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DVCon Europe is Coming Soon. Sign Up Now

DVCon Europe is Coming Soon. Sign Up Now
by Bernard Murphy on 10-31-2023 at 6:00 am

logo accellera min

I’m a fan of DVCon, a fan of Accellera and a fan of Munich, hosting DVCon Europe once again. This year’s event runs from November 14th through 15th (with some events on the 16th) at the Holiday Inn Munich in the City Center. Phillippe Notton (CEO, SiPearl) will deliver a keynote on “Energy Efficient High-Performance Computing in the Heart of Europe”, and Michaela Blott (Sr. Fellow at AMD Research) will deliver a second keynote on “Pervasive and Sustainable AI with Adaptive Computing”. Add to that a medley of Accellera updates and EDA, semiconductor, and EDA+semiconductor talks on a variety of topics. I’ll briefly summarize Accellera-related topics below, remembering that, as is normal with standards, detail is hard to come by until officially released. Remember to REGISTER.

Functional safety working group update

This working group is chaired by Alessandra Nardi, a well-respected authority in the safety domain. The group aims to standardize methods to capture and propagate safety intent from system (a car for example) down through software, SoC and IP design, ensuring ability to exchange data and to support traceability between multiple levels of total system design. This working group will release a white paper soon which they will discuss in the session.

Workshops on UVM-AMS and CDC/RDC

These are areas I am watching closely. In AMS, Accellera is working on both mixed signal modeling and UVM-AMS; in this event they will elaborate on the latter. This technical workshop will walk the audience through a worked example to illustrate key pieces of this approach and give a preview of how this standard will expand the ecosystem for AMS verification to allow vendors and users to create and share compatible verification components and use them in existing UVM environments. Well worth attending, I think.

The CDC/RDC (reset domain crossing) session starts with an intro to the basics on domain crossings. The second half will be another must-see for anyone working with IP verified against one CDC/RDC tool which must be verified at the system level using a different CDC/RDC tool. A demo will highlight different steps of the CDC verification flow. A small and illustrative RTL test case with at least two EDA verification tools will be used to raise awareness about the importance of a new standard to make CDC models portable and reusable between different tools.

IP-XACT and SystemC

IP-XACT has been around for a while and is well-accepted as a standardized format for IP meta data relevant to integration, but how widely is it used as an integration platform? The IP-XACT discussion comes in two parts, starting with a tutorial on the basics of the standard including aspects relevant to integration and the hardware/software interface. The second part addresses industrial practices from EDA vendors, IP providers, and IP integrators: Agnisys, Arteris, Infineon, and Intel. That I think should be very interesting – I’m always eager to hear more about IP-XACT integration practices in production.

There is also a SystemC evolution day planned to review upcoming standard advances and for experts in the field to network and exchange ideas.

AI panel (because AI)

You can’t have a conference these days without an AI topic. Accellera chair Lu Dai features as a panelist on this panel, titled “All AI All the Time”. They will discuss how AI can best be applied in verification objectives. I’m sure discussion will be fairly free ranging 😊

REGISTER before you forget!


S2C’s FPGA Prototyping Accelerates the Iteration of XiangShan RISC-V Processor

S2C’s FPGA Prototyping Accelerates the Iteration of XiangShan RISC-V Processor
by Daniel Nenni on 10-30-2023 at 10:00 am

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S2C announced that the Beijing Institute of Open Source Chip (BOSC) adopted its Prodigy S7-19P Logic System, a VU19P-based FPGA prototyping solution, in the development of the “XiangShan” RISC-V processor. S7-19P not only accelerates the iterations of processor development but also simplifies other companies to realize XiangShan-based SoCs.

RISC-V, an open instruction set architecture, has increasingly become the focus of global processor development. Among them, “XiangShan” is a high-performance open-source RISC-V processor core and is considered an international leading representative of the RISC-V industry. Since the launch of its first generation, “XiangShan” has received over 2,500 stars and 277 forks on GitHub, making it one of the most followed open-source hardware projects internationally. To date, “XiangShan” has launched two generations, with the third generation under development. Industry-leading companies are adopting “XiangShan” and conducting further development for various applications and expanding the RISC-V ecosystem.

In the adoption of the “XiangShan” project, the key role of the Prodigy S7-19P Logic System is allowing software development and profiling in high-performance FPGA prototyping. This allows the software and hardware engineers of “XiangShan” to work in parallel, significantly shortening the development process. A BOSC representative added, “Due to the diversity of RISC-V, our clients need to survey different RISC-V cores to find the right one matching their applications. S2C’s FPGA prototyping enables us to showcase processor performance through the SPEC benchmark. It is also a must-have tool for I/O verification and BSP driver development. S2C’s solution covers the entire cycle from hardware design to software integration and client test drivers, making it easier for our clients to choose the most suitable solution and proliferation of the ‘XiangShan’ core.”

