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Crypto modernization timeline starting to take shape

Crypto modernization timeline starting to take shape
by Don Dingee on 06-15-2023 at 10:00 am

CNSA Suite 2.0 crypto modernization timeline

Post-quantum cryptography (PQC) might be a lower priority for many organizations, with the specter of quantum-based cracking seemingly far off. Government agencies are fully sensitized to the cracking risks and the investments needed to mitigate them and are busy laying 10-year plans for migration to quantum-safe encryption. Why such a bold step, given that experts still can’t say precisely when quantum threats will appear? PQShield has released its first installment of an e-book on PQC and crypto modernization subtitled “Where is your Cryptography?” outlining the timeline taking shape and making the case that private sector companies have more exposure than they may realize and should get moving now.

Ten crypto years is not that much time

Folks who survived the Y2K scramble may recall thinking it was far away and probably not as big a problem as all the hype projected. In retrospect, it ended up being a non-event with almost no catastrophic failures – but only because organizations took it seriously, audited their platforms, vendors, and development efforts, and proactively made fixes ahead of the deadline.

PQC has some of the same vibes, with two exceptions. There is no firm calendar date for when problems will start if not mitigated. Many of today’s platforms have crypto technology deeply embedded, and there are no fixes for quantum threats to public-key algorithms short of PQC redesign. It’s fair to say that if an organization doesn’t explicitly understand where platforms have PQC embedded, all platforms without it must be considered vulnerable. It’s also fair to say that the potential for lasting damage is high if a problem starts before a plan is in place.

That makes the NSA advisory on the Commercial National Security Algorithm Suite 2.0 (CNSA Suite 2.0) noteworthy. Released in September 2022, it identifies a crypto modernization timeline for six classes of systems with a target of having all systems PQC-enabled by 2033.

 

 

 

 

 

 

 

 

Those earlier milestones for some system classes in the timeline starting in 2025, combined with requiring new full-custom application development to incorporate PQC, shorten the ten-year horizon. PQShield puts it this way in their e-book:

“The message for [public and private sector] organizations is both clear and urgent: the time to start preparing for migration to PQC is now, and that preparation involves assessing and prioritizing an inventory of systems that use cryptography, and are candidates for migration.”

Where to start with crypto modernization

Many veterans who guided organizations through Y2K have retired – but left behind a playbook that teams can use today for crypto modernization. Initial steps involve a risk assessment looking at internally-developed and vendor-supplied systems. Mitigation strategies will vary, with some considerations including how sensitive the data a system handles is, how long that data possibly lives, and if the system is public-facing.

 

 

 

 

 

 

 

 

 

PQShield makes two vital points here. First, it may not be possible, especially for vendor-supplied systems, to make an immediate replacement. Enterprise-class system replacements need careful piloting not to disrupt operations. The good news is for most commercial application and system vendors, PQC will not be a surprise requirement.

The second point is that hybrid solutions may overlap with both PQC and pre-quantum legacy crypto running, with a containment strategy for the legacy systems. This overlap may be the case for infrastructure, where the investment will be enterprise-wide, and the priority may be protecting public-facing platforms with PQC first.

Moving to an industry-specific discussion for PQC

After discussing infrastructure concerns in detail, PQShield devotes about half of this e-book installment to industry-specific considerations for PQC. They outline ten industries – healthcare, pharmaceuticals, financial services, regulatory technology, manufacturing, defense, retail, telecommunications, logistics, and media – highlighting areas needing specific attention. The breadth of the areas discussed shows how many systems we take for granted today use cryptography and will fall vulnerable soon.

Crypto modernization is a complex topic, made more so by the prevalence of crypto features in many vendor-supplied systems organizations don’t directly control. Awareness of timelines in place, along with places to look for vulnerabilities, is a meaningful discussion.

To download a copy of the e-book, please visit the PQShield website:

Cryptography Modernization Part 1: Where is your Cryptography?


S2C Accelerates Development Timeline of Bluetooth LE Audio SoC

S2C Accelerates Development Timeline of Bluetooth LE Audio SoC
by Daniel Nenni on 06-15-2023 at 6:00 am

actt

S2C has been shipping FPGA prototyping platforms for SoC verification for almost two decades, and many of its customers are developing SoCs and silicon IP for Bluetooth applications.  Prototyping Bluetooth designs before silicon has yielded improved design efficiencies through more comprehensive system validation, and by enabling hardware/software co-design prior to silicon availability.  When Bluetooth IP and SoC prototypes can be connected directly to real system hardware, running at hardware speeds, running real software prior to silicon, the resulting design efficiencies enable reduced development times, and higher quality products.

Bluetooth Low Energy (“BLE”) is a wireless communication technology that is used in a wide variety of applications including smart home devices, fitness trackers, and medical devices such as Neuralink’s Brain-Computer Interface – applications that require low-power operation, and short-range wireless connectivity between devices (up to 10 meters).  The Bluetooth protocol was originally introduced by the Bluetooth Special Interest Group (“Bluetooth SIG”) in 1998, followed by Bluetooth Low Energy (BLE) in 2009, and most recently the Bluetooth Low Energy Audio (“BLE Audio”) specification was released in 2022.  BLE Audio focuses on higher power efficiency than the classic version of Bluetooth, provides for higher audio quality than standard Bluetooth, and introduces new features – and was the largest specification development project in the history of the Bluetooth SIG.

