Humans certainly have always had an aesthetic preference for symmetry. We also see symmetry showing up frequently in nature. The importance of symmetry in electronic designs has been apparent for decades. There are a host of analog structures that require balanced layout. For instance, these include differential pairs and … Read More
Tag: finfet
TSMC Design Considerations for Gate-All-Around (GAA) Technology
The annual VLSI Symposium provides unique insights into R&D innovations in both circuits and technology. Indeed, the papers presented are divided into two main tracks – Circuits and Technology. In addition, the symposium offers workshops, forums, and short courses, providing a breadth of additional information.
At… Read More
VLSI Symposium – TSMC and Imec on Advanced Process and Devices Technology Toward 2nm
At the 2021 Symposium on VLSI Technology and Circuits in June a short course was held on “Advanced Process and Devices Technology Toward 2nm-CMOS and Emerging Memory”. In this article I will review the first two presentations covering leading edge logic devices. The two presentations are complementary and provide and excellent… Read More
TSMC and the FinFET Era!
While there is a lot of excitement around the semiconductor shortage narrative and the fabs all being full, both 200mm and 300mm, there is one big plot hole and that is the FinFET era.
Intel ushered in the FinFET era only to lose FinFET dominance to the foundries shortly thereafter. In 2009 Intel brought out a 22nm FinFET wafer at the… Read More
ISS 2021 – Scotten W. Jones – Logic Leadership in the PPAC era
I was asked to give a talk at the 2021 ISS conference and the following is a write up of the talk.
The title of the talk is “Logic Leadership in the PPAC era”.
The talk is broken up into three main sections:
- Background information explaining PPAC and Standard Cells.
- A node-by-node comparisons of companies running leading edge logic
Analog Bits is Supplying Analog Foundation IP on the Industry’s Most Advanced FinFET Processes
The industry recently concluded a series of technology events for the all the major foundries. Done as virtual events this year, each one provided a significant update on technology platforms, roadmaps and ecosystem partnerships. These events are quite valuable to chip design teams who need to be aware of the latest in process,… Read More
5G, Hyperscaling and the Resurgence of Consumer Silicon
At the recent TSMC OIP Ecosystem Forum and Technology virtual events, TSMC re-affirmed their previous prediction that 5G is going to be a multi-year silicon mega-trend with the biggest drivers being the ramp up of 5G handsets, supporting infrastructure and the continued growth of high performance computing (HPC).
We all want… Read More
A “Super” Technology Mid-life Kicker for Intel
Summary
At the recent Intel Architecture Day 2020 symposium, a number of technology enhancements to the Intel 10nm process node were introduced. The cumulative effect of these enhancements would provide designs with a performance boost (at iso-power) approaching 20% – a significant intra-node enhancement, to be sure. The… Read More
Designing AI Accelerators with Innovative FinFET and FD-SOI Solutions
I had the pleasure of spending time with Hiren Majmudar in preparation for the upcoming AI Accelerators webinar. As far as webinars go this will be one of the better ones we have done. Hiren has deep experience in both semiconductors and EDA during his lengthy career at Intel and now with a pure play foundry. He is intelligent, personable,… Read More
Staying on the Right Side in Worst Case Conditions – Performance (Part 2)
In this, the second part of a two-part series we delve further into defining worst case, this time focusing specifically on device performance.
In the last blog we talked about the steady increase in power density per unit silicon area and how worst case is definitely getting worse. We discussed how in each new FinFET node the dynamic… Read More
