AMD Zen and the Art of Microprocessor Maintenance

AMD Zen and the Art of Microprocessor Maintenance
by Don Dingee on 08-31-2016 at 4:00 pm

AMD is a fantastic company with highly talented people, but for some reason just hasn’t managed to put a winning streak of microprocessor architectures back-to-back. It’s frustrating to watch: they ride like mad to catch up to or even pull slightly ahead of Intel, then fall back in the pack when they have to make an extended pit stop,… Read More


What is Inside the iPhone 7?

What is Inside the iPhone 7?
by Daniel Nenni on 08-20-2016 at 7:00 am

TSMC is the bellwether for not only the foundry business, since they are the dominant player, but also the semiconductor industry as a whole. You could also argue that TSMC is a sneak peek into the world economy since they build capacity based on their customer’s forecasts and the world now revolves around semiconductors.

The other… Read More


If an Intel 10nm transistor fell in the ARM forest

If an Intel 10nm transistor fell in the ARM forest
by Don Dingee on 08-18-2016 at 4:00 pm

Intel’s news at IDF this week about partnering with ARM for foundry services on 10nm set off some wild speculation. It’s not a surprise that ARM would enable Intel – they’ve worked together before, ARM is an equal opportunity ecosystem partner, and ARM has publicly announced 10nm cores taped out at TSMC.… Read More


One transistor for the future of mmWave?

One transistor for the future of mmWave?
by Don Dingee on 08-03-2016 at 4:00 pm

We’ve heard recently from several sources that millimeter wave radios, once the exclusive realm of defense and satellite use, are now finding homes in applications such as automotive radar and 5G networks. Therein lies a significant opportunity for digital design: moving frequency conversion and filtering from the analog … Read More


IMEC-Horizontal Nanowires for 5nm at the VLSI Technology Symposium

IMEC-Horizontal Nanowires for 5nm at the VLSI Technology Symposium
by Scotten Jones on 07-21-2016 at 12:00 pm

At the VLSI Technology Symposium, IMEC presented a paper entitled “Gate-All-Around MOSFETs based on Vertically Stacked Horizontal Si Nanowires in a Replacement Metal Gate Process on Bulk Silicon Wafers”. I have wanted to blog about this paper since the symposium was held but also wanted to tie it in with an interview… Read More


A Brief History of Platform Design Automation

A Brief History of Platform Design Automation
by Daniel Payne on 07-01-2016 at 12:00 pm

Two weeks ago I spoke on the phone with Albert Li, Founder and CEO of Platform DA about his EDA company. Prior to founding Platform DA in Beijing, Li worked at Accelicon which was acquired by Agilent in December 2011. Mr. Li graduated from Tsinghua University and Vanderbilt University, both in Electrical Engineering, and has written… Read More


IMEC Technology Forum (ITF) – Secrets of Semiconductor Scaling

IMEC Technology Forum (ITF) – Secrets of Semiconductor Scaling
by Scotten Jones on 06-07-2016 at 4:00 pm

IMEC is a technology research center located in Belgium that is one of the premier semiconductor research centers in the world today. The IMEC Technology Forum (ITF) is a two-day event attended by approximately 1,000 people to showcase the work done by IMEC and their partners.… Read More


IMEC Technology Forum (ITF) – Moving the Electronics Industry Forward

IMEC Technology Forum (ITF) – Moving the Electronics Industry Forward
by Scotten Jones on 06-02-2016 at 4:00 pm

IMEC is a technology research center located in Belgium that is one of the premier semiconductor research centers in the world today. The IMEC Technology Forum (ITF) is a two-day event attended by approximately 1,000 people to showcase the work done by IMEC and their partners.

Gary Patton is the Chief Technical Officer and Senior… Read More


How TSMC Tackles Variation at Advanced Nodes

How TSMC Tackles Variation at Advanced Nodes
by Pawan Fangaria on 05-27-2016 at 12:00 pm

The design community is always hungry for high-performance, low-power, and low-cost devices. There is emergence of FinFET and FDSOI technologies at ultra-low process nodes to provide high-performance and low-power requirements at lower die-size. However, these advanced process nodes are prone to new sources of variation.… Read More