I have seen a couple of posts comparing the density of the Apple A8 to the Intel Core M and concluding that the TSMC 20nm process is denser than the Intel 14nm process. In one of the threads one of the posters likened this to comparing apples to oranges, I agree except I think it is even worse than that, I think it is more like comparing apples… Read More
Tag: tsmc
IEDM Advanced CMOS Technology Platform Session
First I want recognize that IEDM once again provided all of the attendees with the proceedings as soon as we arrived at the conference, in fact the proceeding included every year of IEDM back to 1955. This is how a conference should be run! Anyone who read my blog about the SPIE Advanced Lithography Conference will know how frustrating… Read More
ANSYS Updates RedHawk for FinFET Nodes
Most designers are not using FinFETs yet, however the increased transistor density and power advantages they offer are compelling. Smaller feature sizes have been a consistent driver in semiconductor technology. Eventually the market will move more and more to FinFET processes, increasingly leaving behind planar transistors.… Read More
Is Fab Business The Forte of APAC?
A little ago, I was looking at the top20 semiconductor companies in the world and was surprised to see a couple of large companies in Taiwan and South Korea garnering >34% of total sales (See – Look who is Leading the World Semiconductor Business). This time it’s another surprise, when I look at IC Insights report on global 300mm… Read More
Results of TSMC’s ECO Fill Flow
By Jeff Wilson, Mentor Graphics and Anderson Chiu, TSMC
At this year’s TSMC Open Innovation Platform® (OIP) Ecosystem Forum, Mentor Graphics and TSMC co-presented some results of the ECO Fill flow developed for TSMC customers working at advanced nodes. Here is a summary of the presentation. (TSMC customers can access the presentation… Read More
IEDM: TSMC, Intel and IBM 14/16nm Processes
This week is IEDM. Three of the presentations today were by TSMC, Intel and IBM going over some of the details of their 14/16nm processes. They don’t provide the slides at IEDM, just the single page papers so this may end up being a somewhat random collection of facts.
TSMC were up first. They talked about the improvements that… Read More
TSMC Gets Ready for IoT
With all the talk about 14/16nm and 10nm it is important to realize that older processes are still important. Eventually 16nm may end up being cheaper than 28nm but for the time being 28nm seems to be a sort of sweet spot, not just cheaper than every process that came before it (which was true for every new node) but also cheaper than every… Read More
TSMC Bringing EUV Into Production
Last week was ASML’s investor day. I wasn’t there and they haven’t yet got the material posted on their website, so this is all second hand information. As you know, if you have read any of my comments on EUV, I have been dubious about whether EUV would ever work for production.
The three big problems seem to be:
- source
What makes the world smart?
The simple answer is when everything in the world is smart. But if you think deeply, you would find that the continuous progression to make things easy in life is what makes the world smarter day-by-day – the sky is the limit. In the world of computing, consider the 17[SUP]th[/SUP] century era when humanbrain was used as a computer … Read More
More Apple A9 Ridiculousness!
File this one under funny things journalists are paid to say. Last week the Korea Times reported that Apple had “designated” Samsung as the primary supplier of the next Apple SoC. In response, the Chinese Commercial Times reported that TSMC is to supply the Apple A9 chip despite competition from Samsung. Since SemiWiki readers … Read More