SPEC Benchmark:
SPEC benchmarking can verify whether the expected performance is achieved. By leveraging S2C’s Prodigy, the “XiangShan” team can conduct the performance evaluation by running Linux with a graphical interface. This provides the team with valuable feedback for more effective optimization.

I/O Verification:
S2C’s Prodigy provides an actual environment for testing and verifying all input/output communication channels in XiangShan. FPGA prototyping is used to ensure seamless integration and communication with other hardware components like memory, storage, and other interfaces. The “XiangShan” team has adopted various S2C’s daughter cards and interfaces, including flash, GMAC, and PCIe, and the overall system operates at 50MHz.

BSP Driver Development:
BSP (Board Support Package) driver development ensures smooth interaction between software and hardware. With FPGA prototyping, developers can develop and test the BSP on actual hardware, ensuring hardware-software co-development. This parallel approach thereby improves development efficiency and accuracy. Once the “XiangShan” hardware design is ported to S7-19P, the BOSC software team immediately embarks on BSP driver development. This method allows the software team to gain a deeper understanding of hardware features and limitations, ensuring optimized hardware design for “XiangShan” before the final tape-out and accelerating software development.

“‘XiangShan’ is a leading high-performance RISC-V processor core,” another BOSC representative stated, “S2C’s FPGA prototyping laid a solid foundation for the XiangShan project. We chose S2C because of their outstanding technology and services. They have injected great momentum into our project.”

Mr. Ying Chen, VP of Sales & Marketing at S2C, also commented, “We are glad that our Prodigy FPGA prototyping solutions accelerate the XiangShan project and meet a wide range of target market needs. In the future, we will work with more partners to expand the RISC-V community for the prosperity of the RISC-V ecosystem.”

About Beijing Institute of Open Source Chip
RISC-V has developed rapidly in recent years and become the focus of international scientific and technological competition. To improve China’s IC design level and build a technology platform connected with the international open source community, Beijing City and the Chinese Academy of Sciences have prioritized development in RISC-V, and organized a number of leading domestic enterprises and top scientific research institutes to establish the BOSC on December 6, 2021. The institute gathers the consensus of industrial development with open source and acceptance, stimulates application traction potential through collaborative innovation, and strives to promote integrating the RISC-V innovation chain and industrial chain, as well as accelerate industrialization in scientific and technological innovation achievements, and the creation of the world’s leading industrial ecosystem of RISC-V.

About S2C
S2C is a leading global supplier of FPGA prototyping solutions for today’s innovative SoC and ASIC designs, now with the second largest share of the global prototyping market. S2C has been successfully delivering rapid SoC prototyping solutions since 2003. With over 600 customers, including 6 of the world’s top 10 semiconductor companies, our world-class engineering team and customer-centric sales team are experts at addressing our customer’s SoC and ASIC verification needs. S2C has offices and sales representatives in the US, Europe, mainland China, Hong Kong, Korea, and Japan. For more information, please visit: www.s2cinc.com and more details about vu440, vu13p, vu19p board, vu9p FPGA, etc.

Also Read:

ViShare’s Rapid Market Entry with FPGA-Based Prototyping Solution from S2C

Systematic RISC-V architecture analysis and optimization

Sirius Wireless Partners with S2C on Wi-Fi6/BT RF IP Verification System for Finer Chip Design


Developing Effective Mixed Signal Models. Innovation in Verification

Developing Effective Mixed Signal Models. Innovation in Verification
by Bernard Murphy on 10-30-2023 at 6:00 am

Innovation New

Mixed-signal modeling is becoming more important as interaction between digital and analog circuitry become more closely intertwined. This level of modeling depends critically on sufficiently accurate yet fast behavioral models for analog components. Paul Cunningham (Senior VP/GM, Verification at Cadence), Raúl Camposano (Silicon Catalyst, entrepreneur, former Synopsys CTO and now Silvaco CTO) and I continue our series on research ideas. As always, feedback welcome.

The Innovation

This month’s pick is Fast Validation of Mixed-Signal SoCs. The paper was presented in the 2021 Journal of the Solid-State Circuits Society. The authors are from Stanford, Seoul National University and Scientific Analog.

A recent SemiWiki blog on mixed signal captured enormous interest, suggesting this is an area worth further study. A critical step to realize effective mixed signal verification is to develop accurate mixed-level behavioral models for analog functions which are suitable for event-driven simulation, and even synthesizable models for deployment in hardware emulation. The paper describes a template-based approach to generating models and two methods to interpolate analog behavior to event-based connections: oversampling and event-driven modeling with feature vectors (real number models).

The authors demonstrate application to a high-speed link simulation and emulation with impressive results. Comparison between Spice and Verilog simulation on the ADC shows close correspondence in results, running orders of magnitude faster. Emulation-based modeling adds yet more orders of magnitude to that speed.