One provider company of silicon IP and SoC design services that chose S2C’s FPGA-based prototyping solutions for their SoC verification and system validation platform was Analog Circuit Technology Inc. (“ACTT”).  ACTT was founded in 2011 and specializes in the development of low power physical IP and full SoC design services.  ACCT’s portfolio includes ultra-low power analog/mixed-signal IP, high reliability eNVM, wireless RF IP, and wired interface IP.  ACTT’s IP is widely used in 5G, Internet of Things (“IoT”), smart home, automotive, smart power, wearables, medical electronics, and industrial applications.

For one of its BLE projects, ACTT planned for a design verification and system validation platform that would take on several significant challenges;

  1. A System-level Verification platform for a BLE Audio SoC that would enable comprehensive validation of the entire system’s functionality, and would also support industry regulation compliance testing.
  2. A Hardware/Software Co-Design platform that would provide the software development team with a platform for early software development and hardware/software co-design.
  3. A Stability Testing platform – and as it turned out, several issues were surfaced by the verification platform that required highly-targeted debugging to ensure product stability and performance standards compliance.

Working together with ACCT on their BLE Audio project, ACCT selected S2C’s VU440 Prodigy Logic System prototyping hardware platform, prototyping software, and debugging tools for a comprehensive FPGA prototyping platform.  As part of their complete prototyping solutions, S2C offers a wide range of versatile daughter cards (“Prototype-Ready IP”), such as I/O expansion boards, peripheral interface boards, RF interface boards, and interconnect cables.  S2C’s Prototype-Ready IP supports prototyping interfaces for JTAG, SPI FLASH, UART, I2S, SD/MMC, and RF, with speeds of up to 60MHz.  S2C’s off-the-shelf Prototype-Ready IP enables faster time-to-prototyping, and reliable plug-and-play interconnection to S2C prototyping platforms.

ACTT’s Deputy General Manager, Mr. Yang, offered an enthusiastic retrospective of ACTT’s use of S2C’s FPGA-based prototyping platform: “During the development of our BLE Audio SoC, we effectively used S2C’s Prodigy Logic System for hardware verification and concurrent hardware/software development.  This innovative approach enabled us to complete the software SDK development well ahead of the chip product’s tape-out phase, resulting in a remarkable timesaving of approximately 2 to 3 months in our overall product development timeline.”

Through committed collaboration with customer-partners, such as ACTT, S2C has a reputation for stimulating independent innovative thinking about SoC verification, and enhancing its customers’ competitiveness in their respective markets. By working closely with its customer-partners, S2C fosters a thriving collaborative working environment that encourages the timely exchange of ideas, resources, and SoC development expertise. With a shared vision of success, S2C and its customer-partners strive to achieve successful SoC development outcomes like ACCT’s, that delivers compelling value to our customer-partners.

About S2C:

S2C is a leading global supplier of FPGA prototyping solutions for today’s innovative SoC and ASIC designs, now with the second largest share of the global prototyping market. S2C has been successfully delivering rapid SoC prototyping solutions since 2003. With over 600 customers, including 6 of the world’s top 15 semiconductor companies, our world-class engineering team and customer-centric sales team are experts at addressing our customer’s SoC and ASIC verification needs. S2C has offices and sales representatives in the US, Europe, mainland China, Hong Kong, Korea and Japan. For more information, please visit: www.s2cinc.com

Also Read:

S2C Helps Client to Achieve High-Performance Secure GPU Chip Verification

Ask Not How FPGA Prototyping Differs From Emulation – Ask How FPGA Prototyping and Emulation Can Benefit You

A faster prototyping device-under-test connection


Semico Research Quantifies the Business Impact of Deep Data Analytics, Concludes It Accelerates SoC TTM by Six Months

Semico Research Quantifies the Business Impact of Deep Data Analytics, Concludes It Accelerates SoC TTM by Six Months
by Kalar Rajendiran on 06-14-2023 at 10:00 am

Design Costs Comparison

The semiconductor industry has been responding to increasing device complexity and performance requirements in multiple ways. To create smaller and more densely packed components, the industry is continually advancing manufacturing technology. This includes the use of new materials and processes, such as extreme ultraviolet lithography (EUV) and 3D stacking. To meet performance requirements, the industry is developing new chip architectures that enable more efficient data processing and power consumption. This includes open-domain-specific-architectures (ODSA) incorporating specialized processors and artificial intelligence (AI) accelerators. To reduce costs and improve performance, the industry is integrating more components onto a single chip, resulting in System on Chip (SoC) designs or opting for multi-die systems using chiplets-based implementations. There is also increasing levels of collaboration within the ecosystem including the equipment suppliers, foundries, package and assembly houses.

