Webinar: Exploring the Advancement of Chiplet Technology and the Ecosystem

Webinar: Exploring the Advancement of Chiplet Technology and the Ecosystem
by Admin on 03-25-2024 at 1:24 pm

Semiconductor companies are making transistors smaller and cramming more into chips to meet the demands of today’s high-tech industries and applications. In fact, in a recent article from the Financial Times, technology industry consultants McKinsey forecast that semiconductors will become a trillion-dollar industryRead More


TSMC 2023 Taiwan OIP Ecosystem Forum

TSMC 2023 Taiwan OIP Ecosystem Forum
by Admin on 09-15-2023 at 12:13 pm

Learn About:

  • Emerging advanced node design challenges and corresponding design flows and methodologies for N2, N3/N3E/N3P/N3AE, N4/N4P, N5/N5A, N6/N6e/N6RF/N7, N12e, and N22
  • Latest updates on TSMC 3DFabric™ chip stacking and advanced packaging processes, InFO, CoWoS®, and SoIC, 3DFabric Alliance, and 3Dblox™ standard,
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TSMC 2023 Europe OIP Ecosystem Forum

TSMC 2023 Europe OIP Ecosystem Forum
by Admin on 09-15-2023 at 12:11 pm

Learn About:

  • Emerging advanced node design challenges and corresponding design flows and methodologies for N2, N3/N3E/N3P/N3AE, N4/N4P, N5/N5A, N6/N6e/N6RF/N7, N12e, and N22
  • Latest updates on TSMC 3DFabric™ chip stacking and advanced packaging processes, InFO, CoWoS®, and SoIC, 3DFabric Alliance, and 3Dblox™ standard,
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Webinar: Open Silicon Photonics 3D-IC Ecosystem for Computing Applications

Webinar: Open Silicon Photonics 3D-IC Ecosystem for Computing Applications
by Admin on 05-01-2023 at 1:46 pm

Hear researchers from HP Enterprise discuss methodology specifics and design details for a silicon photonics device utilizing 3D-IC technology.

TIME:
MAY 16, 2023
11 AM EDT / 5 PM CEST

Venue:
Virtual

About this Webinar

We’ll highlight a collaborative project with HPE where Ansys HFSS and Ansys Lumerical INTERCONNECT were used

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