Computer Vision Design with HLS

Computer Vision Design with HLS
by Bernard Murphy on 08-21-2018 at 7:00 am

I’m on a mini-roll on the subject of high-level design for ML-based systems. No complaints from me, this is one of my favorite domains and is certainly a hot area; it’s great to that EDA vendors are so active in advancing ML-based design. Here I want to talk about the Catapult HLS flow for use in ML design.

Since I’ve covered the ML topic… Read More


Webinar: High-Capacity Power Signoff Using Big Data

Webinar: High-Capacity Power Signoff Using Big Data
by Bernard Murphy on 11-07-2017 at 7:00 am

Want to know how NVIDIA signs off on power integrity and reliability on mega-chips? Read on.

PPA over-design has repercussions in increased product cost and potential missed schedules with no guarantee of product success. Advanced SoCs pack more functionality and performance resulting in higher power density, but traditional… Read More


Webinar: How RTL Design Restructuring Helps Meet PPA

Webinar: How RTL Design Restructuring Helps Meet PPA
by Bernard Murphy on 06-07-2017 at 7:00 am

To paraphrase an Austen line, it is a truth universally acknowledged that implementation, power intent and design hierarchy don’t always align very well. Hierarchy is an artifact of legacy structure, reuse and division of labor, perhaps well-structured piecewise for other designs but not necessarily so for the design you now… Read More


eSilicon Just Made It Easier to Explore Memory Tradeoffs

eSilicon Just Made It Easier to Explore Memory Tradeoffs
by Bernard Murphy on 10-14-2016 at 7:00 am

If you are building an advanced SoC, you know that you’re going to need a lot of embedded memory. Unless this is your first rodeo, you also know that which memories you choose can have a huge impact on Power, Performance and Area (PPA) and, for some applications, Energy (power integrated over time), Temperature and Reliability. Which… Read More


ARM tests out TSMC 10FinFET – with two cores

ARM tests out TSMC 10FinFET – with two cores
by Don Dingee on 05-25-2016 at 4:00 pm

About 13 months ago, the leak blogs posted news of “Artemis” on an alleged ARM roadmap slide, supposedly a new 16FF ARM core positioned as the presumptive successor to the Cortex-A57. Now, we’re finding out what “Artemis” may actually be, inside a multi-core PPA test chip on TSMC 10FinFET.… Read More


Body-biasing for ARM big or LITTLE in GF 22FDX

Body-biasing for ARM big or LITTLE in GF 22FDX
by Don Dingee on 05-04-2016 at 4:00 pm

GLOBALFOUNDRIES has been evangelizing their 22FDX FD-SOI process for a few months; readers may have seen Tom Simon’s write-up of their preview at ARM TechCon. Dr. Joerg Winkler recently gave an updated webinar presentation of their approach in an implementation of ARM Cortex-A17 core.

By now, you’ve probably heard that 22FDX… Read More


SoCs in New Context Look beyond PPA

SoCs in New Context Look beyond PPA
by Pawan Fangaria on 03-21-2015 at 7:00 am

If we look back in the last century, performance and area were two main criteria for semiconductor chip design. All design tools and flows were concentrated towards optimizing those two aspects. As a result, density of chips started increasing and power became a critical factor. Now, Power, Performance and Area (PPA) are looked… Read More


Innovus: Cadence’s Next Generation Implementation System

Innovus: Cadence’s Next Generation Implementation System
by Paul McLellan on 03-11-2015 at 7:00 am

Yesterday was the first day of CDNLive. There were three keynotes. The first was by Lip-Bu Tan, Cadence’s CEO (and the Chairman of Walden International that he will be the first to remind you). The most interesting tidbit was that Cadence now has over 1000 people working on IP and that it represents 11% of their revenue. Then… Read More


IP Market at Your Desk!

IP Market at Your Desk!
by Pawan Fangaria on 02-01-2015 at 4:00 pm

Semiconductors have played very important role in making internet successful and that has unleashed the potential of e-commerce. Today, we see names like Alibaba, whose primary focus is on commodity trade. I couldn’t imagine an e-commerce type of web portal for semiconductor services until I looked at the eSilicon website. … Read More


20nm IC production needs more than a ready Foundry

20nm IC production needs more than a ready Foundry
by Pawan Fangaria on 08-23-2013 at 11:00 am

I think by now all of us know, or have heard about 20nm process node, its PPA (Power, Performance, Area) advantages and challenges (complexity of high design size and density, heterogeneity, variability, stress, lithography complexities, LDEs and so on). I’m not going to get into the details of these challenges, but will ponder… Read More