One of the goals of the recent RISC-V Summit was to demonstrate that the RISC-V movement is real – major programs by large organizations committing to development around the RISC-V ISA. I would say this goal was achieved. Many high-profile announcements and aggressive, new architectures based on RISC-V were presented. On day … Read More
Unleashing the 1.6T Ecosystem: Alphawave Semi’s 200G Interconnect Technologies for Powering AI Data Infrastructure
In the rapidly evolving landscape of artificial intelligence (AI) and data-intensive applications, the demand for high-performance interconnect technologies has never been more critical. Even the 100G Interconnect is already not fast enough for infrastructure applications. AI applications, with their massive datasets… Read More
Ceva Launches New Brand Identity Reflecting its Focus on Smart Edge IP Innovation
Company sharpens its strategy of delivering silicon and software IP that makes it possible for low power Edge AI devices to connect, sense and infer data, reliably and efficiently, across multiple high-growth end markets
Ceva Inc. is an interesting company. Founded in November 2002, through the combination of the DSP IP licensing… Read More
Samtec Welcomes You to the Future with Proven 224G PAM4 Interconnect Solutions
We all know about the relentless march of Moore’s Law. Denser, faster, and cheaper semiconductor devices that fuel the innovations that surround us. For this discussion, I will lump the significant movement from single chip advances to multi-chip strategies into a single thread as devices continue to get smaller, faster and … Read More
IEDM: TSMC Ongoing Research on a CFET Process
I attended the recent International Electron Devices Meeting (IEDM) last week. Many of the sessions are too technical and too far away from high volume manufacture to make good topics for a blog post. As a Fellow from IBM said about 5nm at and earlier IEDM, “none of these ideas will impact 5nm. It takes ten years for a solution to from… Read More
Podcast EP198: How Lightmatter Creates the Foundation for the Next Moore’s Law with Ritesh Jain
Dan is joined by Ritesh Jain. Ritesh is the senior vice president of engineering and operations for Lightmatter. Prior to joining Lightmatter, Ritesh was a vice president in Intel’s Data Center and AI group where he directed the hardware development across silicon packaging, power integrity, signal integrity, mechanical &… Read More
CEO Interview: Sridhar Joshi of TenXer
Sridhar Joshi has more than Two and half decades of experience in the Semiconductor Industry. He spent Large part of his career working in various Engineering and leadership roles at National Semiconductor and Texas Instruments, including leading a company wide initiative for System Design and Technology, ARM Microcontroller… Read More
An Insider’s View of the 2023 Global Semiconductor Alliance’s (GSA) Annual Awards
My beautiful wife and I attended the annual Global Semiconductor Alliance (GSA) Awards event last week. Usually this is a solo event but since my wife is CFO of SemiWiki I was able to get her an invite. I go every year and she wanted to see what all of the excitement was about. She also knows quite a few industry people from attending the… Read More
WEBINAR: FPGA-Accelerated AI Speech Recognition
The three-step conversational AI (CAI) process – automatic speech recognition (ASR), natural language processing, and text-to-synthesized speech response – is now deeply embedded in the user experience for smartphones, smart speakers, and other devices. More powerful large language models (LLMs) can answer more queries… Read More
RISC-V and Chiplets: A Panel Discussion
At the recent RISC-V Summit, the very last session was a panel about chiplets called Chiplets in the RISC-V Ecosystem. It was moderated by Calista Redmond, the CEO of RISC-V International. The panelists were:
- Laurent Moll, COO of Arteris
- Aniket Saha, VP of Product Management of Tenstorrent
- Dale Greenley, VP of Engineering of Ventana
Next Generation of Systems Design at Siemens