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Sidense NVM Scores Qualification on GLOBALFOUNDRIES 28nm SLP and HPP

Sidense NVM Scores Qualification on GLOBALFOUNDRIES 28nm SLP and HPP
by Tom Simon on 04-12-2015 at 7:00 am

A tremendous number of chips being designed for today’s products require some sort of onboard data storage. The size of these needs range from a handful of bytes, for trim and calibration storage, to something much more substantial like boot code storage. In both of these examples the storage ideally should be nonvolatile, with… Read More


TSMC Unleashes Aggressive 28nm Strategy!

TSMC Unleashes Aggressive 28nm Strategy!
by Daniel Nenni on 04-11-2015 at 10:00 pm

The most interesting presentation at the jam-packed TSMC Symposium last week for me was “Advanced Technology Updates” by Dr. BJ Woo. Coincidentally, I met with BJ during my last visit to Fab 12. Much of what we discussed was about TSMC being more aggressive this year but I wasn’t able to really connect the dots until her presentation.… Read More


Xilinx at NAB: Any Media Over Any Network

Xilinx at NAB: Any Media Over Any Network
by Paul McLellan on 04-11-2015 at 7:00 am

The NAB (National Association of Broadcasters) show has just started, April 11-16th in Las Vegas. It covers a very broad range of topics:
As the premier trade association for broadcasters, NAB advances the interests of our members in federal government, industry and public affairs; improves the quality and profitability of Read More


Cu-Pillar in Advanced Logic Devices

Cu-Pillar in Advanced Logic Devices
by Arabinda Das on 04-10-2015 at 7:00 pm

In 2001, flipchip with solder bump was already a dominant technology and it was replacing wire bonding as the main interconnection choice for a growing number of devices. It was offering fine pitch interconnections for increased I/O counts. In the solder bump process, a bump is formed on the chip and on the package substrate and … Read More


From Medical and Wearables to Big Data, in 日本語/한국어/中文

From Medical and Wearables to Big Data, in 日本語/한국어/中文
by Paul McLellan on 04-10-2015 at 7:00 am

Whether it’s a tiny always-on medical device or a secure cloud network processing Big Data, the Internet of Things (IoT) is bringing new challenges to IC design. Almost by definition an IoT device contains a microcontroller of some sort along with some way of communicating. Unlike our smartphones where we are reasonably happy … Read More


ANSYS Enters the League of 10nm Designs with TSMC

ANSYS Enters the League of 10nm Designs with TSMC
by Pawan Fangaria on 04-09-2015 at 7:00 pm

The way we are seeing technology progression these days is unprecedented. It’s just about six months ago, I had written about the intense collaboration between ANSYSand TSMCon the 16nm FinFET based design flow and TSMC certifying ANSYS tools for TSMC 16nm FF+ technology and also conferring ANSYS with “Partner of the Year” award.… Read More


Starvision Pro: Lattice Semiconductor’s Experience

Starvision Pro: Lattice Semiconductor’s Experience
by Paul McLellan on 04-09-2015 at 7:00 am

During SNUG I took the opportunity to chat to Choon-Hoe Yeoh of Lattice Semiconductor about how they use Concept Engineering’s Starvision Pro product. He is the senior director of EDA tools and methodologies there.

Lattice Semiconductor is a manufacturer of low-power, small-footprint, low-cost programmable logic devices.… Read More


Archives from TI’s Baseband Glory – Part 1

Archives from TI’s Baseband Glory – Part 1
by Majeed Ahmad on 04-08-2015 at 7:30 pm

In 1992, nearly two years after Britain’s Acorn Computers joined hands with Apple and VLSI to create Advanced RISC Machines or ARM, the semiconductor upstart landed its first major licensing breakthrough. In retrospect, while Apple’s Newton handheld computer had played a key role in creating the ARM venture, Texas… Read More


New oscillator for low-power implantable transceivers

New oscillator for low-power implantable transceivers
by admin on 04-08-2015 at 10:00 am

Due to the limitations of implanting a device in the human body, the devices have limited power storage. Using CMOS technology, different circuits and systems design techniques have to be in place to achieve an energy efficient communication interface. This CMOS technology, created by Arash Moradi and Mohamad Sawan, helps to… Read More


FinFET vs FDSOI – Which is the Right One for Your Design?

FinFET vs FDSOI – Which is the Right One for Your Design?
by Daniel Nenni on 04-08-2015 at 4:00 am

As a professional conference goer I can see definite trends when it comes to topics and attendance. Thus far this year I have seen a double digit increase in attendance, which is great. The question is why? Why is the fabless semiconductor ecosystem leaving the safety of their cubicles and computer screens in droves to mingle amongst… Read More