Accelerating Design and Manufacturing at the 25th Annual IEEE Electronic Design Process Symposium

Accelerating Design and Manufacturing at the 25th Annual IEEE Electronic Design Process Symposium
by Camille Kokozaki on 09-05-2018 at 12:00 pm

25th annual IEEE Electronic Design Process Symposium
Accelerating Design and Manufacturing
September 13 & 14, 2018, SEMI, 673 S. Milpitas Blvd, Milpitas, CA 95035

This year marks a milestone in EDPS’s history as it turns 25. The event will be held at SEMI’s new headquarter facility and will provide a forum for EDA, foundry … Read More


Attending DAC in Austin for Free

Attending DAC in Austin for Free
by Daniel Payne on 04-23-2017 at 7:00 am

I’ve been attending DAC since the late 1980’s and can tell you that it’s an annual highlight for me and anyone else interested in the EDA, IP and semiconductor industries. Where else can you see most of the big and little vendors of EDA software, semiconductor IP and foundries in one place? I recently blogged aboutRead More


OEMs Lead the Way on Self Driving Tech

OEMs Lead the Way on Self Driving Tech
by Roger C. Lanctot on 02-25-2017 at 7:00 am

It’s never a good sign when car makers are called before Congress. It’s almost as bad as being asked to visit the President. But last week the meeting didn’t involve allegations or investigations. It was just an occasion for a friendly chat regarding “Self-Driving Cars: Road to Deployment.”

IEEE
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IoT Standardization and Implementation Challenges

IoT Standardization and Implementation Challenges
by Ahmed Banafa on 11-15-2016 at 12:00 pm

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The rapid evolution of the #IoT market has caused an explosion in the number and variety of IoT solutions. Additionally, large amounts of funding are being deployed at IoT startups. Consequently, the focus of the industry has been on manufacturing and producing the right types of hardware to enable those solutions. In current … Read More


Why are Top Brass from NXP, Qualcomm, Skyworks Keynoting Upcoming IEEE SOI-3D-SubVt (S3S) Conference? (San Francisco, Oct.’16)

Why are Top Brass from NXP, Qualcomm, Skyworks Keynoting Upcoming IEEE SOI-3D-SubVt (S3S) Conference? (San Francisco, Oct.’16)
by Adele Hars on 08-25-2016 at 12:00 pm

By Fred Allibert
The IEEE S3S Conference (10-13 October 2016 at the San Francisco Airport Hyatt Regency) brings together 3 key technologies that will play a major role in tomorrow’s industry: SOI, 3D integration, and Subthreshold Microelectronics. The numerous degrees of freedom they allow enable the ultra-low power operation… Read More


At What Point Does Transistor Gate Length Stop Getting Smaller?

At What Point Does Transistor Gate Length Stop Getting Smaller?
by Daniel Payne on 08-03-2016 at 12:00 pm

When I started doing IC design back in 1978 we had 6,000 nm channel gate lengths, and today you can buy a smart phone with 16 nm or 14 nm technology, although the gate lengths in those phones are more like 34 nm. The International Technology Roadmap for Semiconductors (ITRS) makes predictions about emerging trends in our industry and… Read More


The Importance of Transistor-Level Verification

The Importance of Transistor-Level Verification
by Students@olemiss.edu on 04-10-2016 at 7:00 am

According to the IEEE Std 1012-2012, verification is the acknowledgement that a product is in satisfactory condition by meeting a set of rigorous criteria. [3] Transistor-level verification involves the use of custom libraries and design models to achieve ultimate performance, low power, or layout density. [2] Prediction… Read More


Speaking about the Internet of Trust on April 21

Speaking about the Internet of Trust on April 21
by Don Dingee on 03-14-2016 at 4:00 pm

Five minutes to ruin a reputation built over 20 years, as Warren Buffett put it, holds true in personal relationships. On the Internet of Things, reputations can disappear in five seconds. How do we move from merely intelligent Things to a level where devices have to be Trusted?… Read More


OCF shows there may be hope for IoT consortia yet

OCF shows there may be hope for IoT consortia yet
by Don Dingee on 03-02-2016 at 4:00 pm

The recent launch of the Open Connectivity Foundation (OCF) was met first with a wave of “oh good, another IoT consortium”, then “phew, it’s just a rebrand of the OIC”, followed by a bit of confusion over why a few AllSeen Alliance players and some other names jumped in. Is it just a marketing ploy, or is there more to this?… Read More


Challenges in IP Qualification with Rising Physical Data

Challenges in IP Qualification with Rising Physical Data
by Pawan Fangaria on 12-17-2015 at 7:00 am

With every new technology node, there are newer physical effects that need to be taken into account. And every new physical effect brings with itself several new formats to model them. Often a format is also associated with several of its derivatives, sometimes an standard reincarnation of a proprietary format further evolved… Read More