At the same time, time-to-market (TTM) is taking on more and more importance for product companies. In today’s fast evolving markets, the market window for a product may be just two years. A company cannot afford to be late to any market, let alone these kind of fast moving markets. Thus, each company utilizes its own tested and proven ways of deriving TTM advantages to get to market first. Of late, deep data analytics is being leveraged by many companies to accelerate their SoC product development efforts. By leveraging deep data analytics, design issues can be caught early in the development process, reducing the need for expensive and time-consuming re-spins. It can also identify potential performance bottlenecks and optimization opportunities. In essence, deep data analytics can not only reduce TTM but also help improve product performance, increase power efficiency and enhance reliability of a product. The product company gets to enjoy bigger market share at significantly improved return on investment (ROI) and longer term customer satisfaction.

proteanTecs is a leading provider of deep data analytics for advanced electronics monitoring. Its solution utilizes on-chip monitors and machine learning techniques to deliver actionable insights during development through production and in-field deployment. The company hosted a webinar recently where Rich Wawrzyniak, Principal Analyst for ASIC and SoC at Semico Research, presented a head-to-head comparison of two companies designing a similar multicore SoC on a 5nm technology node. One of the two companies in this comparison leveraged proteanTecs technology in its product development and gained a six-month TTM advantage over the other.

The webinar is based on a Semico Research white paper, which we covered in the article, “How Deep Data Analytics Accelerates SoC Product Development.”

Here are some excerpts from the webinar.

The Cost Edge

Below is a design costs comparison table for two competing solutions for the same application based on current industry design and production costs. Company A’s solution leveraged proteanTecs analytics-based design methodology and Company B’s solution used standard methodology. The solution is a data center accelerator SoC product, details of which are shared by Rich in the webinar. Company A’s cost savings amounted to about 9% over Company B.

The Time-to-Market (TTM) Benefit

Using proteanTecs approach for deep data analytics, Company A met their market window with on-time entry, allowing it to capture the majority of the target market. The company gained a 6-month TTM advantage over Company B. It also recovered its design investment even as their market was still growing, allowing for increased revenues and profitability.

In-Field Advantage

As highlighted in the Figure below, proteanTecs analytics solution not only helps during design, bring up and manufacturing phases but also after a product has been deployed in the field. This helped Company A monitor for and correct potential problems in the field under real world operating conditions. This kind of analytics insights could be used for preventive maintenance and fine tuning for power consumption and product performance in the field. Marc Hutner, Senior Director of Product Marketing at proteanTecs, presented this information during the webinar.

Cloud-Based Platform Demo

To conclude the webinar, Alex Burlak, Vice President, Test & Analytics at proteanTecs, showed a demo of the proteanTecs cloud-based analytics platform. He highlighted the platform’s capabilities and revealed the different types of insights users receive from proteanTecs’ on-chip monitors, also called Agents.

Summary

Anyone involved with semiconductor product development will find the information presented in the webinar very useful. You can watch the webinar on-demand here.

Also Read:

Maintaining Vehicles of the Future Using Deep Data Analytics

Webinar: The Data Revolution of Semiconductor Production

The Era of Chiplets and Heterogeneous Integration: Challenges and Emerging Solutions to Support 2.5D and 3D Advanced Packaging


TSMC Doubles Down on Semiconductor Packaging!

TSMC Doubles Down on Semiconductor Packaging!
by Daniel Nenni on 06-14-2023 at 6:00 am

TSMC 3DFabric Integration

Last week TSMC announced the opening of an advanced backend fab for the expansion of the TSMC 3DFabric System Integration Technology. It’s a significant announcement as the chip packaging arms race with Intel and Samsung is heating up.

Fab 6 is TSMC’s first all-in-one advanced packaging and testing fab which is part of the increasing investment in packaging TSMC is making. The fab is ready for mass production of the TSMC SoIC packing technology. Remember, when TSMC says mass production they are talking about Apple iPhone sized mass production, not engineering samples or internal products.

Today packaging is an important part of a semiconductor foundry offering. Not only is it a chip level product differentiator, it will take foundry customer loyalty to a whole new level. This will be critical as the chiplet revolution takes hold making it much easier for customers to be foundry independent. Chiplet packaging however is very complex and will be foundry specific which is why TSMC, Intel, and Samsung are spending so much CAPEX to secure their place in the packaging business.

The TSMC 3DFabric is a comprehensive family of 3D Silicon Stacking and Advanced Packaging Technologies:

  • TSMC 3DFabric consists of a variety of advanced 3D Silicon Stacking and advanced packaging technologies to support a wide range of next-generation products:
    • On the 3D Si stacking portion, TSMC is adding a micro bump-based SoIC-P in the TSMC-SoIC®family to support more cost-sensitive applications.
    • The 2.5D CoWoS®platform enables the integration of advanced logic and high bandwidth memory for HPC applications, such as AI, machine learning, and data centers. InFO PoP and InFO-3D support mobile applications and InFO-2.5D supports HPC chiplet integration.
    • SoIC stacked chips can be integrated in InFO or CoWoS packages for ultimate system integration.
  • CoWoS Family
    • Aimed primarily for HPC applications that need to integrate advanced logic and HBM.
    • TSMC has supported more than 140CoWoS products from more than 25
    • All CoWoS solutions are growing in interposer size so they can integrate more advanced silicon chips and HBM stacks to meet higher performance requirements.
    • TSMC is developing a CoWoS solution with up to 6Xreticle-size (~5,000mm2) RDL interposer, capable of accommodating 12 stacks of HBM memory.
  • InFO Technology
    • For mobile applications, InFO PoP has been in volume production for high-end mobile since 2016 and can house larger and thicker SoC chips in smaller package form factor.
    • For HPC applications, the substrateless InFO_M supports up to 500 square mm chiplet integration for form factor-sensitive applications.
  • 3D Silicon stacking technologies
    • SoIC-P is based on 18-25μm pitch μbump stacking and is targeted for more cost-sensitive applications, like mobile, IoT, client, etc.
    • SoIC-X is based on bumpless stacking and is aimed primarily at HPC applications. Its chip-on-wafer stacking schemes feature 4.5 to 9μm bond pitch and has been in volume production on TSMC’s N7 technology for HPC applications.
    • SoIC stacked chips can be further integrated into CoWoS, InFo, or conventional flip chip packaging for customers’ final products.

“Chiplet stacking is a key technology for improving chip performance and cost-effectiveness. In response to the strong market demand for 3D IC, TSMC has completed early deployment of advanced packaging and silicon stacking technology production capacity, and offers technology leadership through the 3DFabricTM platform,” said Dr. Jun He Vice President, Operations / Advanced Packaging Technology & Service, and Quality & Reliability. “With the production capacity that meets our customers’ needs, we will unleash innovation together and become an important partner that customers trust in the long term.”

TSMC’s customer centric culture will be a big part of the chiplet packaging revolution. By working with hundreds of customers you can bet TSMC will have the most comprehensive IC packaging solutions available for fabless and systems companies around the world, absolutely.

TSMC Press Release:
TSMC Announces the Opening of Advanced Backend Fab 6, Marking a Milestone in the Expansion of 3DFabric™ System Integration Technology

Also Read:

TSMC Clarified CAPEX and Revenue for 2023!

TSMC 2023 North America Technology Symposium Overview Part 1

TSMC 2023 North America Technology Symposium Overview Part 2

TSMC 2023 North America Technology Symposium Overview Part 3

TSMC 2023 North America Technology Symposium Overview Part 4

TSMC 2023 North America Technology Symposium Overview Part 5


The Opportunity Costs of using foundry I/O vs. high-performance custom I/O Libraries

The Opportunity Costs of using foundry I/O vs. high-performance custom I/O Libraries
by Stephen Fairbanks on 06-13-2023 at 10:00 am

signal 2023 06 07 192908

The original vision for Certus Semiconductor in 2008 was to leverage production I/O Libraries from more significant partners, starting with Freescale, and take it to smaller external customers for licensing.  This IP was proven and validated, with an excellent silicon track record and big company support; in our minds, we thought, “What small company wouldn’t want to use it!”  A year later, we had not sold a single I/O Library license.

Instead, every customer looked at the offerings and said, “This is not much different from the foundry IP, which is free, and despite a few minor advantages, we see no benefit in licensing it.”  This could have been the end of our story and the original business model. Still, our customers were very good at pointing us toward our future business model with this final statement, “Now, if the IO had this feature or higher performance, then we would license it.”

Our vision of an IP company shifted, and we fine-tuned our core business, designing custom best-in-class, high-performance I/O libraries that meet or exceed our customer’s market needs. Custom design services and support were added to the mix, and over time our standard IP offerings grew to a significant library of leading IP.

Today we are firmly both an IP licensing company and a custom design services company. Still, the most popular I/O Libraries grow from our custom portfolio, offering features, benefits, and capabilities our customers want that do not exist anywhere else in the semiconductor industry.

When asked, “How do you compete against free IP?” about the foundry or freely available third-party I/O libraries, I respond, “Opportunity Cost.”

In economic theory, opportunity cost is the value of what you lose when choosing between two or more options. Ideally, when you decide, you feel your choice will have better results for you regardless of what you lose by not choosing the alternative.

Engineers are very good at understanding opportunity costs regarding  I/O tradeoffs when it is quantifiable.  They can quickly determine the specific benefits of a custom I/O when they consider it has lower power, freeing up their power budgets for other blocks; or smaller footprints where they can compare the cost of saved silicon area versus the licensing fees. Such metrics allow simple calculations to guide the decision to use free I/O libraries or purchase a custom I/O license.

Conversations with sales, marketing leads, and product architects are where the hidden, and many times more significant, opportunity cost discussions surrounding I/O libraries happen.  They understand the subjective benefits of a custom I/O library better than the design engineers.   For example, adding an additional I/O protocol to a bank of I/O may open a new market or industry for the product.  If by licensing a custom I/O library, you can double or triple your available market space, is that not worth it?  By choosing a free I/O library, what does the loss of that potential market cost you?

Discussing with a Marketing lead what we can do with an I/O design is always fun.  As soon as you start to mention new features or electrical interfaces that can easily be added to a set of I/O’s, you can begin to see them get excited about potential new markets, potential new customers, and new business opportunities!