Paul’s view

Big context-swap this month into the world of analog verification and its “mixed-signal” intersection with digital verification. This paper is an invited paper in a prestigious journal which beautifully summarizes state-of-the-art to build abstracted models of analog circuits that can keep up with digital simulation, even on an emulator, and do so with amazingly good accuracy.

In the analog world everything is smooth and usually oscillating, with intended input-output behavior often described by first transforming input/output waveforms into the frequency domain. The gold standard for analog simulation is Spice, iteratively solving device-level differential equations for voltages at all points in a circuit within guaranteed error tolerances. Compared to digital simulation, Spice is thousands of times slower.

The typical approach to creating fast abstract analog models is to do discrete time sampling of the input waveform and then generate the appropriate discrete time sampled output waveform using some DSP-like logic (e.g. discrete-time filters). Signal values between these discrete time points can be generated if needed using linear or spline-based interpolation.

The authors present a complete open-source framework with an elegant model generation language and compiler to generate both simulatable and emulatable models from this language. They use an adaptive time-step sampling method with spline-based interpolation and work through a credible case study using their framework on a 16nm high speed SERDES link PHY. Going from Spice to digital CPU-based simulation with their abstracted models achieves a 13,000x speed-up. Putting the models on an FPGA gave another 300x speed-up. Nice.

Raúl’s view

The validation of mixed-signal SoCs is a challenge, among other things because running sufficient test vectors to validate the digital parts – typically with an event driven simulator or on an emulator – results in prohibitive times to simulate the analog part with a circuit simulator. A solution is the creation of analog behavioral models. This month’s paper reviews several approaches to create these models and presents what the authors believe to be the first complete, open-source framework for AMS emulation. This is an invited paper to the IEEE open journal of the Solid-State Circuits Society, and as such large passages read like a tutorial on analog design and validation. It is quite different to what we have done before in this blog; the reader needs some analog know-how to be able to fully benefit (e.g., Laplace domain, z-transform, PLL, phase interpolator, Nyquist rates, jitter, etc.).

Functional models of analog circuits receive inputs and generate outputs at discrete times. Waveforms can be modelled using piecewise constant or piecewise linear functions, using spline points (the approach used in this paper) or sums of complex exponential functions. Time is modelled as discrete-time (sampled or oversampled) or as piecewise linear modeling (used here). The actual models of circuits are assembled from a library of templates. The authors put all this together in a system consisting of: 1) A Python tool for generating synthesizable AMS models providing a set of functions that allows users to describe AMS blocks as differential equations, netlists, transfer functions, or switched systems, … in either fixed or floating point, and 2) A simulator-like abstraction of FPGA boards.. which provides emulation infrastructure that manages the emulation timestep, emulation clock speed, and test interfaces and generates the FPGA emulation bitstream with the help of EDA tools.

The trick is not using circuit simulation but rather replacing circuit models by functional models. For a high-speed link receiver called DragonPHY the speedup of a Verilog versus a Spice simulation is 12,800x, providing sufficient accuracy. But even this speedup is not enough to simulate the clock recovery and channel equalization loops, to test bit error rates (BER), with feedback loops which may take 100,000s of cycles to settle. Modifying the models so they are synthesizable and can be incorporated into emulation provides further 5000x speedup, sufficient to compute BER within 7.5%. Impressive!

Also Read:

Assertion Synthesis Through LLM. Innovation in Verification

Cadence Tensilica Spins Next Upgrade to LX Architecture

Inference Efficiency in Performance, Power, Area, Scalability


KLAC- OK quarter in ugly environment- Big China $ – Little Process $ – Legacy good

KLAC- OK quarter in ugly environment- Big China $ – Little Process $ – Legacy good
by Robert Maire on 10-29-2023 at 10:00 am

KLAC Tencor
  • KLA has an OK quarter in an ugly market- bouncing along bottom
  • Like Lam & ASML, China was huge at 43% represents more risk
  • 2/3 Foundry/logic, 1/3 memory – Process tools were weak
  • No change, stable , no visibility on recovery
Quarter and guide were good in continued ugly industry

As expected KLAC reported earnings at the high end coming in at $2.4B in revenues and $5.41 in EPS. Guidance was also positive at $2.45B+-$125M and EPS of $5.86+-$0.60.

Given that KLA usually runs with a significant multi quarter backlog they should always be able to “dial in” their quarterly numbers to hit the target they want.

While we are down from last year we still have a slow upward cadence despite the industry “bouncing along the bottom”

At 43% of revenues, China becomes a bigger risk & savior at same time

Lam saw China at 48% of business and ASML saw China at 46%, KLA cam in third with China at 43% of business. Not as bad as Lam but at elevated levels that raise our concern about exposure risk to China. We remain surprised that China hasn’t been more negatively impacted.

It also remains clear that China is obviously buying anything that isn’t nailed down and perhaps things that are nailed down.

While most of the China exposure may be for legacy nodes we still think this represents a risk although less of a risk than leading edge which has already been cut back.

