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As you may have heard, Intel is making some interesting moves into the China mobile market. At first it had me a bit puzzled but I had some lengthy discussions about it during ARM TechCon last week so I’m ready to start writing. Spoiler alert: This will be pro Intel so please sit down and take some deep breaths before reading.
The first… Read More
Silicon Does NOT Lie!by Daniel Nenni on 10-06-2014 at 7:00 amCategories: General
In the 30+ years that I have worked in Silicon Valley I have seen many great products fail and even more mediocre products succeed, the difference being how the companies communicate to the outside world. In the semiconductor industry, presenting the value proposition of your company or product is under even more scrutiny now that… Read More
One of the strengths of the fabless semiconductor ecosystem is competition since it keeps innovation high and prices low. One of the challenges of fostering competition is that you have to make good on a threat of using a competing product during a pricing negotiation. Well, in my opinion, for the next version of the iPhone, Apple… Read More
It was CES 2011 when Steve Ballmer sweatered up and pitched the coming universe according to Microsoft, where the same Windows base would run on everything – PC, phone, tablet, and game console. Getting from that visionary statement to Windows 10 hasn’t been a smooth ride.… Read More
ARM ♥ TSMC!by Daniel Nenni on 10-02-2014 at 4:00 pmCategories: Arm, Foundries, IP, TSMC
This week is the 10[SUP]th[/SUP] annual ARM Technical Conference in Silicon Valley. In regards to size, content, and relevance, I believe ARM TechCon is the #1 event for the fabless semiconductor ecosystem for sure. I attended keynotes, sessions, and walked the hallways on Wednesday and Thursday. I wish I could write about everything… Read More
In the modern semiconductor ecosystem we are seeing rapid advancement in technology breaking past once perceived limits; 28nm, 20nm, 16-14nm, 10nm and we are foreseeing 7nm now. Double and multi-patterning are already being seen along with complex FinFET structures in transistors to gain the ultimate advantages in PPA from… Read More
There has been a lot of discussion on SemiWiki lately around 14nm FinFET technology and who really leads and by how much. I thought it would be interesting to review some process metrics for previous technology generation and then make some forecasts around 10nm.
The focus of this article will be Intel, TSMC and Global Foundries/Samsung… Read More
ARM ♥ Xilinx!by Daniel Nenni on 09-28-2014 at 7:00 amCategories: Arm, FPGA, IP, Xilinx
The good news is that as a part of SemiWiki we get free media passes to all of the cool conferences. The bad news is that our inboxes get flooded with announcements. ARM TechCon is next week and my delete button is on overtime but it is interesting to see who is active in conferences and who is not. In this case Xilinx is very active and Altera… Read More
The official term is “beneficiary rule”, but among colorful racing broadcasters, drivers, and fans it is more commonly referred to as the “lucky dog”: the driver who is down a lap, but gets to advance to the lead lap by virtue of being farthest ahead when a caution flag is raised.
Qualcomm has lapped the entire field when it comes to … Read More
There were two big announcements last week right in my backyard and I missed them both! Instead, I was in Taiwan investigating yet another big development and all three of these events will intersect next year, absolutely.
At IDF in San Francisco Intel outlined the new 14nm Core M. This is an impressive CPU, one that will fill the now… Read More