TSMC Q1 2019 Earnings Call Discussion!

TSMC Q1 2019 Earnings Call Discussion!
by Daniel Nenni on 04-19-2019 at 7:00 am

It’s no coincidence that the TSMC Symposium is right after the Q1 earnings call. This will allow TSMC to talk more freely and they certainly will, my opinion. It is a very interesting time in the semiconductor industry and TSMC, being the bellwether, can tell us what will happen the rest of the year and give us some 2020 insights.… Read More


Samsung 5nm and TSMC 6nm Update

Samsung 5nm and TSMC 6nm Update
by Daniel Nenni on 04-16-2019 at 12:00 pm

TSMC and Samsung continue to raise the competitive bar for FinFET foundry market share with dueling announcements this week. As I mentioned previously in the blog Semiconductor Foundry Landscape Update 2019, FinFETs are the market to watch with the coming onslaught of 5G and AI chips on the edge, in the cloud, and in our autonomous… Read More


Accelerating 5G Innovation and Reliability Through Simulation and Advanced FinFET Design

Accelerating 5G Innovation and Reliability Through Simulation and Advanced FinFET Design
by Camille Kokozaki on 02-14-2019 at 7:00 am

In an ANSYS seminar held at DesignCon 2019, Dr. Larry Williams, ANSYS Director of Technology, outlined how 5G design innovation can be accelerated through simulation. He posited that 5G will become a general-purpose technology that affects an entire economy, drastically alter societies and unleash a cascade of complementary… Read More


Where Circuit Simulation Model Files Come From

Where Circuit Simulation Model Files Come From
by Daniel Payne on 02-07-2019 at 7:00 am

I started out my engineering career by doing transistor-level circuit design and we used a proprietary SPICE circuit simulator. One thing that I quickly realized was that the accuracy of my circuit simulations depended entirely on the model files and parasitics. Here we are 40 years later and the accuracy of SPICE circuit simulations… Read More


Parasitic Extraction for Advanced Node and 3D-IC Designs

Parasitic Extraction for Advanced Node and 3D-IC Designs
by Alex Tan on 10-31-2018 at 7:00 am

Technology scaling has made positive impacts on device performance, while creating challenges on the interconnects and the fidelity of its manufactured shapes. The process dimension scaling has significantly increased metal and via resistance for advanced nodes 7nm and onward, as shown in figures 1a,1b. Similar to a fancy… Read More


Essential Analog IP for 7nm and 5nm at TSMC OIP

Essential Analog IP for 7nm and 5nm at TSMC OIP
by Tom Simon on 10-24-2018 at 7:00 am

When TSMC’s annual Open Innovation Platform Exposition takes place, you know it will be time to hear about designs starting on the most advanced nodes. This year we were hearing about 7nm and 5nm. These newer nodes present even more challenges than previous nodes due to many factors. Regardless of what kind of design you are undertaking… Read More


GLOBALFOUNDRIES Pivot Explained

GLOBALFOUNDRIES Pivot Explained
by Scotten Jones on 10-02-2018 at 7:00 am

GLOBALFOUNDRIES (GF) recently announced they were abandoning 7nm and focusing on “differentiated” foundry offerings in a move our own Dan Nenni described as a “pivot”, a description GF appears to have embraced. Last week GF held their annual Technology Conference and we got to hear more about the pivot from new CEO Tom Caulfield… Read More


Make Versus Buy for Semiconductor IP used in PVT Monitoring

Make Versus Buy for Semiconductor IP used in PVT Monitoring
by Daniel Payne on 10-01-2018 at 12:00 pm

As an IC designer I absolutely loved embarking on a new design project, starting with a fresh, blank slate, not having to use any legacy blocks. In the early 1980’s we really hadn’t given much thought to re-using semiconductor IP because each new project typically came with a new process node, so there was no IP even ready… Read More


Custom SoC Platform Solutions for AI Applications at the TSMC OIP

Custom SoC Platform Solutions for AI Applications at the TSMC OIP
by Daniel Nenni on 09-27-2018 at 12:00 pm

The TSMC OIP event is next week and again it is packed with a wide range of technical presentations from TSMC, top semiconductor, EDA, and IP companies, plus long time TSMC partner and ASIC provider Open-Silicon, a SiFive Company. You can see the full agenda HERE.

AI is revolutionizing and transforming virtually every industry… Read More