Abstract:
The programming interfaces of logic simulators are largely the domain of specialists writing proprietary tools and extensions and are only vaguely in the consciousness of many design and verification engineers, if aware at all. Yet the simplest use of such interfaces opens up a whole world of possibilities in extending
The 23rd annual IEEE Wireless and Microwave Technology Conference, WAMICON 2023, will be held in Melbourne, Florida, on April 17-18, 2023.
The conference will address up-to-date multidisciplinary research needs and interdisciplinary aspects of wireless and RF technology. The central theme of WAMICON 2023
OPEN TO EVERYONE
Note, The Michigan EMC Fest is May 25, 2023 <here>
This will be a great MiniSymposium, guaranteed to sell out
If you are working in the EMC field, our MiniSymposium is for you!
You definitely will come away with new ideas about troubleshooting techniques, specification updates and a better understanding… Read More
VLSI-SoC 2023 is the 31st in a series of international conferences sponsored by the International Federation for Information Processing Technical Committee 10 Working Group 5, IEEE CEDA, and IEEE CASS, which explore the state-of-the-art in the areas of Very Large-Scale Integration (VLSI) and System-on-Chip (SoC) design.… Read More
The MIXDES conference series started in Debe near Warsaw in 1994 and has been organized yearly in different Polish cities. This time we would like to invite you to Kraków.
The aim of the MIXDES conference is to provide an annual Central-European forum for the presentation and discussion of recent advances in design, modeling, simulation,… Read More
May 21 – May 25, 2023
Monterey, California, USA
The IEEE International Symposium on Circuits and Systems (ISCAS) is the flagship conference of the IEEE Circuits and Systems (CAS) Society and the world’s premiere forum for researchers in the active fields of theory, design and implementation of circuits
Presenter: Boris Murmann
Description
Abstract: Inspired by the possibilities of open-source chip design, the IEEE Solid-State Circuits Society (SSCS) launched its new Platform for IC Design Outreach (PICO) in the summer of 2021. With this program, the SSCS intends to contribute to the new open source movement, forge connections… Read More
The Phil Kaufman Award honors individuals who have had a demonstrable impact on the field of electronic system design through technology innovations, education/mentoring, or business or industry leadership. The award was established as a tribute to Phil Kaufman, the late industry pioneer who turned innovative technologies… Read More
Next-generation devices increasingly feature complex architectures that connect dies vertically (3D IC) or side-by-side (2.5D) so they behave as a single device. The new Tessent Multi-die software delivers comprehensive automation for the highly complex DFT tasks associated with these 2.5D and 3D IC designs.
Tessent Multi-die
We are excited to invite you to the 2022 IEEE Israel Electromagnetic Compatibility, Signal & Power Integrity Conference, the biggest EMC SI/PI event in Israel. Meet world-leading EMC, SI/PI and PCB designers and get to know the local community.
This is an excellent opportunity
