At NVIDIA’s recent GTC conference, a Cadence-NVIDIA joint session provided insights into how AI-powered innovation is reshaping the future of data center infrastructure. Led by Kourosh Nemati, Senior Data Center Cooling and Infrastructure Engineer from NVIDIA and Sherman Ikemoto, Sales Development Group Director from … Read More
Customized Foundation IP Enables the Next Generation of Automotive ComputeAs vehicles become increasingly software-defined, automotive semiconductor suppliers…Read More
Rambus Delivers Complete DDR5 Client Chipset for High-Speed CUDIMM and CSODIMM Memory ModulesThe rapid emergence of AI-enabled personal computers is…Read More
From Evidence to Authority: Bounded Gate Authority for Governed Semiconductor RealizationAdvanced semiconductor systems are no longer limited by…Read More
Synopsys and Samsung Foundry Extend AI-Driven Design Collaboration for Advanced 2nm and Multi-Die SystemsAt SAFE Forum 2026, Synopsys announced significant advancements…Read More
Broadcom Told the Truth. The Market Hasn’t Heard the Rest of It Yet.Hock Tan and his CFO Kirsten Spears logged…Read MoreCEO Interview with Dr. Michael Förtsch of Q.ANT
Dr. Michael Förtsch, CEO of Q.ANT, is a physicist and innovator driving advancements in photonic computing and sensing technologies. With a PhD from the Max Planck Institute for the Science of Light, he leads Q.ANT’s development of Thin-Film Lithium Niobate (TFLN) technology, delivering groundbreaking energy efficiency … Read More
Verifying Leakage Across Power Domains
IC designs need to operate reliably under varying conditions and avoid inefficiencies like leakage across power domains. But how do you verify that connections between IP blocks has been done properly? This is where reliability verification, Electrical Rule Checking (ERC) tools and dynamic simulations all come into play particularly… Read More
How Cadence is Building the Physical Infrastructure of the AI Era
At the 2025 NVIDIA GTC Conference, CEO Jensen Huang delivered a sweeping keynote that painted the future of computing in bold strokes: a world powered by AI factories, built on accelerated computing, and driven by agentic, embodied AI capable of interacting with the physical world. He introduced the concept of Physical AI—intelligence… Read More
TSMC’s Innovations in Physical Design for Semiconductor Scaling
In a 2017 ISPD presentation, TSMC Fellow LC Lu outlined critical challenges and innovations in physical design to sustain power, speed, and area scaling trends in semiconductors. As Moore’s Law faces economic hurdles, process-design co-optimization emerges as key to extending it. Lu emphasized application-optimized… Read More
Podcast EP284: Current Capabilities and Future Focus at Intel Foundry Services with Kevin O’Buckley
Dan is joined by Kevin O’Buckley, senior vice president and general manager of Foundry Services at Intel Corporation. In this role, he is responsible for driving continued growth for Intel Foundry and its differentiated systems foundry offerings, which go beyond traditional wafer fabrication to include packaging, chiplet… Read More
Andes RISC-V CON in Silicon Valley Overview
RISC-V conferences have been at full capacity and I expect this one will be well attended as well. Andes is the biggest name in RSIC-V. The most notable thing about RISC-V conferences is the content. Not only is the content deep, it is international from the top companies in the industry. It is hard to find a design win these days without… Read More
Achieving Seamless 1.6 Tbps Interoperability for High BW HPC AI/ML SoCs: A Technical Webinar with Samtec and Synopsys
HPC Bandwidth Explosion and 1.6T Ecosystem Interop Need
The exponential growth in data bandwidth requirements driven by HPC systems, AI, and ML applications has set the stage for an ever-increasing need for 1.6Tbps Ethernet. As data centers strive to manage vast data transfers with maximum efficiency, the urgency for interoperability… Read More
Predictive Load Handling: Solving a Quiet Bottleneck in Modern DSPs
When people talk about bottlenecks in digital signal processors (DSPs), they usually focus on compute throughput: how many MACs per second, how wide the vector unit is, how fast the clock runs. But ask any embedded AI engineer working on always-on voice, radar, or low-power vision—and they’ll tell you the truth: memory stalls … Read More
Executive Interview with Leo Linehan, President, Electronic Materials, Materion Corporation
Leo Linehan leads Materion’s Electronic Materials business segment, an important supplier to the global semiconductor market and an industry leader in the production of advanced chemicals, microelectronic packaging, precious and non-precious metals, and deposition, reclamation and refining services.
Prior to joining… Read More


Intel: Pushing EMIB Forward: Design Methodology Insights with Synopsys Tools