Last week Intel held a manufacturing day where they revealed a lot of information about their 10nm process for the first time and information on competitor processes continues to slowly come out as well. I thought it would be useful to summarize what we know now, especially since some of what Intel announced was different than what… Read More
Tag: intel
Integrated Photonics Accelerates with Entrance of TSMC and TowerJazz Foundries
I’m writing this from the Boston airport on my way home from four straight weeks of PIC (photonic integrated circuit) related travel. It’s been a grueling but very rewarding four weeks and the big take away from this month is that there are now many more signs in the market that integrated photonics is reaching a real tipping point.… Read More
Shootout at 22nm!
For an industry that drives improvement at an exponential rate it is funny how often something old is new again. Intel went into high volume production on 22nm in 2011, and TSMC and Samsung have both had 20nm technologies in production for several years. And yet, recently we have seen renewed interest in 22nm. GLOBALFOUNDRIES has… Read More
Intel Manufacturing Day: Nodes must die, but Moore’s Law lives!
Yesterday I attended Intel’s manufacturing day. This was the first manufacturing day Intel has held in three years and according to Intel their most in depth ever.
Nodes must die
I have written several articles comparing process technologies across the leading-edge logic producers – GLOBALFOUNDRIES, Intel, Samsung… Read More
ESDA Event: Power and Policy in California
Apparently this event is now being postponed until sometime later in the year. Stay tuned
We spend a lot of our time with our heads down in the technical details and when we look up at what we think is the big picture, it’s usually just a little bit bigger, often no more than a justification for immediate product directions. So wouldn’t… Read More
SPIE 2017: EUV Readiness for High Volume Manufacturing
The SPIE Advanced Lithography Conference is the world’s leading conference addressing photolithography. This year on the opening day of the conference, Samsung and Intel presented papers summarizing the readiness of EUV for high volume manufacturing (HVM). In this article, I will begin by summarizing the EUV plans … Read More
EUV is NOT Ready for 7nm!
The annual SPIE Advanced Lithography Conference kicked off last night with vendor sponsored networking events and such. SPIE is the international society for optics and photonics but this year SPIE Advanced Lithography is all about the highly anticipated EUV technology. Scotten Jones and I are at SPIE so expect more detailed… Read More
Scott Jones ISS Talk – Moore’s Law Lives!
I was invited to give a talk at this year’s ISS conference, the talk seemed to be very well received and I was asked to blog about it for SemiWiki. Parts of the talk will be familiar to SemiWiki readers from some of my previous blogs but I also went into more detail around some scaling challenges. The following is a summary of what… Read More
AMD vs Intel Update!
Is it just me or has AMD just pulled off one of the most amazing semiconductor comebacks of the century? Let’s take a closer look.
Who doesn’t long for the days when Intel and AMD went head to head in the battle for microprocessor supremacy? Back then Intel, was still operating under the Andrew Grove mantra of “Only the Paranoid Survive”… Read More
Intel Conveys Compute Card Capabilities at CES
Intel is once again adding a new computing form factor to the mix. At CES Intel announced its new Intel Compute Card. It combines CPU, GPU, DRAM, storage, WiFi, and communications inside a small modular housing slightly larger than a credit card and about 5mm thick. Intel already offers its Compute Stick, but it is limited in its interface… Read More