It used to be that if you went to a processor conference, you could expect to spend hours listening to talks about pipelining, cache schemes and processor architecture. Well, I went to the Linley Processor Conference this week in Santa Clara and found the topics pretty compelling. Processors are in just about everything. It is easier… Read More
Exploring Cycuity’s Radix-ST: Revolutionizing Semiconductor SecurityCycuity’s Radix-ST represents a groundbreaking advancement in semiconductor…Read More
Smart Verification for Complex UCIe Multi-Die ArchitecturesBy Ujjwal Negi - Siemens EDA Multi-die architectures…Read More
PDF Solutions Adds Security and Scalability to Manufacturing and TestEveryone knows design complexity is exploding. What used…Read More
Revolutionizing Processor Design: Intel's Software Defined Super CoresIn the ever-evolving landscape of computing, Intel's patent…Read More
TSMC's 2024 Sustainability Report: Pioneering a Greener Semiconductor FutureTSMC, the world's most trusted semiconductor foundry, released…Read More
Five Areas at #53DAC That Require Your Contribution
The 53rd DAC (Design Automation Conference) is some 8 months away, however to make this conference and exhibit another success requires planning, people and awareness. That’s where you come in, because you can contribute your expertise in five different areas:
[LIST=1]
IMEC and Cadence Disclose 5nm Test Chip
Recently imec and Cadence disclosed that they had fabricated 5nm test chips. This afternoon Dan Nenni and I had a conference call with Praveen Raghavan, principal engineer at imec, and Vassilios Gerousis, distinguished engineer at Cadence to get more details on what the test chip is and what was learned.
First off Vassilios really… Read More
BATTERYGATE: Is Apple’s Samsung made iPhone 6S Core Rotten?
By this time, anyone with a pulse in the tech industry knows that Apple has dual sourced the A9 processor for the Iphone 6S, from both Samsung and TSMC. There are even apps to tell whether your 6S has a Samsung or TSMC part in it. People have run performance comparisons and concluded that the processing performance is the same, which … Read More
Cadence Outlines Automotive Solutions at TSMC OIP Event
I used to joke that my first car could survive a nuclear war. It was a 1971 Volvo sedan (142) that was EMP proof because it had absolutely no semiconductors in the ignition system, just points, condensers and a coil. If you go back to the Model T in 1915 you will see that the “on-board electronics” were not that different. However, today’s… Read More
UFS or NVMe in Smartphone? See Apple’s answer!
There should be a link between iPhone H/W architecture and the incredible success of the product? Let’s assume and claim that this architecture, based on the internally developed ARM based A9 application processor, is simply the best on the market today…
Apple has implemented SSD in MacBook based on NVM Express (NVMe) protocol.… Read More
Dinner with the Man who is Reshaping the Semiconductor Industry!
The recent mega acquisition of Broadcom Corp by Avago can be traced all the way back to Silicon Valley stalwart Hewlett Packard (founded in a two car Palo Alto garage in 1939). Even more interesting is the man behind the acquisition and how he got to where he is today.Avago began as the semiconductor products division of HP in 1961, … Read More
Coventor prepping MEMS for CMOS integration
About 11 months ago, I wrote a piece titled “Money for data and your MEMS for free.” In that, I took on the thinking that TSMC is just going to ride into town, fab trillions of IoT sensors, and they all will be 2.6 cents ten years from now. Good headline, but the technology and economics are not that simple. This may be the semiconductor … Read More
12 Reasons to Attend this Annual User Group Meeting for Transistor-level IC Designers
My first job out of college was transistor-level circuit design of DRAMs at Intel, so I’ve continued to be fascinated with both the craft and science of designing, optimizing, verifying and debugging custom ICs. Last October I traveled to Munich, Germany to attend a two day user group meeting for engineers using tools from… Read More
A FinFET BSIM-CMG model update from UC-Berkeley
Every designer relies upon an underlying “compact” device model for circuit simulations – these models are the lifeblood of the IC industry. Designers may not be aware that there is an organization that qualifies models – the Compact Model Coalition – which operates under the umbrella of the Si2 Consortium: http://www.si2.org/cmc_index.php… Read More
MediaTek Develops Chip Utilizing TSMC’s 2nm Process, Achieving Milestones in Performance and Power Efficiency