Like Lam, without China’s money, business would have been very ugly which is not very heartening.

Process tools suffering

It comes as no surprise that the process tool side of KLA is weaker than process control, the historical wheelhouse of the company. We expect that this portion of business will likely lag in any sort of recovery when it does eventually happen.

The $3.4B acquisition of Orbotech 5 years ago has not exactly been a “barn burner” for KLA.

No talk or idea about timing of a recovery

As we heard with both ASML & Lam there is essentially no clue as to when there will be a recovery in the industry. Things will likely be lumpy and bumpy along the bottom with some sectors being stronger or weaker on a quarter by quarter basis with no clear trend that we can define out of the numbers.

Delays in major projects continue to be one of the biggest drags on business. Its clear that TSMC, Intel, Samsung, Micron and others are delaying new construction and major new projects. We haven’t heard much about any change in that momentum or lack thereof.

We remain concern about reticle inspection

As we mentioned in our recent report from the SPIE photomask show, there has been no news about a new leading edge actinic reticle inspection tool coming from KLA. The balance between KLA’s wafer inspection and reticle inspection used to be a bit more even handed.

As KLA has lost dominance in reticle inspection, wafer inspection is almost twice the revenue of reticle inspection. We don’t see this correcting or rebalancing back to more even levels any time soon.

It remains one of the few key weak points in an otherwise dominant story.

The Stock

We were not blown away by the results and the industry still sucks. Risks with China are higher than ever.

There have not been any significant new technology nodes announced by KLA and customers , with the exception of China, are spending very slowly at sustenance levels.

KLA also continues to live off of a very long backlog built while times were good that are helping it get through the winter but we are concerned about how long that backlog lasts.

Overall our view remains not very positive…..its better than it could have been but far from compelling…..

We are not motivated to take a new position and would continue to lighten up if there was an uptick as we see no new reason to own the shares on the horizon.

KLA remains one of the best run companies, with great financial results but the industry still sucks….its just that simple. You can be the greatest in the world but if industry conditions are weak, its hard to outperform in a meaningful way.

We think investors are figuring out this is going to be a longer, colder winter in the semiconductor industry than we have seen in a long while…..

Also Read:

LRCX- QTR OK but outlook mixed- At half of revs, China is huge risk- Memory poor

ASML- Longer Deeper Downcycle finally hits lithography – Flat 2024 – Weak Memory – Bottom?

ASML- Absolutely Solid Monopoly in Lithography- Ignoring hysteria & stupidity


Podcast EP190: The Growth and Impact of RISC-V and a Peek at the Upcoming RISC-V Summit with Calista Redmond

Podcast EP190: The Growth and Impact of RISC-V and a Peek at the Upcoming RISC-V Summit with Calista Redmond
by Daniel Nenni on 10-27-2023 at 10:00 am

Dan is joined by Calista Redmond, CEO of RISC-V International. Prior to RISC-V International, Calista held a variety of roles at IBM, including vice president of IBM Z Ecosystem where she led strategic relationships across software vendors, system integrators, business partners, developer communities, and broader engagement across the industry.

Calista outlines the growth RISC-V has experienced over the past few years. She discusses benefits such as design and business flexibility that this global open standard has delivered. Calista reviews the markets that are moving to RISC-V, both today and going forward. She also discusses future development at RISC-V International in areas such as training, development on-ramps, compatibility, and certification.

Calista also provides a preview of the upcoming RISC-V Summit, to be held Nov.7 – 8 in Santa Clara, CA. She touches on product introductions and other announcements, keynotes, and in-depth demonstrations among other topics.

The views, thoughts, and opinions expressed in these podcasts belong solely to the speaker, and not to the speaker’s employer, organization, committee or any other group or individual.


CEO Interview: Venkata Simhadri of MosChip

CEO Interview: Venkata Simhadri of MosChip
by Daniel Nenni on 10-27-2023 at 6:00 am

Venkata Simhadri

Mr. Venkata Sudhakar Simhadri is a serial entrepreneur with a proven track-record in the semiconductor industry. He was the Founder, President & CEO of Gigacom Semiconductor LLC & Founder / Director of Gigacom India (Both the Companies acquired by MosChip) and the driving force behind establishing IP licensing and design services business with leading semiconductor companies.

Earlier to Gigacom, Venkata was the Founder, President & CEO of Time-to-Market (TTM) from 1998 till its acquisition by Cyient in 2008 and was the head of its Hi-tech Business Unit till 2012. Venkata has 30+ years of experience, primarily working in the USA and India region.

Mr. Venkata is currently the MD & CEO of MosChip Technologies Limited, Chairman of IESA Semicondutor Manufacturing CIG (Core Interest Group),Vice-Chairman of the IESA Hyderabad Chapter, the brains behind the IESA AI Summit started in 2021, and was the General Chair for the recent blockbuster, VLSI Design & Embedded Systems Conference 2023.

