Samsung Voice of the Body

Samsung Voice of the Body
by Paul McLellan on 05-28-2014 at 2:12 pm

I just back from Samsung’s big announcement held at the SFJazz center (very conveniently 15 minutes walk from my place). They put a stake in the ground about their program at the intersection of medicine and health and technology. They had said in advance that they would not announce any new hardware but in fact they did…although… Read More


Semicon Technology Advancement – A View From IEDM

Semicon Technology Advancement – A View From IEDM
by Pawan Fangaria on 12-20-2013 at 10:00 am

As I see the semiconductor industry going through significant changes and advances, yet ironically plagued by a growing perception that the pace of scaling is slowing, I was inclined to take a peek into what the industry experts say about the state of the industry and the future of Moore’s Law. Fortunately, at last week’s InternationalRead More


2nd International RRAM Workshop at Stanford

2nd International RRAM Workshop at Stanford
by Ed McKernan on 10-24-2012 at 5:00 pm

The 2nd International Workshop on Resistive RAM. The workshop was the second installment of an annual series organized by Stanford University and the Belgian research institute Imec. Like most RRAM workshops, this year’s event featured talks focusing on the physics of RRAM devices and their underlying switching mechanism(s).… Read More


2nd International Workshop on Resistive RAM at Stanford

2nd International Workshop on Resistive RAM at Stanford
by Ed McKernan on 09-20-2012 at 8:02 pm

A Veritable who’s who of ReRAM researchers will be present at the 2nd International Workshop on Resistive RAM at Stanford in the beginning of October. Sponsored by IMEC and Stanford’s NMRTI (Non-Volatile Technology Research Initiative), the program features two days of talks, panel sessions and no doubt lots of… Read More


Learning about 3D IC Design and Test, IEEE Workshop on Friday, December 9th in Newport Beach, CA

Learning about 3D IC Design and Test, IEEE Workshop on Friday, December 9th in Newport Beach, CA
by Daniel Payne on 11-19-2011 at 4:42 pm

The IEEE has an Orange Country Chapter of the Components, Packaging and Manufacturing Technology Society who are organizing an all-day workshop, 3D Integrated Circuits: Technologies Enabling the Revolution. This looks to be an informative day with real-world examples in both design and test being presented by over a dozen … Read More


AMD and GlobalFoundries / TI and UMC

AMD and GlobalFoundries / TI and UMC
by Daniel Nenni on 04-11-2011 at 11:38 am

There have been some significant foundry announcements recently that if collated will give you a glimpse into the future of the semiconductor industry. So let me do that for you here.

First the candid EETimes article about TI dumping Samsung as a foundry:

Taiwan’s UMC will take the ”lead role’’ in making the OMAP 5 device onRead More


Atrenta Semiconductor Design in 3D!

Atrenta Semiconductor Design in 3D!
by Daniel Nenni on 06-27-2010 at 7:04 pm

My vote for most compelling technology at #47DAC is 3D technology. No, I don’t mean Hollywood-style 3D, I’m talking about vertical stacked-die system on chip design. This design approach basically means putting different parts of the system on different silicon substrates, so you can use the right technology for each part, and… Read More