EUV Will Never Happen

EUV Will Never Happen
by Paul McLellan on 05-23-2014 at 9:21 pm

ASML SMIC TSMC EUV DUV

I had lunch today with a guy who has to remain nameless. But he is on the edge of the semiconductor lithography thing. He told me EUV will never happen. Of course lots of people have said that. Me for one. But he said everyone knows it. The investment community, the foundries, everyone. Intel put money into ASML in the hopes that it would… Read More


EUV Slips a Year Per Year…Or More

EUV Slips a Year Per Year…Or More
by Paul McLellan on 04-19-2014 at 1:54 am

I was at EDPS in Monterey the last couple of days. It is one of the most interesting conferences to attend. Go next year since you already missed it this year. It is not big but the quality of the content is high. Historically the dinner in the middle is in the Monterey Yacht Club and there is a keynote speech. A few years ago it was me but this… Read More


450mm Delayed and Other SPIE News

450mm Delayed and Other SPIE News
by Scotten Jones on 03-04-2014 at 11:00 pm

Last week I attended the SPIE Advanced Technology Conference. There were a lot of interesting papers and as is always the case at these conferences, there was a lot of interesting things to learn from talking to other attendees on the conference floor.

The first interesting information from the conference floor was that 450mm is… Read More


The State of 450mm Wafers. And Intel Gossip

The State of 450mm Wafers. And Intel Gossip
by Paul McLellan on 01-14-2014 at 11:55 pm

Paul Farrar, the General Manager of the Global 450mm Consortium (G450C) presented at the SEMI ISS conference today. What is G450C, it is a public-private consortium to develop a cost-effective 450mm wafer fabrication infrastructure, develop equipment prototypes and coordinate the industry move to 450mm. It is located in Albany… Read More


Technology Challenges: Intel, IBM, Xilinx, GlobalFoundries, IMEC

Technology Challenges: Intel, IBM, Xilinx, GlobalFoundries, IMEC
by Paul McLellan on 01-14-2014 at 7:00 pm

I spent the day at the SEMI Industry Strategy Symposium in Half Moon Bay. The early part of the day was devoted to technology challenges. Obviously everyone did not say exactly the same things, and had a little bit of a different spin depending on what business they are in. But there was a lot of commonality between Intel, IBM, Xilinx… Read More


Lithography: Future Technologies

Lithography: Future Technologies
by Paul McLellan on 11-27-2013 at 12:28 pm

The first part of Lars Liebmann’s ICCAD keynote about lithography was on the changes in lithography that have to us to where we are today. In some ways it was an explanation of why we have the odd design rules, double patterning etc that we have in 20nm and 16nm processes. The second part of his talk was a look forward to how we might… Read More


Semicon: Multiple Patterning vs EUV, round #2

Semicon: Multiple Patterning vs EUV, round #2
by Paul McLellan on 07-24-2013 at 9:00 pm

Round #1 was here.

In the EUV corner were Stefan Wurm of Sematech (working on mask issues mostly) and Skip Miller of ASML who are the only company making EUV steppers (and light sources, they acquired Cymer).

You may know that the biggest issue in EUV is getting the source brightness to have high enough energy that an EUV stepper has … Read More


Semicon: Multiple Patterning vs EUV, round #1

Semicon: Multiple Patterning vs EUV, round #1
by Paul McLellan on 07-21-2013 at 9:01 pm

If you want to know the state of play in lithography, there is no better place than the special session on lithography at Semicon West. This year was no exception. The session was given the punchy title Still a tale of 2 paths: multi-patterning lithography at 20nm and below: EUVL source and infrastructure progress.

In the blue corner… Read More


SEMICON West: My Top Picks

SEMICON West: My Top Picks
by Paul McLellan on 06-20-2013 at 11:21 am

I will be at Semicon West from 9th to 11th July in Moscone, San Francisco. Of course there are lots of interesting sessions but here are two that I think are especially important to get a good impression of the way things are going in the future from experts. The two most interesting questions about the future are what comes after 14nm,… Read More


What does 3D IC, FinFETs, and EUV have in common?

What does 3D IC, FinFETs, and EUV have in common?
by Daniel Nenni on 06-19-2013 at 6:00 pm


They are three of the top trending terms on SemiWiki and three of the hot topics at this year’s Semicon West:

In its 43rd year, SEMICON West is the flagship annual event for the global microelectronics industry. It is the premier event for the display of new products and technologies for microelectronics design and manufacturing,Read More