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Automating Formal Verification

Automating Formal Verification
by Daniel Payne on 01-30-2025 at 10:00 am

LUBIS on cloud min

Formal verification methods are being adopted at a fast pace as a complement to traditional verification methods like functional simulation for IP blocks in SoC designs. I had a video meeting with Max Birtel, co-founder of LUBIS EDA and learned more about their history, products and vision. This company started recently in 2020… Read More


2024 Retrospective. Innovation in Verification

2024 Retrospective. Innovation in Verification
by Bernard Murphy on 01-30-2025 at 6:00 am

Innovation New

As usual in January we start with a look back at the papers we reviewed last year. Paul Cunningham (GM, Verification at Cadence), Raúl Camposano (Silicon Catalyst, entrepreneur, former Synopsys CTO and lecturer at Stanford, EE292A) and I continue our series on research ideas. As always, feedback welcome.

The 2024 Picks

These … Read More


Full Spectrum Transient Noise: A must have sign-off analysis for silicon success

Full Spectrum Transient Noise: A must have sign-off analysis for silicon success
by Scott Guyton on 01-29-2025 at 10:00 am

Figure 1

Noise minimization is required for advanced analog and radiofrequency (RF) circuits. Unlike digital circuits, where noise is a second-order effect, system performance metrics such as signal-to-noise ratio (SNR), phase noise, timing jitter, and bit error rate (BER) are directly affected in analog and RF designs. Effective… Read More


PSS and UVM Work Together for System-Level Verification

PSS and UVM Work Together for System-Level Verification
by Bernard Murphy on 01-29-2025 at 6:00 am

System level testing min

In the early days of the PSS rollout, some verification engineers were suspicious. Just as they were beginning to get comfortable with UVM, here came yet another standard to add to their learning and complexity overhead. Then the fog started to clear; UVM is ideal for block-level testing whereas PSS is ideal for system level testing.… Read More


Will 50% of New High Performance Computing (HPC) Chip Designs be Multi-Die in 2025?

Will 50% of New High Performance Computing (HPC) Chip Designs be Multi-Die in 2025?
by Kalar Rajendiran on 01-28-2025 at 6:00 am

Synopsys Predictions for Multi Die Designs in 2025

Predictions in technology adoption often hinge on a delicate balance between technical feasibility and market dynamics. While business considerations play a pivotal role, the technical category reasons for the success or failure of a prediction are more tangible and often easier to identify—if scrutinized with care. However,… Read More


Heterogeneous 2D/3D Packaging Challenges

Heterogeneous 2D/3D Packaging Challenges
by Daniel Payne on 01-27-2025 at 10:00 am

Innovator3D IC flow min

A growing trend in system design is the use of multiple ICs mounted in advanced packages, especially in high-performance computing and AI. These modern packages now integrate multiple ICs, often with high-bandwidth memory (HBM), resulting in hundreds of thousands of connections that need proper verification. Traditional… Read More


Webinar: Achieve Full Flow and Resource Management Visibility to Optimize Cost and Sustainability with Innova

Webinar: Achieve Full Flow and Resource Management Visibility to Optimize Cost and Sustainability with Innova
by Mike Gianfagna on 01-27-2025 at 6:00 am

Webinar Achieve Full Flow and Resource Management Visibility to Optimize Cost and Sustainability with Innova

The lifecycle for complex chip design includes many factors. Traditional systems focus on design tasks, associated schedules and manufacturing logistics. While these are important aspects of the project there is a lot more that can be measured, predicted and tracked. Taking a more holistic view of the project opens new opportunities… Read More


Podcast EP271: A Tour of SiLC’s LiDAR Technology and Its Broad Impact with Mehdi Asghari

Podcast EP271: A Tour of SiLC’s LiDAR Technology and Its Broad Impact with Mehdi Asghari
by Daniel Nenni on 01-24-2025 at 10:00 am

Dan is joined by SiLC Technologies CEO Mehdi Asghari. Mehdi is one of the early pioneers of the silicon photonics industry with over 25 years of commercialization experience in this space. SiLC is his third Silicon Photonics start-up focusing on advanced imaging solutions. His previous startups, Kotura and Bookham, both enabled… Read More


Crosstalk, 2kAmp power delivery, PAM4, and LPDDR5 analysis at DesignCon

Crosstalk, 2kAmp power delivery, PAM4, and LPDDR5 analysis at DesignCon
by Don Dingee on 01-24-2025 at 8:00 am

Old way of crosstalk analysis

High-speed digital (HSD) designers have long tested the limits of realizable speed. GHz frequencies are now the norm, and multi-level signaling is pushing rates higher while the long-awaited transition to optical signaling and even higher rates looms ever closer. Power density is also climbing, and data-hungry applications… Read More


2025 Outlook with Dr Josep Montanyà of Nanusens

2025 Outlook with Dr Josep Montanyà of Nanusens
by Daniel Nenni on 01-24-2025 at 6:00 am

Josep 202408

Dr Josep Montanyà is a Co-founder leading the company, with +18 years of experience in MEMS, patents and the semiconductor industry. Founded Baolab Microsystems prior to Nanusens.

Tell us a little bit about your company.

 We have a patented technology that allows us to build chips with nano-mechanisms inside (called NEMS) using… Read More