Webinar on Methods for Monte Carlo and High Sigma Analysis

Webinar on Methods for Monte Carlo and High Sigma Analysis
by Tom Simon on 06-12-2020 at 6:00 am

Advanced Monte Carlo Methods

There is an old saying popularized by Mark Twain that goes “There are three kinds of lies: lies, damned lies, and statistics.” It turns out that no one can say who originated this saying, yet despite however you might feel about statistics, they play an important role in verifying analog designs. The truth is that there are large numbers… Read More


Free Webinar: Analog Verification with Monte Carlo, PVT Corners and Worst-Case Analysis

Free Webinar: Analog Verification with Monte Carlo, PVT Corners and Worst-Case Analysis
by Tom Simon on 04-29-2019 at 4:00 pm

The letters “PVT” roll of the tongue easily enough, belying the complexity that variations in process, temperature and voltage can cause for analog designs. For semiconductor processes, there are dozens of parameters that can affect the viability of a design. It would be easy enough to optimize a circuit with only one or two varying… Read More


Machine Learning Meets Scan Diagnosis for Improved Yield Analysis

Machine Learning Meets Scan Diagnosis for Improved Yield Analysis
by Tom Simon on 07-30-2018 at 12:00 pm

Naturally, chips that fail test are a curse, however with the advent of Scan Logic Diagnosis these failures can become a blessing in disguise. Through this technique information gleaned from multiple tester runs can help pin down the locations of defects. Initially tools that did Scan Logic Diagnosis relied on the netlist to filter… Read More


A New Problem for High-Performance Mobile

A New Problem for High-Performance Mobile
by Bernard Murphy on 04-04-2018 at 7:00 am

About 6 months ago, ANSYS was approached by a couple of leading mobile platform vendors/suppliers with a challenging problem. These companies were hitting target 2.5GHz performance goals on their (N10 or N7) application processors, but getting about 10% lower yield than expected, which they attributed to performance failures.… Read More


Mentor Tessent Products Ready for Second Edition of ISO 26262 Coming in March 2018

Mentor Tessent Products Ready for Second Edition of ISO 26262 Coming in March 2018
by Mitch Heins on 01-17-2018 at 7:00 am

Have you notice how smart your automobile is getting? Watching the first round of NFL playoffs I lost count on the number of TV commercials showing cars weaving through tight construction zones (and Star Wars figures), big trucks parking in incredibly tight spaces, cars avoiding rear-end collisions and pedestrians, and even … Read More


Optimizing SRAM IP for Yield and Reliability

Optimizing SRAM IP for Yield and Reliability
by Daniel Payne on 08-31-2015 at 12:00 pm

My IC design career started out with DRAM at Intel, and included SRAM embedded in GPUs, so I recall some common questions that face memory IP designers even today, like:

  • Does reading a bit flip the stored data?
  • Can I write both 0 and 1 into every cell?
  • Will read access times be met?
  • While lowering the supply voltage does the cell data retain?
Read More

Build Low Power IoT Design with Foundation IP at 40nm

Build Low Power IoT Design with Foundation IP at 40nm
by Pawan Fangaria on 07-28-2015 at 12:00 pm

In a power hungry world of semiconductor devices, multiple ways are being devised to budget power from system to transistor level. The success of IoT (Internet of Things) Edge devices specifically depend on lowest power, lowest area, optimal performance, and lowest cost. These devices need to be highly energy efficient for sustained… Read More


Eyes Meet Innovations at DAC

Eyes Meet Innovations at DAC
by Pawan Fangaria on 06-14-2015 at 7:00 am

It gives me a very nice, somewhat nostalgic, feeling after attending the 52[SUP]nd[/SUP] DAC. There was a period during my final academic year in 1990 and my first job when I used to search through good technical papers in DAC proceedings and try implementing those concepts in my project work. In general, representation from ‘R&D… Read More


Exensio: Big Data in the Fab

Exensio: Big Data in the Fab
by Paul McLellan on 03-03-2015 at 7:00 am

For 20 years PDF Solutions have been working with fabs on yield enhancement. Today, they announced their Exensio Platform for big data manufacturing environments. They haven’t really been keeping it a secret and have been talking about it at events since late last year, but it has basically been in stealth mode for the last… Read More


Coventor Panel at IEDM Digs into Variation Issues

Coventor Panel at IEDM Digs into Variation Issues
by Tom Simon on 01-05-2015 at 7:00 pm

Recently I attended a panel discussion on variability in semiconductor fabrication hosted by Coventor in conjunction with the IEEE IEDM conference in San Francisco. The IEEE bills the conference as “the world’s pre-eminent forum for reporting technological breakthroughs in the areas of semiconductor and electronic device… Read More