One of my favorite questions is, “If you had a wish list for this product’s I/O capability, what would it include?”  There have been many situations where a program director or marketing lead begins mentioning a feature they wanted because they saw a market opportunity but didn’t think it possible.  As soon as we offer to add it in, the excitement is real!  Some of the best custom designs we have done in the past were built off of a wish list of features given to us by the customer, many times with features they didn’t think possible but also features we wouldn’t have considered adding without their input.

Personal favorites of such collaborative designs are our 12V-30V interfaces in standard 40nm and 28nm low voltage CMOS processes, with no special masks, used for MEM’s and RF products.  Additional fun examples are precision tristate-able PWM GPIOs and a specialty die-to-die low-power high-speed interface for MCMs.

Very few areas of chip design can enable new markets, and unique design socket wins, then I/O features.  I/O design flexibility and options directly impact the variety of systems and market a part can be sold into.  By allowing our team to collaborate with our customers’ marketing leads, we have been lucky to design many fascinating libraries for the industries.

At a conference in 2017, I gave a presentation titled “Fear not to Customize.”   In that presentation, I explored several examples of how I/O custom features enabled our customers to leverage new opportunities, grow their markets, and expand their design wins.  The principles of that presentation are still valid today.  The last statement is one of my favorites, “Fear not to customize, instead let your competitors fear it.”

I still stand by that belief, telling my customers always to be bold and open to discussing with us or requesting custom I/O features.  In many cases, we have already implemented that feature in a different node—the only fear they should have ar the opportunity costs of not customizing.   Product architects and marketing must dream big and consider any design requests that enable new markets and opportunities and expand product impacts on the industry, even if those features seem implausible.  We never know what unique products will come from such collaborations and dreams.

Certus Semiconductor will be present at DAC 2023, so you’ll have an opportunity to learn more about the opportunity costs of using foundry I/O versus high-performance I/O libraries.  More importantly, you’ll have the chance to brainstorm with us new ideas about how a unique I/O design could reimagine your product and your market.

Also Read:

CEO Interview: Stephen Fairbanks of Certus Semiconductor

Certus Semiconductor releases ESD library in GlobalFoundries 12nm Finfet process

Certus Semiconductor becomes member of Global Semiconductor Alliance (GSA)


An Automated Method to Ensure Designs Are Failure-Proof in the Field

An Automated Method to Ensure Designs Are Failure-Proof in the Field
by Rob vanBlommestein on 06-13-2023 at 6:00 am

fusa white paper semiwiki

I don’t know about you, but when I think of mission-critical applications, I immediately think of space exploration or military operations. But in today’s world, mission-critical applications are all around us. Think about the cloud and how data is managed, analyzed, and shared to execute any number of tasks that have safety and security implications. Or in home IoT-based applications where security systems or smoke alarms should reliably operate and send alerts when something goes awry. What about your self-driving car? One failure could cause serious damage or fatality. If you look, you’ll find that mission-critical applications exist in every aspect of our lives from travel to medical to energy to manufacturing to connectivity.

SoCs are at the heart of these mission-critical applications so how do we ensure that these SoCs don’t fail in the field? How do we make sure that these designs are resilient against random hardware failures? Systematic failures are often detected and fixed during IC development and verification, but random failures in the field are unexpected and can be difficult to plan against leading to serious implications. Devices need to not only be reliable, and function properly as expected, but also resilient against random failures that can occur. Devices need to be able to either recover from these events or mitigate them.

Devices in the field also need to be built to last. Aging effects can be factored into the reliability of the design during the development phase using models, DFM, test, and simulation. However, random failures must be accounted for during the design phase. Designing in safety mechanisms or safety measures (SMs) is key to ensure mission-critical designs are not affected by random failures such as single event upsets (SEUs) during the lifespan of the device.

Adding SMs, which are generally in the form of redundancy, into a design to protect against SEUs is not a new concept – it has been around for decades. However, this effort has largely been manual. Manually inserting SMs is painstaking and error prone as physical placement constraints and routing considerations need to be accounted for to ensure that these SMs don’t have any adverse cascading effects on elements such as reset, power, or clock network signals.

Synopsys synthesis and implementation tools provide a fully automated approach to inserting the SMs to make mission-critical design much more resilient. Synthesis can automatically insert the elements while the place and route (P&R) tools will take care of the physical implementation challenges such as placement distance and routing independence of signal nets. We have drafted a white paper to describe the process of adding these SMs and analyzing and verifying that they meet requirements from RTL to GDSII. Download the white paper “An Automated Method for Adding Resiliency to Mission-Critical SoC Designs” to learn more.

An Automated Method for Adding Resiliency to Mission-Critical SoC Designs

Adding safety measures to system-on-chip (SoC) designs in the form of radiation-hardened elements or redundancy is essential in making mission-critical applications in the Aerospace and Defense (A&D), cloud, automotive, robotics, medical, and Internet-of-Things (IoT) industries more resilient against random hardware failures that occur. Designing for reliable and resilient functionality does impact semiconductor development where these safety measures have generally been inserted manually by SoC designers. Manual approaches can often lead to errors that cannot be accounted for. Synopsys has created a fully automated implementation flow to insert various types of safety mechanisms, which can result in more reliable and resilient mission-critical SoC designs.