Tell us about your company?
MosChip Technologies is a publicly traded (BSE | 532407↗) semiconductor and Embedded system design services company headquartered in Hyderabad, India, with 1300+ engineers located in Silicon Valley-USA, Hyderabad, Bengaluru, Ahmedabad and Pune. MosChip provides turn-key digital and mixed-signal ASICs, design services, SerDes IP, and embedded system design solutions. Over the past 2 decades, MosChip has developed and shipped millions of connectivity ICs. For more information, visit moschip.com

What problems are you solving?
MosChip is a semiconductor design and solutions company that offers a wide range of products, services, and IP (Intellectual Property) portfolio to cater to various industries. The problems that MosChip is solving across industries include:

Semiconductor Design Challenges: Semiconductor industry has been growing rapidly for the last few decades with the demand in emerging markets like automotive, AI, IOT and etc. As a result, there has been a huge scarcity for experienced chip design engineers. MosChip has been focused on training and creating chip design talent and providing design services to the top semiconductor companies in the world.

Embedded System Development: MosChip has twenty plus years of track record in Embedded product design and has built many products ( both hardware/ software ) for defense, communications, IOT applications. MosChip has been helping customers to build proto-types, validation and releasing the products to markets.

IP Portfolio: Their IP portfolio includes pre-designed and verified intellectual property blocks, which can save time and resources for companies looking to integrate proven technology into their products. This can be especially useful for speeding up product development cycles.

Industry-Specific ASIC Platforms/Solutions: MosChip has been investing in RISC-V based platforms for IOT, Industrial and Automotive applications that includes both Analog/ Mixed-signal and digital building blocks. Leveraging the platform, MosChip can provide quick turn-around for building custom silicon ( turn-key ASICs ) for customers looking for optimizing their products.

In summary, MosChip addresses a wide range of challenges across industries by offering semiconductor design services, a diverse IP portfolio, Embedded system design services. These services aim to help companies innovate, improve product quality, reduce development time &cost, and stay competitive in their respective markets.

What application areas are your strongest?
Our strongest application areas include Consumer Electronics, Networking, Industrial Automation, automotive electronics, smart cities, Government, and healthcare. In these domains, MosChip has a proven track record of delivering customized semiconductor and embedded solutions that enhance performance, reliability, and efficiency.

What does the competitive landscape look like and what are your collaborations across various sectors?
The competitive landscape in our industry is spread across the world and some of the Indian IT service companies offering similar design services. However, our collaborations with the leading fabs ( MosChip is TSMC’s DCA partner ), EDA Companies like Cadence, Synopsys and Siemens and IP companies give us competitive edge. Most importantly, MosChip’s dedicated focus and Semiconductor industry and the 20+ years of track-record gives us the competitive edge.

What new features/technology are you working on?
We have been investing on technologies such as Artificial Intelligence (AI) and Machine Learning (ML) to enhance our semiconductor solutions. Additionally, we are expanding our capabilities in edge computing and edge applications to provide clients with more comprehensive and efficient solutions.

MosChip is also working on VIDYUT, which is a cutting-edge, fully-integrated polyphase Energy Meter IC designed specifically for Energy Meter OEMs. The platform we are building for this IC using RISC-V has the potential address many different applications.

How do customers normally engage with your company?
As mentioned, MosChip is one publicly-traded companies on Bombay Stock Exchange (BSE) in the Semiconductor companies of India which gives us a basic exposure to the customers. Apart from this, Customers discover us through our personal business network and via our digital presence (on LinkedIn | Twitter | Instagram | Facebook | YouTube | Koo | website). MosChip is also an active member of multiple orgnizations like IESA and My self being the Chairman of the Semiconductor Manufacturing Core Interest Group (CIG) of IESA gives us a great visibility. We are also been the active participants in the Semicon India Conferences and other events relevant to Embedded Systems, AI/ML, etc.

Also Read:

CEO Interview: Islam Nashaat of Master Micro

CEO Interview: Sanjeev Kumar – Co-Founder & Mentor of Logic Fruit Technologies

CEO Interview: Stephen Rothrock of ATREG


Keynote Speakers Announced for IDEAS 2023 Digital Forum

Keynote Speakers Announced for IDEAS 2023 Digital Forum
by Daniel Nenni on 10-26-2023 at 10:00 am

ideas 400X400

As we all know, hearing directly from the people who actually use EDA tools, people who are solving real world problems with the latest technologies are the best source of information. Thus EDA User group meetings are always first on my event list every year which brings us to Ansys Ideas.

Ansys User Group Meeting Features Technical Presentations from World’s Leading Semiconductor, Electronic, and Photonic Companies

Join Ansys on November 30, 2023 for the IDEAS 2023 Digital Forum. With almost 30 technical presentations, keynote speakers, and panel discussions from some of the world’s leading electronic and semiconductor design companies, IDEAS is one of the foremost technical showcases for the latest trends in semiconductors, electronics, and photonics.

