Keysight webinar 800x100
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Intel Discusses Scaling Innovations at IEDM

Intel Discusses Scaling Innovations at IEDM
by Scotten Jones on 12-14-2021 at 6:00 am

Intel at IEDM Slides Page 1

Standard Cell Scaling

Complex logic designs are built up from standard cells, in order to continue to scale logic we need to continually shrink the size of standard cells.

Figure 1 illustrates the dimensions of a standard cell.

 Figure 1. Standard Cell Dimensions.

 From figure 1 we can see that shrinking standard cell sizes requires… Read More


Ansys CEO Ajei Gopal’s Keynote on 3D-IC at Samsung SAFE Forum

Ansys CEO Ajei Gopal’s Keynote on 3D-IC at Samsung SAFE Forum
by Tom Simon on 12-09-2021 at 10:00 am

Ajei Gopal talks about 3D IC

System on chip (SoC) based design has long been recognized as a powerful method to offer product differentiation through higher performance and expanded functionality. Yet, it comes with a number of limitations, such as high cost of development.  Also, SoCs are monolithic, which can inhibit rapid adaptation in the face of changing… Read More


Low Power High Performance PCIe SerDes IP for Samsung Silicon

Low Power High Performance PCIe SerDes IP for Samsung Silicon
by Tom Simon on 12-02-2021 at 10:00 am

SerDes IP for PCIe

No matter how impressive the specifications are for an SoC, the power performance and area of the finished design all depend on the IP selected for the IO blocks. In particular, most SOCs designed for consumer and enterprise applications rely heavily on PCI Express. Because PCIe analog IP is critical to design success, Samsung … Read More


US Supply Chain Data Request Elicits a Range of Responses, from Tight-Lipped to Uptight

US Supply Chain Data Request Elicits a Range of Responses, from Tight-Lipped to Uptight
by Craig Addison on 11-14-2021 at 6:00 am

China TSMC Supply chain woes 2021

TSMC drew the ire of Chinese state media last week after it complied with the US Department of Commerce request to submit supply chain data by the November 8 deadline.

The Chinese reports, which called it an act of “surrender” to US hegemony, were careful in laying blame on Taipei for caving in to Washington, rather than pointing fingers… Read More


Taiwan Semiconductor Outlook May 1988

Taiwan Semiconductor Outlook May 1988
by Daniel Nenni on 11-12-2021 at 6:00 am

James E. Dykes

This is an interesting piece of TSMC history. From 1987 to 1988 James E. Dykes served as the first President and Chief Executive Officer of Taiwan Semiconductor Manufacturing Company Ltd.

Taiwan Semiconductor Outlook
by James E. Dykes
President & Chief Executive Officer
Taiwan Semiconductor Manufacturing Company

Given… Read More


Update on TSMC’s 3D Fabric Technology

Update on TSMC’s 3D Fabric Technology
by Tom Dillinger on 11-03-2021 at 8:00 am

3D eTV testchip

TSMC recently held their 10th annual Open Innovation Platform (OIP) Ecosystem Forum.  An earlier article summarized the highlights of the keynote presentation from L.C. Lu, TSMC Fellow and Vice-President, Design and Technology Platform, entitled “TSMC and Its Ecosystem for Innovation” (link).

Overview of 3D Fabric

The TSMC… Read More


On-Chip Sensors Discussed at TSMC OIP

On-Chip Sensors Discussed at TSMC OIP
by Tom Simon on 11-02-2021 at 10:00 am

phase noise correlation

TSMC recently held their Open Innovation Platform (OIP) Ecosystem Forum event where many of their key partners presented on their latest projects and developments. This year one of their top IP provider partners, Analog Bits, gave two presentations. Analog building blocks have always been necessary as enabling technology … Read More


Design Technology Co-Optimization for TSMC’s N3HPC Process

Design Technology Co-Optimization for TSMC’s N3HPC Process
by Tom Dillinger on 11-02-2021 at 8:00 am

N3HPC performance comparison

TSMC recently held their 10th annual Open Innovation Platform (OIP) Ecosystem Forum.  An earlier article summarized the highlights of the keynote presentation from L.C. Lu, TSMC Fellow and Vice-President, Design and Technology Platform, entitled “TSMC and Its Ecosystem for Innovation” (link).

One of the topics that L.C. … Read More


Highlights of the TSMC Open Innovation Platform Ecosystem Forum

Highlights of the TSMC Open Innovation Platform Ecosystem Forum
by Tom Dillinger on 11-01-2021 at 8:00 am

N3 comparison

TSMC recently held their 10th annual Open Innovation Platform (OIP) Ecosystem forum.  The talks included a technology and design enablement update from TSMC, as well as specific presentations from OIP partners on the results of recent collaborations with TSMC.  This article summarizes the highlights of the TSMC keynote from… Read More


Semiconductor CapEx too strong?

Semiconductor CapEx too strong?
by Bill Jewell on 10-28-2021 at 1:00 pm

Oct 2021 capex2

Semiconductor capital expenditures (CapEx) are on track for strong growth in 2021. For many companies the increase should continue into 2022. TSMC, the dominant foundry company, expects to spend $30 billion in CapEx in 2021, a 74% increase from 2020. TSMC announced in March it plans to invest $100 billion over the next three years,… Read More