Today, the CMOS chip manufacturing is the pinnacle of the human technology defining economy, society and perhaps us as modern humans. This was highlighted by the recent chip shortage, followed by the ‘shocking’ realization that more than 80% of all chips are manufactured in the Far East.
Important decisions need to be taken by … Read More
IBM and Leti each presented several papers at IEDM including a joint nanosheet paper. I had the opportunity to sit down with Huiming Bu, director of advanced logic & memory tech and Veeraraghavan Basker, senior engineer from IBM and then in a separate interview Francois Andrieu, head of advanced CMOS laboratory and Shay Reboh,… Read More
A variety of growing and emerging segments of the semiconductor industry rely on Silicon-On-Insulator (SOI) wafers. Soitec is the primary source for SOI wafers particularly on 300mm. On Tuesday at SEMICON I got to sit down with Bernard Aspar, Soitec’s Executive Vice President, Communication & Power BU and Christophe… Read More
I have attended last week to the LETI Days in Grenoble, lasting two days to mark the 50[SUP]th[/SUP] anniversary of the CEA subsidiary. Attending to the LETI Days is always a rich experience: LETI is a research center counting about 3000 research engineers, but LETI is also a start-up nursery. The presentations are ranging from … Read More
I had the good fortune to be able to attend a very informative five-day photonic integrated circuit (PIC) training this last week in Santa Clara, CA. The training was organized by Erik Pennings of 7 Pennies consulting and hosted by Tektronix. Several ecosystem partners from the design automation, photonic foundries and photonic… Read More
On Tuesday, July 12th at SEMICON West I had an opportunity to sit down with Marie Semeria, the CEO of Leti and discuss the status and future of FDSOI. Leti pioneered FDSOI 15 years ago and has been the leading FDSOI research ever since.
Two years ago Leti and ST Micro demonstrated products on 28nm that are cost competitive with bulk technology.… Read More
Let’s start with yesterday evening, so technically yesterday. It was July 14th, which is the equivalent of Independence Day in France. So the perfect day for Leti, based in Grenoble, to present a lot of the work that they are doing on 3D “more than Moore” type technologies, including photonics. Also, wafer-scale… Read More
The LETI days and the associated FD-SOI workshop took place in Grenoble (France) last week and I could not attend in person… but I had the opportunity to speak with LETI CEO Marie Semaria. Before going into details into the 3 key messages from the LETI (FD-SOI, Silicon Impulse and Cool Cube), it’s important to share the great news from… Read More
The LETI and STMicro have demonstrated a DSP that can hit 500 MHz while pulling just 460mV – that’s ten times better than anything the industry’s seen so far. Implemented on a 28nm FD-SOI technology, with ultra thin forward body biasing (UTFBB) capability (used to decrease Vth), this DSP can also be exercised at higher voltage when… Read More
No doubt that FDSOI generate high interest these days and I found a very interesting contribution from Zvi Or-Bach, President and CEO of MonolithIC 3D, Inc. Zvi has accepted to share his wrap-up from IEDM, in a blog for Semiwiki readers. If you remember the long discussion we had in Semiwiki about cost comparison, some comments were… Read More