliant to the JEDEC HBM 2.2 specification and supports up to 5mm interposer trace lengths with the above stated performance. It also supports AXI and a native host interface.

Open Silicon also showed a road map of their next development including a port of their HBM2 IP-subsystem to TSMC’s 7nm CMOS process with the intent to have it silicon validated by the middle of 2018. This version will support a multi-port version of the AXI interface with different schemes for arbitration and quality of service (QoS) levels and programmability of different address mapping modes. The 7nm technology will enable greater than 300 GBps of total bandwidth while running data rates of up to 2.4Gbps/pin. This time line matches up with when major HBM memory providers will be delivering products capable of supporting the 2.4Gbps data rates. Additionally, Open Silicon already has eyes on the evolving HBM3 standard and is targeting development of an IP-subsystem to support that with a 7nm TSMC process. They are expecting HBM3 work to begin sometime in 2019.

So, to summarize, Open Silicon presented on their silicon proven HBM2 IP-subsystem based on TSMC 16nm FF+ and showed good modeling and simulation predictability. They also showed some interesting details of their design along with their FPGA-based evaluation and validation board and test methodology. And, they followed up with some real characterization data from their runs with TSMC showing impressive data rates of 1.6Gbps/pin to 2Gbps/pin using 5mm interposer trace length.

All in all, a very impressive set of IP that can be used in a wide variety of markets where high bandwidth memories are key to success. System designers building high-performance computing and networking solutions for data centers, networking, augmented and virtual reality, neural networks, artificial intelligence and cloud computing can all benefit from Open Silicon’s HBM2 IP-subsystem that not only completes their solutions but lowers their risk and shortens their time to market.

Nice job Open Silicon! You can see the replay HERE.

See also: Open Silicon Solutions


Yield Analysis is a Critical Driver for Profitability

Yield Analysis is a Critical Driver for Profitability
by Daniel Nenni on 09-20-2017 at 7:00 am

One of the most important aspects of any manufacturing effort is the yield of the process. Today, the investment in facilities, equipment and materials is so high that consistently high yields are vital to the profitability of the semiconductor manufacturer. Furthermore, the engineers must get to that consistent high yield as quickly as possible to avoid product delays, A yield ramp delay of 3-6 months is extremely costly, and a 6+ month delay could be catastrophic (bad press, lost business, etc.). An example of this (although not necessarily a chip problem) is the delay that Apple is experiencing with the iPhone X. The later than expected introduction will impact holiday sales for them, resulting in a significant revenue hit. In fact, the stock price fluctuated significantly when the ship date was announced earlier this month.

Identifying and eliminating the source of yield loss is one of the most challenging activities a product or fab engineer will face in his/her job. Yield analysis is quite often high-pressure work, requiring long days and quick decisions based on an incomplete understanding of the situation. Solving a yield issue requires complex pattern recognition skills using limited amounts of data. While fab tools and test equipment generate terabytes of data, knowing what to look for in that mountain of data is a difficult task. Typically, one needs to start with a big picture understanding, by identifying what is failing (failure mode of the IC), and how the failure manifests itself in the process (spatial dependencies, lot dependencies, equipment dependencies, etc.).

The engineer must then formulate hypotheses that fit the “what” and “how”. He or she would then look through the data at hand to try and confirm or deny each hypothesis. If there is insufficient data to do this, one may have to gather additional data. Finally, if there is no data on hand that can conclusively prove an hypotheses, then the engineer would typically submit a sample of ICs for failure analysis to help provide greater understanding of the problem. Once the engineering team identifies the source of the problem, they will develop a fix and implement the fix on a set of control material. If the fix is successful, they can roll it out to the entire production line. Yield analysis is sort of like learning to ride a bike – you get better at yield analysis the more you do it. However, there are some important concepts relating to data visualization, data analysis, techniques, and the overall process for yield analysis. Semitracks has an online course that covers these concepts in more detail (they provide the course as an in-house training course as well).

If you are a product engineer that has the responsibility for maintaining the yield of an IC, if you are a fab engineer who must gather the data for yield work and fix fab-related problems, or if you are a foundry interface engineer who needs to understand yield analysis work in order to make an informed decision about what to do with your products, then going through this type of training is a must. Successful yield analysis work can save your organization millions of dollars. The stakes are simply too high to ignore this.