An AI Accelerator Ecosystem For High-Level Synthesis

An AI Accelerator Ecosystem For High-Level Synthesis
by Bernard Murphy on 07-01-2019 at 10:00 am

AI accelerators as engines for object or speech recognition (among many possibilities), are becoming increasingly popular for inference in mobile and power-constrained applications. Today much of this inferencing runs largely in software on CPUs or GPUs thanks to the sheer size of the smartphone market, but that will shift… Read More


10 Predictions for the Future of IoT

10 Predictions for the Future of IoT
by Ahmed Banafa on 04-24-2016 at 7:00 am

A Google search for “Internet of Things” term reveals over 280,000,000 results, thanks to the media making the connection between the smart home, wearable devices, and the connected automobile, IoT has begun to become part of the popular parlance. But that’s not the complete picture, according to Gartner’s… Read More


For high-volume manufacturing at 10 nm and below: technology and friendship

For high-volume manufacturing at 10 nm and below: technology and friendship
by Beth Martin on 09-03-2015 at 4:00 pm

The technology for 10 nm is settled, but what about 7 nm and 5 nm? Those nodes will happen with silicon-based CMOS and 193nm immersion lithography, but exactly how is still being worked out. Right now, though, the focus is on getting 10 nm chips into high-volume production. TSMC and Intel both claim to be on track for high-volume manufacturing… Read More


GlobalFoundries 22nm FD-SOI: What Happens When

GlobalFoundries 22nm FD-SOI: What Happens When
by Paul McLellan on 07-17-2015 at 7:00 am

Earlier in the week I wrote about GlobalFoundries announcement of 22nm FD-SOI. At SEMICON West there were three events that filled in some more details. First, on Tuesday, a lunch presentation given by SOITEC who make the wafer blanks that FD-SOI requires. Then on Wednesday I sat down for an hour with Gary Patton and Subi Kengeri … Read More


TSMC Open Innovation Platform Forum, October 1st

TSMC Open Innovation Platform Forum, October 1st
by Paul McLellan on 09-28-2013 at 5:00 am

One of TSMC’s two big Silicon Valley events each year is the Open Innovation Platform (OIP) Forum. This year it is on Tuesday October 1st. It is in the San Jose Convention Center and starts at 9am (registration opens at 8am). Pre-registration to attend is now open here or click on the image to the right.

From 9.10 to 9.40 is the … Read More


Notes from Common Platform: Collaborate or Die

Notes from Common Platform: Collaborate or Die
by Beth Martin on 02-07-2013 at 2:16 pm

FinFETs are hot, carbon nanotubes are cool, and collaboration is the key to continued semiconductor scaling. These were the main messages at the 2013 Common Platform Technology Forum in Santa Clara.

The collaboration message ran through most presenations, like the afternoon talk by Subi Kengeri of GLOBALFOUNDRIES and Joe Sawicki… Read More


What did CES 2013 mean for #SemiEDA?

What did CES 2013 mean for #SemiEDA?
by Don Dingee on 01-18-2013 at 4:55 pm

CES is the preeminent gadget show, and in the LVCC South Hall a wave has been building for some time. It’s now the place where chipsets are introduced, and this year saw a wide range of introductions from Atmel, Bosch, Broadcom, Intel (OK, they’re still in Central Hall), InvenSense, Marvell, NVIDIA, Qualcomm, Samsung, ST-Ericsson,… Read More


Powering the Platforms: ARM’s 2012 Approach

Powering the Platforms: ARM’s 2012 Approach
by Don Dingee on 02-08-2012 at 4:30 pm

A client turned me on to a great new book, “The Age of the Platform” by Phil Simon. It’s about how Amazon, Apple, Facebook, and Google have radically transformed the landscape. For me, it’s not just social networking – it’s social computing, changing how things are designed.

I’m borrowing this right from Phil… Read More