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Wearables at Linley Mobile: Diverging views

Wearables at Linley Mobile: Diverging views
by Daniel Nenni on 05-08-2014 at 11:30 pm

The Linley Mobile Conference last week initiated a lot of discussion about emerging technologies and markets, especially wearables. Jessica Lipsky’s EE Times article captured some of the sentiments in her article, “Wearables Need Tailored SoCs.” But the conference covered a lot more ground than wearables, including mobile… Read More


Analog and Full Chip Simulation at Micron

Analog and Full Chip Simulation at Micron
by Daniel Payne on 05-08-2014 at 12:50 pm

IDM companies like Micronuse SPICE circuit simulators during the design phase in order to predict timing, currents and power on their custom IC chip designs at the transistor level. A senior memory design engineer at Micron named Raed Sabbahtalked today at a webinarabout how the embedded solutions group uses the FineSimcircuit… Read More


Get that Smartphone Chip out of my Wearable!

Get that Smartphone Chip out of my Wearable!
by Daniel Nenni on 05-08-2014 at 11:30 am

Last week, I had the pleasure to present at the Linley Group Mobile Conference. My presentation was part of the Wearable Device Session, which examined wearables from several different angles including software, sensor, processor, and IP.

As the smartphone market is maturing and the pace of innovation generally slowing, there… Read More


What Executives Say About IP Licensing

What Executives Say About IP Licensing
by Pawan Fangaria on 05-08-2014 at 7:00 am

In the fabless world of semiconductor design, IP components have become indispensable partners and have enabled the development of complex billion gate SoCs. IP business in general is exhibiting a very high growth rate since couple of years and it is going to increase; the same is being reflected by a growing number of IP vendors… Read More


180nm still a big deal

180nm still a big deal
by Don Dingee on 05-07-2014 at 3:00 pm

When I was reading the recent Daniel Payne article “Designing Change Into Semiconductor Techonomics” with commentary on a recent presentation from Aart de Geus of Synopsys, one chart jumped out at me: the most popular process node for new design starts today is 180nm.

Upon mentioning that to a few of my IoT counterparts, they quickly… Read More


Intel is Still Missing Mobile!

Intel is Still Missing Mobile!
by Daniel Nenni on 05-07-2014 at 9:00 am

Paul McLellan was on assignment in Hong Kong last week so I attended the Linley Mobile Conference and was not surprised Intel did not present. During the networking sessions I asked more than a dozen people why and the answers were pretty focused on “Intel still does not play well with others” and “Intel’s current mobile offerings… Read More


Processors For Internet of Things

Processors For Internet of Things
by Paul McLellan on 05-06-2014 at 10:58 pm

Tomorrow and Thursday this week is the Internet of Things (IoT) developers conference. It takes place at the Hyatt Regency in Santa Clara. There are 3 keynotes and 3 CTO viewpoints:

  • Driving Heterogeneous System Architectures Everywhere – Amit Rohatgi, Imagination Technologies
  • Solving the Networking Puzzle: From IOT
Read More

New Method for Metrology with sub-10 nm Lithrography

New Method for Metrology with sub-10 nm Lithrography
by Daniel Nenni on 05-06-2014 at 6:00 pm

NewPath Research will describe their new method for nanoscale carrier profiling in semiconductors on May 19[SUP]th[/SUP] at the Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) in Saratoga Springs, NY. This new method is intended to fill the gap that has been addressed in the Roadmaps for the semiconductor… Read More


The Matrix, your ultimate OPC

The Matrix, your ultimate OPC
by Beth Martin on 05-06-2014 at 12:47 pm

One of the many consequences of shrinking process nodes is that traditional OPC can no longer achieve good pattern fidelity with reasonable turn-around-time. But there is a solution; we made it ourselves and call it matrix OPC.

First, let’s explore the problems with traditional optical proximity correction (OPC) when applied… Read More


IC Power Noise Reliability for FinFET Designs

IC Power Noise Reliability for FinFET Designs
by Daniel Payne on 05-06-2014 at 9:07 am

Reliability for ICs is a big deal because the last thing that you want to do is ship a new part only to find out later in the field that there are failures not being caught by testing. I’ve already had two consumer products fail this year because of probable reliability issues: My MacBook Pro with 16GB of RAM started rebooting caused… Read More