The Evolution of the Extension Implant Part III

The Evolution of the Extension Implant Part III
by Daniel Nenni on 05-06-2019 at 7:00 am

The problem of traditional FinFET Extension Implant doping concerns the awkward 3-dimensional structure of the fin. Because the Extension Implant defines the conductive electrical pathway between the Source/Drains and the undoped channel portion of the fin, it is essential that the fin be uniformly doped all three of its surfaces… Read More


The Evolution of the Extension Implant Part II

The Evolution of the Extension Implant Part II
by Daniel Nenni on 05-02-2019 at 7:00 am

The use of hard masks instead of photoresist for the Extension implant is an effective way to optimize the amount of dopant that is retained along the fin sidewalls for those fins that border along photoresist edges (as discussed in Part 1 of this series).

However, hard masks do nothing to address the dominant problem driving steeper… Read More


The Evolution of the Extension Implant Part I

The Evolution of the Extension Implant Part I
by Daniel Nenni on 04-29-2019 at 7:00 am

The 3D character of FinFET transistor structures pose a range of unique fabrication problems that can make it challenging to get these devices to yield. This is especially true for the all-important Extension implant that is put in place just prior to the nitride spacer formation.

The Extension implant is a central component of… Read More


TSMC Q1 2019 Earnings Call Discussion!

TSMC Q1 2019 Earnings Call Discussion!
by Daniel Nenni on 04-19-2019 at 7:00 am

It’s no coincidence that the TSMC Symposium is right after the Q1 earnings call. This will allow TSMC to talk more freely and they certainly will, my opinion. It is a very interesting time in the semiconductor industry and TSMC, being the bellwether, can tell us what will happen the rest of the year and give us some 2020 insights.… Read More


Samsung 5nm and TSMC 6nm Update

Samsung 5nm and TSMC 6nm Update
by Daniel Nenni on 04-16-2019 at 12:00 pm

TSMC and Samsung continue to raise the competitive bar for FinFET foundry market share with dueling announcements this week. As I mentioned previously in the blog Semiconductor Foundry Landscape Update 2019, FinFETs are the market to watch with the coming onslaught of 5G and AI chips on the edge, in the cloud, and in our autonomous… Read More


Webinar: Addressing Multiphysics Challenges in 7nm FinFET Designs

Webinar: Addressing Multiphysics Challenges in 7nm FinFET Designs
by Daniel Nenni on 03-12-2019 at 7:00 am

EDA is big on growth through acquisition, being acquired many times throughout my career I know this by experience. In fact, we have a wiki that tracks EDA Mergers and Acquisitions and it is the most viewed wiki on SemiWiki.com with 101,918 views thus far.

In March of 2017 ANSYS acquired CLK Design Automation which did timing variation… Read More


Accelerating 5G Innovation and Reliability Through Simulation and Advanced FinFET Design

Accelerating 5G Innovation and Reliability Through Simulation and Advanced FinFET Design
by Camille Kokozaki on 02-14-2019 at 7:00 am

In an ANSYS seminar held at DesignCon 2019, Dr. Larry Williams, ANSYS Director of Technology, outlined how 5G design innovation can be accelerated through simulation. He posited that 5G will become a general-purpose technology that affects an entire economy, drastically alter societies and unleash a cascade of complementary… Read More


Parasitic Extraction for Advanced Node and 3D-IC Designs

Parasitic Extraction for Advanced Node and 3D-IC Designs
by Alex Tan on 10-31-2018 at 7:00 am

Technology scaling has made positive impacts on device performance, while creating challenges on the interconnects and the fidelity of its manufactured shapes. The process dimension scaling has significantly increased metal and via resistance for advanced nodes 7nm and onward, as shown in figures 1a,1b. Similar to a fancy… Read More


Essential Analog IP for 7nm and 5nm at TSMC OIP

Essential Analog IP for 7nm and 5nm at TSMC OIP
by Tom Simon on 10-24-2018 at 7:00 am

When TSMC’s annual Open Innovation Platform Exposition takes place, you know it will be time to hear about designs starting on the most advanced nodes. This year we were hearing about 7nm and 5nm. These newer nodes present even more challenges than previous nodes due to many factors. Regardless of what kind of design you are undertaking… Read More