IDEAS is Ansys’ annual user group meeting for our semiconductors, electronics, and photonics customers and partners. This free, virtual event  brings together more than 1,000 professional attendees from around the world and serves as a global platform to explore limitless possibilities in the field of electronics industry. This digital conference provides case studies for artificial intelligence/machine learning (AI/ML), high-performance computing (HPC), telecommunications, low-power design, signoff voltage/timing analysis, and electromagnetic modeling.

All presentations are delivered by industrial production engineers actively working on some of the world’s leading electronic design projects. Participants can delve into these insightful sessions and visualize intricate concepts, gaining a deep understanding of latest advancements in electronics and semiconductor industry. By joining the day of, you will have a unique opportunity to interact directly with presenters who will be available to answer questions from the audience.

In addition to Ansys customers, IDEAS also hosts contributions from our electronics design partners, including major EDA design tool suppliers. Ansys is committed to supporting open and extensible design platforms that enable designers to create customized solutions using the best technology from across the industry.

IDEAS 2022 featured technical speakers were: Nvidia, Qualcomm, AMD, Intel, Samsung, Meta, MediaTek, NXP, and more.

IDEAS 2023 will kick off with three executive keynote presentations.

Prith Banerjee, chief technology officer of Ansys, will give his perspective on the major trends and developments in electronic design today. Lalitha Immaneni, vice president of architecture, design, and technology solutions at Intel, will present her executive keynote of the latest semiconductor and packaging technologies from Intel. Murat Becer, vice president  of engineering for semiconductor products at Ansys, will deliver a technology keynote announcing the latest technology breakthroughs by Ansys.

Following the keynote speakers are multiple technical tracks with topics including:

  • Power integrity analysis and signoff.
  • 3DIC and thermal analysis.
  • AI/ML for multiphysics convergence.
  • Early RTL power analysis, electromagnetic simulation, and modeling.
  • Photonic design.

The final agenda will be available on the registration page in the coming weeks. Register now to reserve your seat and add IDEAS 2023 to your calendar.

Also Read:

Ansys Revving up for Automotive and 3D-IC Multiphysics Signoff at DAC 2023

Keynote Sneak Peek: Ansys CEO Ajei Gopal at Samsung SAFE Forum 2023

Chiplet Q&A with John Lee of Ansys


LRCX- QTR OK but outlook mixed- At half of revs, China is huge risk- Memory poor

LRCX- QTR OK but outlook mixed- At half of revs, China is huge risk- Memory poor
by Robert Maire on 10-26-2023 at 8:00 am

China Memory Shortage
  • LRCX has OK QTR but “challenging outlook” – Memory still sucks
  • China at 48% is a huge risk given potential of more sanctions
  • Leading & trailing logic both poor- no recovery in sight yet
  • Memory spending at historical lows for NAND
Quarter came in OK but outlook seems weak and unclear

Revenues came in at $3.48B (of which $1.43B was service so equipment sales hit a low of $2B) with EPS of $6.85. We are still way down from the year ago revenue of $5.07B and seem to be bouncing along the bottom of business.

WFE spend for the year is estimated at roughly $80B.

Guidance is for $3.7B +- $300M and EPS of $7.00 +- $0.75, in line with expectations.

Lam is very reliant on China at 48% of revenues & would/could be toast without it

At roughly half of Lam’s business, up from 30% of business, China is a huge risk in our view. With unclear new sanctions and continued poor relations with China having half your semiconductor business there is just not a tolerable risk.

Without China, Lam would be in sad shape….its the only sector working for them right now.

We think this clearly warrants a discount on the value of the company as right now they appear to have the highest exposure in the semiconductor space to China.

It doesn’t sound like December is going to be much different and this is not a one quarter aberration.

R&D spending headwind in 2024?

Management also issued a somewhat veiled warning that R&D spend will be strong in 2024 and could negatively impact financials. This seems an odd warning as R&D typically has been increasing across the industry so we wonder if there is some unusual spend anticipated or if R&D as a percentage will be up due to weaker revenues?

No talk or idea about timing of a recovery

As we have pointed out in prior notes there are no real signs of any sort of a recovery on the horizon. Management did not offer timing or speculation about a recovery and the lack of commentary itself may add to the uncertainty on the part of investors.

Memory is clearly in the deepest hole and will be the slowest to recover but we also have no idea about logic/foundry.

The company stayed away from any prognostication about 2024 other than spending more on R&D……..

Fab utilizations at record lows

Management commented that fab utilization is at historical lows which not only slows/stops new equipment and new fabs but also slows spending on service/spares & upgrades of existing installed tools.

We can confirm we have been hearing that across the board, fab utilization is very low and certainly a major concern of semiconductor producers that is keeping them fearful and up at night. This is obviously the key reason they have slowed their orders to a relative trickle.