This paper discusses the process of implementing the safety mechanisms/measures (SM) in the design to make them more resilient and analyze their effectiveness from design inception to the final product.

Also Read:

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WEBINAR: Revolutionizing Chip Design with 2.5D/3D-IC Design Technology

WEBINAR: Revolutionizing Chip Design with 2.5D/3D-IC Design Technology
by Daniel Nenni on 06-12-2023 at 10:00 am

Figure 1 (2)

In the 3D-IC (Three-dimensional integrated circuit) chip design method, chiplets or wafers are stacked vertically on top of each other and are connected using Through Silicon Vias (TSVs) or hybrid bonding.

The 2.5D-IC design method places multiple chiplets alongside each other on a silicon interposer. Microbumps and interconnect wires establish connections between dies whereas TSVs are used to make connections with the package substrate.

Figure 1: 2.5D IC design block diagram
Why do we need 3D-ICs?

Emerging technologies like Artificial Intelligence, machine learning, and high-speed computing require highly functional, high-speed, and compact ICs. 3D-IC design technology offers ultra-high performance and reduced power consumption, making it suitable for multi-core CPUs, GPUs, high-speed routers, smartphones, and AI/ML applications. As the high-tech industry evolves, the need for smaller size and more functionality grows. The heterogeneous integration capability of 3D-IC design provides more functional density in a smaller area. The vertical architecture of 3D-ICs also reduces the interconnect length, allowing faster data exchange between dies. Overall, this advanced packaging technology is a much-needed IC design method to meet the growing demand for speed, more functionality, and less power consumption.

Benefits of 3D-ICs

One key advantage of 3D-ICs is heterogeneous integration. It allows the integration of chiplets in different technology nodes in the same space. Digital logic, analog circuits, memory, and sensors can be placed within a single package. This enables the creation of highly customized and efficient solutions tailored to specific application requirements.

Higher integration density is another benefit of 3D-IC design. By vertically stacking multiple layers of interconnected chiplets or wafers, the available chip area is utilized more efficiently. This increased integration density allows for the inclusion of more functionality within a smaller footprint, which is particularly beneficial in applications where size and weight constraints are critical, such as mobile devices and IoT devices.

3D-ICs also exhibit higher electrical performance. The reduced interconnect length in vertically stacked chips leads to shorter signal paths and lower resistance, resulting in improved signal integrity and reduced signal delay. This translates to higher data transfer rates, lower power consumption, and enhanced overall system performance.

With the latest configuration methods like TSMC’s CoWoS (Chip On Wafer on Substrate) and WoW (Wafer on Wafer), which utilize hybrid bonding techniques, the interconnect length is further minimized, leading to reduced power losses and improved performance.

3D-IC technology provides a range of exceptional advantages, including heterogeneous integration, higher integration density, smaller size, higher electrical performance, reduced cost, and faster time-to-market. These advantages make 3D-ICs a compelling solution for advanced chip designs in various industries.

Challenges of 3D-IC Design

Although 2.5D/3D-IC design methods have numerous advantages, these new methodologies have also introduced new challenges related to physics. The structural, thermal, Power, and Signal integrity of the entire 3D-IC system is more complicated. 3DIC designers are at the beginning of the learning curve to master the integrity challenges during the physical implementation of the system. Accurate simulation methods are a must for any chip designer especially when dealing with 3D-IC. Each component in the 3D-IC system should be examined and validated using highly accurate simulation tools.

Learn more about the latest developments in 3D-IC design, challenges, and simulation, and the key to a successful 3D-IC design by registering for the replay: Design and Analysis of Multi-Die & 3D-IC Systems by Ansys experts. He will also discuss the advanced simulation methods to predict the possible structural, thermal, Power, and Signal integrity issues in 3D-IC.

Also Read:

Chiplet Q&A with John Lee of Ansys

Multiphysics Analysis from Chip to System

Checklist to Ensure Silicon Interposers Don’t Kill Your Design


VLSI Symposium – Intel PowerVia Technology

VLSI Symposium – Intel PowerVia Technology
by Scotten Jones on 06-12-2023 at 6:00 am

Slide4

At the 2023 VLSI Symposium on Technology and Circuits, Intel presented two papers on their PowerVia technology. We received a pre-conference briefing on the technology embargoed until the conference began and received the papers.

Traditionally all interconnects have taken place on the front side of devices with signal and power interconnects sharing the same set of interconnect layers. There is a fundamental trade off between signal routing where small cross sectional area routing lines are required for scaling and large cross sectional area routing lines are needed for low resistance/power drop power delivery. Moving power delivery to the backside of a wafer, Backside Power Delivery Network (BS-PDN) enables optimized signal routing layers on the frontside and optimized power delivery layers on the backside with big/thick power interconnects, see figure 1.

Figure 1. Frontside Versus Backside Power Delivery

As logic technology has advanced the number of interconnect layers required has been steadily growing, see figure 2.

Figure 2. Intel Interconnect Layers

Please note that for recent nodes interconnect layers may vary by a few layers depending on the device.

