800x100 Efficient and Robust Memory Verification (2)

IC capacity utilization declined in 3Q 2011

IC capacity utilization declined in 3Q 2011
by Bill Jewell on 12-14-2011 at 11:54 pm

SICAS (Semiconductor Industry Capacity Statistics) has released its 3Q 2011 data, available through the SIA at: SICAS data . Beginning with 2Q 2011 the SICAS membership list no longer includes the Taiwanese companies Nanya Technology, Taiwan Semiconductor Manufacturing Company Ltd. (TSMC) or United Microelectronics Corporation… Read More


MEMS layout and automation

MEMS layout and automation
by Daniel Payne on 12-14-2011 at 11:12 am

At a webinar today I listened and learned about how a tool called L-Edit can be used to layout MEMS designs plus automate the task to be more productive. I can see how the history of IC layout editing is now being repeated with MEMS because in the earliest IC layout tools we could only do manual entry of polygons, then gradually we got cells… Read More


iLVS: Improving LVS Usability at Advanced Nodes

iLVS: Improving LVS Usability at Advanced Nodes
by glforte on 12-13-2011 at 4:54 pm

LVS Challenges at Advanced Nodes

Accurate, comprehensive device recognition, connectivity extraction, netlist generation and, ultimately, circuit comparison becomes more complex with each new process generation. As the number of layers and layer derivations increases the complexity of devices, especially Layout Dependent… Read More


IP-SoC 2011 Trip Report: IP again, new ASSP model, security, cache coherence and more

IP-SoC 2011 Trip Report: IP again, new ASSP model, security, cache coherence and more
by Eric Esteve on 12-13-2011 at 9:05 am

For the 20[SUP]th[/SUP] anniversary of IP-SoC, we had about ten presentations, most being really interesting; the conference has provided globally a very good level of information, speakers coming from various places like China, Belarus, The University of Aizu (Japan), University of Sao Paulo (Brazil), Silesian and Warsaw… Read More


Learning About MEMS

Learning About MEMS
by Daniel Payne on 12-12-2011 at 6:34 pm

My automobile has an air bag system that uses a MEMS (Micro Electro Mechanical System) sensor to tell it when to deploy, and I’ve read headlines talking about MEMS over the years so I decided it was about time to learn more by attending a Webinar on Wednesday, December 14th at 8AM Pacific Time.

The EDA company hosting the Webinar… Read More


View from the top: Ajoy Bose

View from the top: Ajoy Bose
by Paul McLellan on 12-12-2011 at 4:13 pm

I sat down yesterday with Dr. Ajoy Bose, CEO of Atrenta, to get his view of the future of EDA – looking through a high-power “spyglass” of sorts. I first met Ajoy when he was at Software & Technologies. I was then the VP of Engineering for Compass Design Automation and we were considering off-shoring some development. We eventually… Read More


Intel Proves Last Year’s Conventional Wisdom Wrong

Intel Proves Last Year’s Conventional Wisdom Wrong
by Ed McKernan on 12-11-2011 at 7:00 pm

Back in the 1990’s, Richard Branson, the legendary Entrepreneur and investor was asked how to become a millionaire, and he allegedly responded, “There’s really nothing to it. Start as a billionaire and then buy an airline.” I think the same principle can be applied to a large part of the Semiconductor… Read More


Synopsys Eats Magma: What Really Happened with Winners and Losers!

Synopsys Eats Magma: What Really Happened with Winners and Losers!
by Daniel Nenni on 12-10-2011 at 6:00 pm

Conspiracy theories abound! The inside story of the Synopsys (SNPS) acquisition of Magma (LAVA) brings us back to the 1990’s tech boom with shady investment bankers and pump/dump schemes. After scanning my memory banks and digging around Silicon Valley for skeletons with a backhoe here is what I found out:

The Commission… Read More


Atrenta’s users. Survey says….

Atrenta’s users. Survey says….
by Paul McLellan on 12-09-2011 at 7:32 pm

Atrenta did an online survey of their users. Of course Atrenta’s users are not necessarily completely representative of the whole marketplace so it is unclear how the results would generalize for the bigger picture, your mileage may vary. About half the people were design engineers, a quarter CAD engineers and the rest … Read More


Challenges in 3D-IC and 2½D Design

Challenges in 3D-IC and 2½D Design
by Paul McLellan on 12-09-2011 at 5:18 pm

3D IC design and what has come to be known as 2½D IC design, with active die on a silicon interposer, require new approaches to verification since the through silicon vias (TSVs) and the fact that several different semiconductor processes may be involved create a new set of design challenges

The power delivery network is a challenge… Read More