The Packaging PDK Is the Missing Layer for Co-Packaged Optics

The Packaging PDK Is the Missing Layer for Co-Packaged Optics
by Moh Kolb on 07-07-2026 at 10:00 am

PKG PDK MISSION CPO JUne26

From Photonic Device Design to Electro-Optical Realization

Co-packaged optics will not scale through photonic device performance alone.

As AI infrastructure pushes bandwidth, power, latency, and reach to new limits, optics is moving closer to the compute engine. The industry is no longer asking only whether a photonic device… Read More


Alchip Accelerates on AI ASIC Demand

Alchip Accelerates on AI ASIC Demand
by Daniel Nenni on 06-04-2026 at 8:00 am

Alchip Accelerates on AI ASIC Demand

Alchip Technologies reported improved financial results for the first quarter, reflecting continued momentum in advanced artificial intelligence (AI), high-performance computing (HPC), and custom ASIC demand. The company cited stronger customer engagement in leading-edge semiconductor designs and accelerating tape-out… Read More


CEO Interview with Geoffrey Rodgers of Chameleon Semiconductor

CEO Interview with Geoffrey Rodgers of Chameleon Semiconductor
by Daniel Nenni on 05-03-2026 at 2:00 pm

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Geoffrey Rodgers spent most of his career at the intersection of semiconductor technology and go-to-market execution, with a focus on scaling businesses and bringing complex solutions to market. He previously led the Analog Go-To-Market motion at Synopsys following the acquisition of Analog Design Automation and held leadership… Read More


Alchip’s Leadership in ASIC Innovation: Advancing Toward 2nm Semiconductor Technology

Alchip’s Leadership in ASIC Innovation: Advancing Toward 2nm Semiconductor Technology
by Daniel Nenni on 04-01-2026 at 10:00 am

Alchip’s Leadership in ASIC Innovation

Alchip Technologies has recently reported significant progress in the development of advanced 2nm  ASICs, positioning itself as a leader in next-generation semiconductor design for AI and HPC. The announcement highlights Alchip’s efforts to commercialize cutting-edge chip technologies and deliver highly customized … Read More


Silicon Insurance: Why eFPGA is Cheaper Than a Respin — and Why It Matters in the Intel 18A Era

Silicon Insurance: Why eFPGA is Cheaper Than a Respin — and Why It Matters in the Intel 18A Era
by Daniel Nenni on 03-26-2026 at 10:00 am

Silicon Insurance Why eFPGA is Cheaper Than a Respin

As semiconductor technology advances into increasingly complex and expensive process nodes, the economic and technical risks associated with ASIC design have grown dramatically. At advanced nodes such as Intel 18A, the cost of a single design error can escalate into tens of millions of dollars, compounded by months of delay.… Read More


Smarter ECOs: Inside Easy-Logic’s ASIC Optimization Engine

Smarter ECOs: Inside Easy-Logic’s ASIC Optimization Engine
by Daniel Nenni on 02-23-2026 at 8:00 am

Easy Logic EDA

Easy-Logic Technology Ltd. is a specialized Electronic Design Automation (EDA) company focused on solving one of the most complex and time-sensitive challenges in semiconductor design: functional Engineering Change Orders (ECOs). Founded in 2014 and headquartered in Hong Kong, the company has built its reputation around

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Podcast EP329: How Marvell is Addressing the Power Problem for Advanced Data Centers with Mark Kuemerle

Podcast EP329: How Marvell is Addressing the Power Problem for Advanced Data Centers with Mark Kuemerle
by Daniel Nenni on 01-30-2026 at 10:00 am

Daniel is joined by Mark Kuemerle, Vice President of Technology, Custom Cloud Solutions at Marvell. Mark is responsible for defining leading-edge ASIC offerings and architects system-level solutions. Before joining Marvell, Mark was a Fellow in Integrated Systems Architecture at GLOBALFOUNDRIES and has held multiple engineering… Read More


2026 Outlook with Howard Pakosh of Tekstart

2026 Outlook with Howard Pakosh of Tekstart
by Daniel Nenni on 01-07-2026 at 10:00 am

TekStart Cognitum Processor

Tell us a little bit about yourself and your company.
I founded TekStart Group in Ontario, Canada, in 1998 with a very clear objective: to help innovators turn breakthrough technology concepts into real, market-ready products. Over the past 25-plus years, we have worked across the full lifecycle of technology development, from… Read More


imec on the Benefits of ASICs and How to Seize Them

imec on the Benefits of ASICs and How to Seize Them
by Daniel Nenni on 12-14-2025 at 2:00 pm

imec ASIC White Paper

In an era where product differentiation increasingly depends on performance, power efficiency, and form factor, Application-Specific Integrated Circuits (ASICs) have become the ultimate competitive weapon for innovative companies. Unlike off-the-shelf processors, FPGAs, or even ASSPs, a full- or semi-custom ASIC is… Read More


Transforming Functional Verification through Intelligence

Transforming Functional Verification through Intelligence
by Daniel Payne on 12-01-2025 at 10:00 am

Wilson Research Group, project schedule min

SoC projects are running behind schedule as design and verification complexity has increased dramatically, so just adding more engineers, more tests and more compute aren’t the answer. The time is ripe to consider smarter ways to improve verification efficiency. The added complexity of multiple embedded processors, multiple… Read More