THE EVENT FOR HIGH PERFORMANCE COMPUTING, NETWORKING, STORAGE, DATA ANALYTICS AND AI/MACHINE LEARNING
CALLS ARE OPEN
ISC High Performance 2020 – June 21 – 25 – Messe Frankfurt, Germany – (Hall 3 and Forum)
Over 3,700 practitioners and users will come together in Frankfurt, Germany, from June 21 … Read More
Celebrating its 40th edition in 2020, the VLSI Symposia is the premier international conference on semiconductor technology and circuits. It offers a superb opportunity to interact and synergize on topics spanning the range from new neuromorphic devices, to beyond-the-state-of-the-art process technology to systems-on-chip
AICAS is an initiative of the IEEE Circuit and Systems Society (CASS) that brings the IEEE CASS together with the explosion of investment in artificial intelligence technology. AICAS aims to stand between ISSCC (solid state circuits) and machine learning conferences like NeurIPS, ICML, ICLR, as major reference
AI Hardware Summit Europe
Munich, Germany
Get the latest updates and technical specifications on InferX X1 Edge Inference Co-Processor
I attended a session on 2.5D silicon interposer analysis at DesignCon 2020. Like many presentations at this show, ecosystem collaboration was a focus. In this session, Jinsong Hu (principal application engineer at Cadence) and Yongsong He (senior staff engineer at Enflame Tech) presented approaches for interposer power modeling… Read More
The use of machine learning (ML) to solve complex problems that could not previously be addressed by traditional computing is expanding at an accelerating rate. Even with advances in neural network design, ML’s efficiency and accuracy are highly dependent on the training process. The methods used for training evolved from CPU… Read More
FPGAs, today and throughout the history of semiconductors, play a critical role in design enablement and electronic systems. Which is why we included the history of FPGAs in our book “Fabless: The Transformation of the Semiconductor Industry” and added a new chapter in the 2019 edition on the history of Achronix.
In a recent blog… Read More
On Tuesday night of IEDM, Applied Materials held a panel discussion “The Future of Logic: EUV is Here, Now What?”. The panelists were: Regina Freed, managing director at Applied Materials as the moderator, Geoffrey Yeap, senior director of advanced technology at TSMC, Bala Haran, director of silicon process research at IBM, … Read More
For decades development work on Artificial Intelligence (AI) and Machine Learning (ML) was done on traditional CPUs and memory configurations. Now that we are in the “hockey stick” upturn in deployment of AI and ML, the search is on for the most efficient types of processing architectures. The result is a wave of development for… Read More
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China Chip Equip Embargo just got real