Connections from the outside world to a device are made through the top interconnect layers and that means for power to get down to the devices, power must go through the entire interconnect stack via chain, see figure 3.

Figure 3. Power Routing Challenges

The example in figure 3 from TSMC’s 3nm technology shows a via chain resistance of 560 ohms versus imec reports of a backside nano-via of ~50 ohms. One of the key advantages of BS-PDN becomes clear.

Another advantage that Intel is talking about is cost. BS-PDN relaxes the requirements for metal zero lowering cost for the most expensive interconnect layer at the expense of relatively large pitch backside metal layers.

There are multiple approaches to BS-PDN. Imec is advocating for Buried Power Rails (BPR) as a connection point for BS-PDN. In figure 4. Intel shows a density advantage to Power Via versus BPR.

Figure 4. Buried Power Rail Versus Power Via

I have two comments about, first of all, my sense is the industry is reluctant to implement BPR because it requires metal buried in the wafer before transistor formation. In my discussions with imec they admit this reluctance but believe BPR will eventually be needed. I should also mention that imec believes BPR can also connect into the side of the device without going up to metal 0 and achieve the same or better density as Power Via, this is an area of contention between the technologies.

In order to minimize risk instead of running their first PowerVia tests on Intel’s 20A process that also introduces RibbonFET (Horizontal Nanosheets), Intel has run Power Via on the i4 FinFET process Intel is currently ramping up in production.

Figure 5. summarize the results seen with PowerVia on i4. Power Via has demonstrated improved Power, Performance, and Area (PPA).

Figure 5. Power Via integrated into i4

Figure 6. illustrates the area improvement and figure 7. Illustrates the power and performance advantages.

Figure 6. Power Via Scaling

From figure 6 it can be seen that power via reduces the call height while also relaxing metal 0 from 30nm pitch to 36nm pitch. The relaxation in pitch likely results in a single patterned EIV layers versus multipatterned EUV.

Figure 7. IR Droop and Fmax

In figure 7 it can bee seen that IR Droop is reduced by 30% and Fmax is increased by 6%.

Finally, in figure 8 we can see that i4 = PowerVia yield is tracking i4 yield offset by 2 quarters.

Figure 8. i4 + Power Via Yield

With PowerVia due to be introduced in 2024 on Intels 20A process in the first half and 18A in the second half, it appears that PowerVia should have minimal impact on yield.

It is interesting to note that Intel is planning to introduce PowerVia in 2024. Samsung and TSMC have both announced BS-PDN for their second generation 2nm nodes due in 2026, giving Intel a 2 year lead in this important technology. My belief is two fold, one Intel is continuing to make progress on the timely introduction of new technologies, and, two, Intel likely prioritized BS-PDN because they are more focused on pure performance that the foundries.

Here is the official Intel press release:

https://www.intel.com/content/www/us/en/newsroom/news/powervia-intel-achieves-chipmaking-breakthrough.html

Also Read:

IEDM 2022 – Ann Kelleher of Intel – Plenary Talk

Intel Foundry Services Forms Alliance to Enable National Security, Government Applications

Intel and TSMC do not Slow 3nm Expansion

How TSMC Contributed to the Death of 450mm and Upset Intel in the Process


Podcast EP167: What is Dirty Data and How yieldHUB Helps Fix It With Carl Moore

Podcast EP167: What is Dirty Data and How yieldHUB Helps Fix It With Carl Moore
by Daniel Nenni on 06-09-2023 at 10:00 am

Dan is joined by Carl Moore, a Yield Management Specialist at yieldHUB. Carl is a semiconductor and yield management expert with more than 35 years of experience in the industry. Carl has held technical management positions across product and test engineering, assembly, manufacturing, and design.

Carl explains what “dirty data” is from a semiconductor test and yield management perspective. He  explains the sources of dirty data, the negative impact it can have on an organization and its customers and how yieldHUB partners with its customers to analyze and fix dirty data at the source.

The views, thoughts, and opinions expressed in these podcasts belong solely to the speaker, and not to the speaker’s employer, organization, committee or any other group or individual.


CEO Interview: Dr. Sean Wei of Easy-Logic

CEO Interview: Dr. Sean Wei of Easy-Logic
by Daniel Nenni on 06-09-2023 at 6:00 am

Photo Sean Wei 006

Dr. Wei has served as CEO & CTO of Easy-Logic since 2020.  Prior to this role, Dr. Wei served as CTO since 2014 where he constructed the core algorithm and the tool structure of EasyECO.  As the CEO, Dr. Wei focuses on building a strong company infrastructure.  In his CTO role he interfaces with strategic ASIC design customers and leads the field support efforts to seamlessly align EasyECO’s technology with emerging industrial needs.  Wei worked at Agate Logic as an FPGA P&R algorithm developer prior to pursuing his PhD degree.

Dr. Wei received his PhD in Computer Engineering from the Chinese University of Hong Kong and both his MS and BS degrees of Computer Science and Technology from Tsinghua University.

