IC to Systems Era

IC to Systems Era
by Daniel Nenni on 05-16-2019 at 12:00 pm

One of my favorite EDA disruptions is the Siemens acquisition of Mentor, pure genius. Joe Sawicki now runs the Mentor IC EDA business for Siemens so we will be seeing him at more conferences and events than ever before. Joe did a very nice keynote at the recent U2U conference that I would like to talk about before we head to the 56thDAC… Read More


TSMC and Samsung 5nm Comparison

TSMC and Samsung 5nm Comparison
by Scotten Jones on 05-03-2019 at 7:00 am

Samsung and TSMC have both made recent disclosures about their 5nm process and I though it would be a good time to look at what we know about them and compare the two processes.

A lot of what has been announced about 5nm is in comparison to 7nm so we will first review 7nm.

7nm
Figure 1 compares Samsung’s 7LPP process to TSMC’s 7FF and 7FFP… Read More


SPIE Advanced Lithography Conference – Imec and Veeco on EUV

SPIE Advanced Lithography Conference – Imec and Veeco on EUV
by Scotten Jones on 04-19-2019 at 12:00 pm

At the SPIE Advanced Lithography Conference Imec presented several papers on EUV and Veeco presented about etching for EUV masks. I had the opportunity to see the presentations and speak with some of the authors. In this article I will summarize the key issues around EUV based on this research.

EUV is ramping up into high volume 7nm… Read More


2018 Semiconductor Year in Review

2018 Semiconductor Year in Review
by Scotten Jones on 01-04-2019 at 12:00 pm

Strong Overall Market Growth but a Slowdown Looms
After six years of single digit percentage growth in the overall semiconductor market, 2017 saw almost 22% growth and 2018 year-to-date is up roughly 17% (based on numbers published by the world semiconductor trade statistics). The big growth driver the last two years has been … Read More


Embeddable FPGA Fabric on TSMC 7nm

Embeddable FPGA Fabric on TSMC 7nm
by Tom Simon on 12-14-2018 at 7:00 am

With their current line-up of embeddable and discrete FPGA products, Achronix has made a big impact on their markets. They started with their Speedster FPGA standard products, and then essentially created a brand-new market for embeddable FPGA IP cores. They have just announced a new generation of their Speedcore embeddable… Read More


56G and 112G SerDes Where the rubber meets the road

56G and 112G SerDes Where the rubber meets the road
by Tom Simon on 12-11-2018 at 12:00 pm

No matter how high the processing capability of a chip, its overall performance is limited by IO speed. This is very similar to a car with low performance tires, a powerful engine will not be able to transfer its energy to the ground effectively. There is quite literally a race going on between core processing and IO speeds for transferring… Read More


Intel Q3 2018 Jibber Jabber

Intel Q3 2018 Jibber Jabber
by Daniel Nenni on 10-29-2018 at 7:00 am

This is what happens when you have a CFO acting as a semiconductor CEO, and Robert Holmes is a career CFO with zero semiconductor experience or education. Granted, no way did he write the opening statement, but it was full of jibber jabber anyway. The real disappointing jibber jabber was from our own Murthy Renduchintala on the status… Read More


The Shape of Semiconductor Things to Come

The Shape of Semiconductor Things to Come
by Robert Maire on 10-15-2018 at 7:00 am

Given that the semiconductor industry is clearly in the midst of a down cycle (even though there are cycle deniers, also members of the flat earth society…), most investors and industry participants want to know the timing of the down cycle and the shape of the recovery as we want to know when its safe to buy the stocks again. … Read More


GLOBALFOUNDRIES Pivoting away from Bleeding Edge Technologies

GLOBALFOUNDRIES Pivoting away from Bleeding Edge Technologies
by Daniel Nenni on 08-27-2018 at 3:00 pm

It’s no secret that I have been a big fan of GLOBALFOUNDRIES since they came about in March of 2009. We even included them in our first book “Fabless: The Transformation of the Semiconductor Industry” right next to TSMC. I am also a big fan of pivoting which is the term we use here in Silicon Valley to describe some of the most innovative… Read More


Welcome DDR5 and Thanks to Cadence IP and Test Chip

Welcome DDR5 and Thanks to Cadence IP and Test Chip
by Eric Esteve on 05-25-2018 at 7:00 am

Will we see DDR5 memory (device) and memory controller (IP) in the near future? According with Cadence who has released the first test chip in the industry integrating DDR5 memory controller IP, fabricated in TSMC’s 7nm process and achieving a 4400 megatransfers per second (MT/sec) data rate, the answer is clearly YES !

Let’s come… Read More