Given the torrid spending pace of China which outstrips the rest of the planet we can’t help but reiterate our concern that additional capacity coming out of China from all these tool purchases could extend the downcycle even further as China will undercut everyone else as they have in every other industry and will be able to throw gasoline on the existing bonfire of capacity and low utilization…..which in turn will inhibit further spend in onshoring to the US much as we see with slowing fab construction in the US.

In essence, selling all these tools to China will stunt growth in the US and elsewhere.

The Stock

As expected, LRCX stock was off 5% in the aftermarket given what was a less than positive conference call and outlook.

Our view is that the overexposure to China is something that we would want to avoid as an investor as the risk to that business is both unknown and highly variable.

Lam could see half its business evaporate overnight if something bad happened with China. While we certainly do not expect that to occur, the risk profile is way too high to overlook or not apply a significant discount to the company’s valuation.

Its bad enough we have no idea about a general industry recovery but to add an unusually high China risk on top is a bit much.

We had indicated that collateral impact after the ASML call this morning would likely be negative and we think we heard that on the Lam call tonight. We likely expect similar uncertainty from KLAC and AMAT as they report later on in earnings season. We would imagine they will also have exposure to China and uncertainty about a recovery as well.

It could also be that investors may be getting tired of hearing from some analysts that a recovery is just around the corner or coming in the next half or trying to put a positive spin on an unending downcycle.

The bottom line is we need a broader macro recovery for semiconductors to start acting better and eventually trickle down to equipment sales. Until that happens we won’t see a true recovery. AI won’t do it. High bandwidth memory won’t do it. The CHIPS Act won’t do it. New technology won’t do it. Its a lot of hand waving and ignoring the fundamental underlying issue of the macro economy and over spending in the past.

We think we are changing our long term view that Lam was the “poster child” for the memory industry into being the “poster child” for the Chinese semiconductor industry.

We would imagine that Lam has likely increased spending on lobbyists in Washington to prevent further China sanctions and perhaps on Mandarin lessons as well……..

Also Read:

ASML- Longer Deeper Downcycle finally hits lithography – Flat 2024 – Weak Memory – Bottom?

ASML- Absolutely Solid Monopoly in Lithography- Ignoring hysteria & stupidity

SPIE- EUV & Photomask conference- Anticipating high NA- Mask Size Matters- China


A New Ultra-Stable Resistivity Monitor for Ultra-Pure Water

A New Ultra-Stable Resistivity Monitor for Ultra-Pure Water
by Bernard Murphy on 10-26-2023 at 6:00 am

Resistivity sensor

I am straying from my normal range of topics here, but confess I am developing an interest in semiconductor metrology since it takes me back to my physics and math roots. Even better I get to learn about the state of the art in ultra-pure water for semiconductor applications, an area where resistivity monitors play a role since resistivity is how purity is estimated these days.

The role of ultra-pure water, and challenges

Ultra-pure water is used throughout semiconductor design for cleaning, rinsing, conditioning and particularly in CMP which requires high volumes for slurry production and rinsing. Unsurprisingly the water must be incredibly pure because even small impurities at current process scales can completely kill yield. Also not a surprise, flow rates have been increasing driven by wafer sizes.

You can’t buy water at this purity (that would be impossibly expensive). It’s all created in-house in fabs, through a complex and expensive series of steps to progressively remove impurities, through filtration, reverse osmosis, de-gasification, UV irradiation, ion exchange, more filtration, more UV irradiation, more ion exchange, etc, etc.

These steps aim to filter out to the greatest extent possible: particles, bacteria, organic carbons, silica, and anything else which isn’t water. Further, setting up or making a change to such a system can incur months of delay due to need to flush the system thanks to outgassing, particle shedding from equipment and pipes, bacteria/biofilm removal and so on.

But perfect purity isn’t possible, just like a perfect vacuum isn’t possible. The goal is to stay within upper limits on impurities, subject to one or more guidelines. One very important way to determine inline that water falls within these guidelines is through resistivity measurements.

Resistivity as a measure of purity

Resistivity is the standard way to check for ionic impurities, measured in MΩ/cm. Seawater (lots of salts) comes in at 20-30 Ω/cm, tap water around 1-5 kΩ/cm and distilled water at 500 kΩ/cm. The expectation for semiconductor grade ultra-pure water is 18.18 MΩ/cm. I have seen slightly different values for absolutely pure water around 18.24 MΩ/cm, an obviously theoretical value since the real thing is not attainable.

In other words, semiconductor grade ultra-pure water is very close to theoretically pure, but real-life metrology requires very high accuracy in measurements.

The Mettler Toledo (MT) UPW UniCond sensor

This sensor is pictured above. MT quote a fab customer calibrating this sensor to 18.2 MΩ/cm once installed, thoroughly rinsed and stabilized. At first, I thought this was just marketing rounding generosity on 18.18 MΩ/cm, but they also show a graph of standard deviation (𝛔) in measurements versus other production sensors. They claim an order of magnitude better 𝛔 at notably 0.0003 MΩ/cm. Even marketing can’t fudge 18.18 to 18.20 with that 𝛔.