Tell us about Easy-Logic

Easy-Logic was founded in year 2014 by a group of PhD graduates with their supervisor from the Chinese University of Hong Kong.  While in the school, they analyzed the EDA solutions for ASIC design industry and realized that functional ECO demands were growing at an alarming rate, but the EDA industry didn’t respond to it.

They participated in the CAD contest of ICCAD International Conference using the functional ECO-related algorithms developed in their research, won world champions 3 times in a row (2012- 2014).  Worth mentioning, in 2012, the contest subject was functional ECO provided by Cadence. Their algorithm performed twice as good compared to any other contender’s.

With a strong combination of the required product development expertise, Easy-Logic set its course for empowering the ASIC project teams to quickly react to functional ECOs at a substantially lower overall cost.

After the product EasyECO was first introduced in 2018, positive responses from the design industry surprised the young entrepreneurs.  The number of customer evaluation requests overwhelmed the startup, and Easy-Logic quickly became a rising star in the EDA industry.  Currently the customer base extends across Asia and North America, among them, many world’s top-tier semiconductor providers.

What problems are you solving?

Easy-Logic Technology is a solution provider for Functional ECO issues in the ASIC design.

A Functional ECO requirement occurs when there is a change in the RTL code that fixes, or modifies, the chip function.  Functional ECO means inserting only a small patch into the existing design (i.e., pre-layout, cell routing, or even post-mask) to make sure the logic function of patched circuit is consistent with revised RTL.  The purpose is to quickly implement the RTL change without re-spinning the whole design.

The design team may receive Functional ECO requests at any stage of the design process.

Depending on the design stage, the required RTL change ripples through design constraints like multi-clock domain and low power design rules, the DFT test coverage requirements, physical restrictions of the layout change, eventually metal changes, and timing closures.  There is no reliable correlation between the complexity of RTL change and the success of layout ECO even if the RTL change looks simple, where a ECO failure means project re-spin.

At present, most IC design companies still need to invest a lot of manual work in functional ECO because market leading EDA tools are not yet capable of effectively addressing challenging ECO issues.  Each design revision mentioned above requires a skilled engineer to crack down the problem based on the nature of the RTL change and the characteristics of the ASIC design.

Easylogic ECO’s automatic design flow efficiently solves functional ECO problems for design teams.

What application areas are your strongest?

Almost all ASIC designs require Functional ECOs, however, each different application has its unique ECO challenges.  Fortunately, EasylogicECO is structured to handle all challenges.

For example,

  1. HPC has challenges on deep optimization which leads to larger differences between netlist and RTL structure, posing greater challenges for ECO algorithms.
  2. AI chips comprise a significant amount of arithmetic logic, requiring specialized algorithms for arithmetic logic ECO.
  3. Automotive area has challenges on scan chain fixing as test coverage is critical.
  4. Consumer products, such as panel controllers, have challenges adopting subsequent functional ECOs as their products need to be versatile and are revised frequently.

EasylogicECO’s core optimization algorithm lays the foundation for all general optimizations on top of the general algorithm. Algorithm designed for each specific application scenario enables identifying and handling the application challenge automatically.

What keeps your customers up at night?

As mentioned earlier, there is no guarantee for the success of functional ECO and each failed functional ECO job means a project delay from weeks to months. The closer it gets to the tape-out stage, the greater the challenges in achieving success.  A re-spin when the design is close to tape out might even kill the product, so the enormous pressure on the success of ECO task, within the shortest ECO turnaround time, sometimes pushes designers over the edge.

Functional ECO is never a simple job.  Its importance has become an industry consensus, and yet, to this day, major EDA companies still couldn’t provide any satisfactory solutions.  The nagging uncertainty of whether the ECO task can be successful is extremely stressful.

What does the competitive landscape look like and how do you differentiate?

Most ASIC design companies still must invest a lot of manpower on complex functional ECO cases as the solutions provided by major EDA vendors couldn’t get the job done efficiently.

Easy-Logic is a newcomer in the functional ECO landscape.  Easy-Logic’s flagship product, EasylogicECO, deploys patented optimization algorithms to create a combination of

  1. The smallest ECO patch
  2. The easiest tool to address complex cases
  3. The most suitable tool flow to address the depth of ECO design changes

That differentiates EasylogicECO from other solutions.

What new features are you working on? 

Functional ECO requires a complete design flow/toolchain.  Following Functional ECO, DFT ECO, PR ECO, Timing ECO, Metal ECO are also required.  Currently, there is no complete solution available for all these needs.  Easy-Logic is committed to developing a toolchain for the complete functional ECO process, enabling customers to easily navigate from an RTL change to a GDS2 change.

How do customers normally engage with Easy-Logic?

The easiest way is to send an email to the Easy-Logic Customer Response Team through the Contact Us form on the Easy-Logic website.  The Easy-Logic field team will reach out to the sender shortly.

Now that travel is open, Easy-Logic will appear in many conference events, the next one being DAC 2023 in San Francisco.  Please make an appointment before the event, or simply drop by, for a detailed solution discussion.

Also Read:

CEO Interview: Issam Nofal of IROC Technologies

CEO Interview: Ravi Thummarukudy of Mobiveil

Developing the Lowest Power IoT Devices with Russell Mohn