As any semiconductor process advances to the next generation or “node”, a sticky point is how to achieve the required higher resolution. As noted in another article [1], multipatterning (the required use of repeated patterning steps for a particular feature) has been practiced already for many years, and many have… Read More
EUV lithography is widely perceived to be the obvious choice to replace DUV lithography due to the shorter wavelength(s) used. However, there’s a devil in the details, or a catch if you will.
Electrons have the last word
The resist exposure is completed by the release of electrons following the absorption of the EUV photon.… Read More
Extreme ultraviolet (EUV) lithography targets sub-20 nm resolution using a wavelength range of ~13.3-13.7 nm (with some light including DUV outside this band as well) and a reflective ring-field optics system. ASML has been refining the EUV tool platform, starting with the NXE:3300B, the very first platform with a numerical
The current leading edge of advanced lithography nodes (e.g., “7nm” or “1Z nm”) features pitches (center-center distances between lines) in the range of 30-40 nm. Whether EUV (13.5 nm wavelength) or ArF (193 nm wavelength) lithography is used, one thing for certain is that the minimum imaged pitch … Read More
Corona Fab Impact –
lower production/raise prices
Chip production supply chain may break
It could temporarily fix memory oversupply
Could it risk the fall roll out of next Iphone
The ” Two week tango” – Waiting games at fabs
When a highly specialized piece of semiconductor equipment misbehaves to the… Read More
Back in April, 2019, TSMC announced that they were introducing their 5 nm technology in risk production and now at IEDM 2019 they brought forth a detailed description of the process which has passed 1000 hour HTOL and will be in high volume production in 1H 2020. This 5nm technology is a full node scaling from 7nm using smart scaling… Read More
Our friends at Threshold Systems have a new class that may be of interest to you. It’s an updated version of the Advanced CMOS Technology class held last May. As part of the previous class we did a five part series on The Evolution of the Extension Implant which you can see on the Threshold Systems SemiWiki landing page HERE. And… Read More
Strong beat in Sept results and Dec Guide
KLAC reported revenue of $1.41B and EPS of $2.48 handily beating street estimates of $1.5B and $2.20 in EPS. More importantly the company guided December to be revenues… Read More
ASML in line QTR with big Orders
Near term slippage w long term upside
Logic is strong but memory recovery unknown
EUV is finally a reality/commercialized
In line quarter- supplier slippage expected in Q4
Results were revenues of Euro 3B and EPS of Euro 1.49, more or less in line with earnings estimate if a tad bit light in revenue. … Read More
Advanced IC packaging, such as fan-out WLP (Wafer Level Packaging) and 2.5D TSV (Through Silicon Via) will drive the packaging equipment market, particularly lithography. This will help specific equipment manufacturers in 2019, since the WFE (Wafer Front End) market will drop 17%. But the Back-End lithography market, led … Read More
