Where has the ASIC Business Gone?

Where has the ASIC Business Gone?
by Daniel Nenni on 11-25-2019 at 10:00 am

As the traditional ASIC business disappears before our eyes with the recent divestitures and acquisitions, I have been asking questions amongst the fabless semiconductor ecosystem and am getting few answers.

Who or what is going to step in to enable start-ups and new to silicon systems companies with application specific chips?Read More


Is the ASIC Business Dead?

Is the ASIC Business Dead?
by Daniel Nenni on 11-11-2019 at 10:00 am

We covered the ASIC business in Chapter 2 of our book “Fabless: The Transformation of the Semiconductor Industry” using VLSI Technology and eSilicon as shining examples. Neither of which now exist. The ASIC business model was a critical steppingstone in the transformation of the semiconductor industry. Many systems companies… Read More


WEBINAR: Which ASIC Manufacturing Method is Right for You?

WEBINAR: Which ASIC Manufacturing Method is Right for You?
by Daniel Nenni on 11-11-2019 at 6:00 am

Minimizing ASIC production costs is the goal of every company. The problem is that this requires extensive knowledge. You must understand the technical intricacies and the financial implications of multiple activities like wafer production, packaging and QA activities such as electrical tests.

Generally, the more your company… Read More


eFPGA – What a great idea! But I have no idea how I’d use it!

eFPGA – What a great idea! But I have no idea how I’d use it!
by Daniel Nenni on 08-05-2019 at 10:00 am

eFPGA stands for embedded Field Programmable Grid Arrays.  An eFPGA is a programmable device like an FPGA but rather than being sold as a completed chip it is licensed as a semiconductor IP block. ASIC designers can license this IP and embed it into their own chips adding the flexibility of programmability at an incremental cost.… Read More


Selecting an ASIC Package

Selecting an ASIC Package
by Daniel Nenni on 05-29-2019 at 10:00 am

Semiconductor chip package technologies have evolved throughout the years to the point where hundreds of package types are available today. 

Most applications will require the more general, single-element packaging for integrated circuits and the other components such as resistors, capacitators, antenna etc. However,… Read More


Top 3 Reasons Why Design IP Is Business Friendly

Top 3 Reasons Why Design IP Is Business Friendly
by Eric Esteve on 02-19-2019 at 7:00 am

The Design IP market is doing well, growing at higher CAGR that the semiconductor market it is serving, in fact 10% higher for 2007-2017! You may wonder why this IP market is so business friendly? I will try to answer and propose the top 3 reasons explaining this behavior. To name it: IP business is recurrent, external IP sourcing isRead More


AI at the Edge

AI at the Edge
by Tom Dillinger on 12-20-2018 at 7:00 am

Frequent Semiwiki readers are well aware of the industry momentum behind machine learning applications. New opportunities are emerging at a rapid pace. High-level programming language semantics and compilers to capture and simulate neural network models have been developed to enhance developer productivity (link). Researchers… Read More


Home Automation IoT Company Cuts ASIC Testing Costs

Home Automation IoT Company Cuts ASIC Testing Costs
by Daniel Nenni on 11-06-2018 at 11:00 am

Customer Case Study
digitalSTROM develops smart home automation solutions providing users with superior comfort and a whole new style of living. Based on proprietary ASIC and software, digitalSTROM’s solutions connect electrical household appliances through existing power lines and enable an intelligent home via light… Read More


Webinar: ASIC and FPGA Functional Verification Study

Webinar: ASIC and FPGA Functional Verification Study
by Alex Tan on 10-23-2018 at 12:00 pm

ASIC or FPGA? Each design style has earned designers’ votes depending on the level of urgency, application complexity and funding of their assigned projects. While it is feasible to transition from ASIC to FPGA design or vice versa, such a move is usually done across project refresh instead of midcourse.

Both Xilinx and … Read More


Custom SoC Platform Solutions for AI Applications at the TSMC OIP

Custom SoC Platform Solutions for AI Applications at the TSMC OIP
by Daniel Nenni on 09-27-2018 at 12:00 pm

The TSMC OIP event is next week and again it is packed with a wide range of technical presentations from TSMC, top semiconductor, EDA, and IP companies, plus long time TSMC partner and ASIC provider Open-Silicon, a SiFive Company. You can see the full agenda HERE.

AI is revolutionizing and transforming virtually every industry… Read More