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Arm’s Total Compute approach addresses many different requirements, from low-power edge devices with adequate performance, to data center class processors delivering the highest possible compute throughput. To realize these requirements, there must be a massive shift in the approach to system-on-chip (SoC) design.
CadenceCONNECT:
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Arm’s Total Compute approach addresses many different requirements, from low-power edge devices with adequate performance, to data center class processors delivering the highest possible compute throughput. To realize these requirements, there must be a massive shift in the approach to system-on-chip (SoC) design.
CadenceCONNECT:
…
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There has been a lot written about artificial intelligence/machine learning (AI/ML) and its application in the Cadence digital design flow. Most recently, I covered significant verification efficiency improvements in Xcellium ML. A recent digital-themed white paper from Cadence takes a broader look at the impact of ML on… Read More
Overview
The Cadence® Innovus™ Implementation System continues to extend technology innovation to ensure designers can complete ever larger and more complex designs. During this webinar, Cadence will share the latest Innovus Implementation 20.1 release technology highlights.
Topics such as physically aware logic restructuring,
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Tue, Mar 31, 2020 11:00 AM – 12:00 PM MDT
*** This webinar requires that you register with your work email address ***
As we move towards advanced nodes where supply voltage reduces and transistors shrink in size, reliability challenges increase significantly. Designers see more IR drop and power integrity issues, and we… Read More
I’m on a mini-roll on the subject of high-level design for ML-based systems. No complaints from me, this is one of my favorite domains and is certainly a hot area; it’s great to that EDA vendors are so active in advancing ML-based design. Here I want to talk about the Catapult HLS flow for use in ML design.
Since I’ve covered the ML topic… Read More
Want to know how NVIDIA signs off on power integrity and reliability on mega-chips? Read on.
PPA over-design has repercussions in increased product cost and potential missed schedules with no guarantee of product success. Advanced SoCs pack more functionality and performance resulting in higher power density, but traditional… Read More
To paraphrase an Austen line, it is a truth universally acknowledged that implementation, power intent and design hierarchy don’t always align very well. Hierarchy is an artifact of legacy structure, reuse and division of labor, perhaps well-structured piecewise for other designs but not necessarily so for the design you now… Read More
If you are building an advanced SoC, you know that you’re going to need a lot of embedded memory. Unless this is your first rodeo, you also know that which memories you choose can have a huge impact on Power, Performance and Area (PPA) and, for some applications, Energy (power integrated over time), Temperature and Reliability. Which… Read More
About 13 months ago, the leak blogs posted news of “Artemis” on an alleged ARM roadmap slide, supposedly a new 16FF ARM core positioned as the presumptive successor to the Cortex-A57. Now, we’re finding out what “Artemis” may actually be, inside a multi-core PPA test chip on TSMC 10FinFET.… Read More