Note this performance reflects not only on accuracy but also on stability. MT attribute this performance to significantly better temperature compensation, signal stability, and environmental isolation than have been previously available. They report that the customer that ran these tests has now mandated this sensor for all new fabs and fab upgrades, the ultimate endorsement.

You can learn more about the MT UPW UnicCond sensor HERE.


Ensuring 3D IC Semiconductor Reliability: Challenges and Solutions for Successful Integration

Ensuring 3D IC Semiconductor Reliability: Challenges and Solutions for Successful Integration
by Kalar Rajendiran on 10-25-2023 at 10:00 am

3D IC Cross Section Illustration

One of the most promising advancements in the semiconductor field is the development of 3D Integrated Circuits (3D ICs). 3D ICs enable companies to partition semiconductor designs and seamlessly integrate silicon Intellectual Property (IP) at the most suitable process nodes and processes. This strategic partitioning yields an array of benefits, including reduced latency, high-bandwidth data transfer, lower manufacturing costs, increased wafer yields, minimized power consumption, and ultimately, lower overall costs. While not yet mainstream, the growing standardization of chiplets and the development of supporting tools are paving the way for the practical and profitable implementation of 3D ICs for both large and small players. These appealing benefits have driven significant growth and development in advanced heterogeneous packaging and 3D IC technology. However, this progress has also introduced challenges related to manufacturability and reliability and must be addressed for 3D ICs to become a mainstream reality.

Siemens EDA has published an eBook that addresses these challenges and offers up solutions to help deliver 3D IC semiconductor reliability. Anyone involved in the development of 3D ICs will find the eBook very informative. The following is an overview of the salient points from the book.

Challenges in Ensuring 3D IC Semiconductor Reliability

3D ICs have brought with them a host of challenges, spanning the selection of tools and methodologies, parasitic extraction, and the task of heterogeneous integration.

Sign-off strategies of 2D ICs heavily rely on design rule kits provided by foundries, typically designed for single-process System-on-Chip (SoC) designs. However, this conventional approach falls short in the realm of 3D IC advanced heterogeneous packaging, where multiple layers with varying processes are involved. Traditional LVS relies on recognizing electrical connections between pins, a feature that passive components lack by definition. To address this, a method is required to comprehend the impact of passive components and consider their interconnection role alongside active devices. This is critical as accurate post-assembly netlisting and simulation results hinge on detailed wire placements and material information. Unlike System-on-Chips (SoCs) that are coplanar, 3D ICs incorporate stacking with components at different vertical depths, rendering them non-coplanar. This non-coplanar nature introduces intricate challenges for semiconductor and IC packaging designers, particularly regarding the assessment of interactions between components with different process technologies and iterative evaluations. The issue also involves determining which interactions are essential to verify to avoid wasting resources on unnecessary checks, further complicating the design and manufacturing process of 3D ICs.

Solutions for 3D IC Semiconductor Reliability

Overcoming these challenges necessitates a blend of innovative strategies, tools, and methodologies.

Accurate Modeling: The initial step in addressing the challenges of 3D ICs is the creation of highly accurate models. Components like Through-Silicon Vias (TSVs) require precise modeling to account for their parasitic elements.

Parasitic Extraction: Accurate parasitic extraction is vital for understanding the effects of these new components on signal integrity, power efficiency, and overall performance. Utilizing advanced extraction tools enables engineers to capture intricate parasitic elements introduced by components like TSVs and micro bumps.

Data Representation: For organic-based (PCB-oriented) 3D ICs, intelligent data representation is paramount. This entails including information such as net names, via details, and structural elements natively in the design database, streamlining the setup time for parasitic extractions and reducing the likelihood of errors.

Early Planning and Floorplanning: The utilization of planning tools is critical to facilitate the integration of diverse components and the creation of a reliable floorplan. This planning step is indispensable for comprehending the interactions between different layers and components within a 3D IC.

Summary

The challenges in ensuring the reliability of 3D ICs are considerable. However, by embracing innovative tools, methodologies, and intelligent data representation, it’s feasible to overcome these hurdles. With accurate modeling, precise parasitic extraction, and innovative design strategies, engineers can unlock the full potential of 3D IC technology while adhering to the highest standards of reliability. As the semiconductor industry evolves, 3D ICs are set to play a pivotal role in shaping the future of electronic devices, promising more powerful, energy-efficient, and compact solutions for consumers.

You can download the “Ensuring 3D IC Semiconductor Reliability: Challenges and Solutions for Successful Integration” eBook here.

Also Read:

The Path to Chiplet Architecture

Placement and Clocks for HPC

AI for the design of Custom, Analog Mixed-Signal ICs