Flex Logix CEO Update 2020

Flex Logix CEO Update 2020
by Daniel Nenni on 05-08-2020 at 10:00 am

FlexLogic Color AI eFPGA

We started working with Felx Logix more than eight years ago and let me tell you it has been an interesting journey. Geoff Tate was our second CEO Interview so this is a follow up to that. The first one garnered more than 15,000 views and I expect more this time given the continued success of Flex Logix pioneering the eFPGA market, absolutely.… Read More


Webinar: Real-time In-Chip Monitoring to Boost multi-core AI, ML, DL Systems

Webinar: Real-time In-Chip Monitoring to Boost multi-core AI, ML, DL Systems
by Daniel Payne on 04-28-2020 at 10:00 am

hot spots

During the COVID-19 pandemic I’m using Zoom and attending more webinars to keep updated on semiconductor industry trends, and one huge trend is the importance of AI applied to SoCs. Using more cores to handle ML and DL makes sense, but then how do you keep the chips within their power and reliability limits while at the same … Read More


How does TensorFlow Lite on Tensilica HiFi DSP IP Sound?

How does TensorFlow Lite on Tensilica HiFi DSP IP Sound?
by Tom Simon on 04-22-2020 at 6:00 am

TensorFlow Lite Needed for Audio

In all the hubbub about AI/ML, it’s easy to see why visual ML gets more attention. It’s got appeal because of applications such as autonomous driving. Because of this it’s easy to overlook the importance of audio ML. I own a Tesla and putting it into autopilot is very cool, but even it has voice recognition built in as an important feature… Read More


There is No Easy Fix to AI Privacy Problems

There is No Easy Fix to AI Privacy Problems
by Matthew Rosenquist on 03-14-2020 at 8:00 am

There is No Easy Fix to AI Privacy Problems

Artificial intelligence – more specifically, the machine learning (ML) subset of AI – has a number of privacy problems.

Not only does ML require vast amounts of data for the training process, but the derived system is also provided with access to even greater volumes of data as part of the inference processing while in operation. … Read More


AI Interposer Power Modeling and HBM Power Noise Prediction Studies

AI Interposer Power Modeling and HBM Power Noise Prediction Studies
by Mike Gianfagna on 02-07-2020 at 6:00 am

Picture1

I attended a session on 2.5D silicon interposer analysis at DesignCon 2020. Like many presentations at this show, ecosystem collaboration was a focus. In this session, Jinsong Hu (principal application engineer at Cadence) and Yongsong He (senior staff engineer at Enflame Tech) presented approaches for interposer power modeling… Read More


Specialized Accelerators Needed for Cloud Based ML Training

Specialized Accelerators Needed for Cloud Based ML Training
by Tom Simon on 01-27-2020 at 10:00 am

AI Domain Specific Processor

The use of machine learning (ML) to solve complex problems that could not previously be addressed by traditional computing is expanding at an accelerating rate. Even with advances in neural network design, ML’s efficiency and accuracy are highly dependent on the training process. The methods used for training evolved from CPU… Read More


FPGAs in the 5G Era!

FPGAs in the 5G Era!
by Daniel Nenni on 01-27-2020 at 6:00 am

New Family of FPGAs Speedster7t

FPGAs, today and throughout the history of semiconductors, play a critical role in design enablement and electronic systems. Which is why we included the history of FPGAs in our book “Fabless: The Transformation of the Semiconductor Industry” and added a new chapter in the 2019 edition on the history of Achronix.

In a recent blog… Read More


IEDM 2019 – Applied Materials panel EUV Recap

IEDM 2019 – Applied Materials panel EUV Recap
by Scotten Jones on 12-23-2019 at 10:00 am

On Tuesday night of IEDM, Applied Materials held a panel discussion “The Future of Logic: EUV is Here, Now What?”. The panelists were: Regina Freed, managing director at Applied Materials as the moderator, Geoffrey Yeap, senior director of advanced technology at TSMC, Bala Haran, director of silicon process research at IBM, … Read More


Webinar – AI/ML SoC Memory and Interconnect IP Perspectives

Webinar – AI/ML SoC Memory and Interconnect IP Perspectives
by admin on 10-08-2019 at 10:00 am

For decades development work on Artificial Intelligence (AI) and Machine Learning (ML) was done on traditional CPUs and memory configurations. Now that we are in the “hockey stick” upturn in deployment of AI and ML, the search is on for the most efficient types of processing architectures. The result is a wave of development for… Read More


Synopsys and Infineon prepare for expanding AI use in automotive applications

Synopsys and Infineon prepare for expanding AI use in automotive applications
by Tom Simon on 10-03-2019 at 10:38 am

We all know that cars are using processors for many tasks, but it is easy to fail to comprehend just how many there are in a typical modern car. Browsing through the Infineon AURIX automotive processor application guide, you can start to see just how pervasive processors are. The AURIX processors are specifically designed for automotive… Read More