Seminar: 2.5D/3D IC Packaging Verification

Seminar: 2.5D/3D IC Packaging Verification
by Daniel Payne on 11-06-2019 at 10:00 am

Mentor - A Siemens Business

Overview

Do you want to find out, hands-on, how many of the leading fabless semiconductor companies are verifying their complex 2.5/3D heterogeneous and homogeneous package assemblies?  Here is your chance to meet our technical staff and ask your questions.  Come and see why fabless semiconductor companies are adopting this… Read More


TSMC – Solid Q3 Beat Guide- 5G Driver – Big Capex Bump – Flawless Execution

TSMC – Solid Q3 Beat Guide- 5G Driver – Big Capex Bump – Flawless Execution
by Robert Maire on 10-19-2019 at 6:00 am

TSMC puts up solid QTR, Capex increase for 5NM and capacity increase, 5G/mobile remains driver- HPC good 7NM, 27% of revs- Very nice margins!

In line quarter-Good guide
TSMC reported revenues of $9.4B and EPS of $0.62 , more or less in line with expectations, perhaps a touch below ” whisper” expectations which had been… Read More


Seminar: 2.5D/3D IC Packaging Verification

Seminar: 2.5D/3D IC Packaging Verification
by Daniel Payne on 10-02-2019 at 10:00 am

Mentor - A Siemens Business

Overview

Do you want to find out, hands-on, how many of the leading fabless semiconductor companies are verifying their complex 2.5/3D heterogeneous and homogeneous package assemblies?  Here is your chance to meet our technical staff and ask your questions.  Come and see why fabless semiconductor companies are adopting this… Read More


The Coming Tsunami in Multi-chip Packaging

The Coming Tsunami in Multi-chip Packaging
by Tom Dillinger on 07-12-2019 at 6:00 am

The pace of Moore’s Law scaling for monolithic integrated circuit density has abated, due to a combination of fundamental technical challenges and financial considerations.  Yet, from an architectural perspective, the diversity in end product requirements continues to grow.  New heterogeneous processing units are being… Read More


ANSYS at DAC

ANSYS at DAC
by Bernard Murphy on 06-21-2018 at 7:00 am

I’m not going to be at DAC this year because I scheduled a fishing trip at the end of June, assuming the show would stay true to form as an early/mid-June event. Still, having to endure salmon and halibut fishing in Alaska rather than slogging around Moscone Center, I can’t pretend to be too disappointed; I’ll be thinking of you all 😎.… Read More


Thermal and Reliability in Automotive

Thermal and Reliability in Automotive
by Bernard Murphy on 06-12-2018 at 7:00 am

Thermal considerations have always been a concern in electronic systems but to a large extent these could be relatively well partitioned from other concerns. Within a die you analyze for mean and peak temperatures and mitigate with package heat-sinks, options to de-rate the clock, or a variety of other methods. At the system level… Read More


“Thinking Outside the Chip”

“Thinking Outside the Chip”
by Students@olemiss.edu on 04-13-2016 at 7:00 am

While pushing Moore’s Law’s boundaries in the world of 2D packaging, companies are starting to explore nontraditional approaches towards designing integrated circuit chips. 2D packaging is currently the most used method in designing chips in the industry, and while it leads in efficiency of power and performance, it lacks … Read More