A long standing tradition has returned to EDA: The CEO Outlook sponsored by ESDA (formerly EDAC) which alone is worth the price of membership! Not only do you get a free meal, the event included quality networking time with the semiconductor elite. In the past, financial analysts moderated this event holding the CEO’s feet to the… Read More
Analog Bits Demos Real-Time On-Chip Power Sensing and Delivery on N2P at the TSMC 2026 Technology SymposiumAnalog Bits has a way of stealing the…Read More
Disaggregating LLM Inference: Inside the SambaNova Intel Heterogeneous Compute BlueprintSambaNova Systems and Intel have introduced a blueprint…Read More
CEO Interview with Johan Wadenholt Vrethem of VoxoWith over two decades of experience bridging technology…Read More
TSMC to Elon Musk: There are no Shortcuts in Building Fabs!The opening of the TSMC 2026 earning call…Read More
Speculation: Silicon’s Most Expensive CompulsionHow Time-Based Scheduling Reclaims Silicon Wasted by Speculative…Read MoreIoT in the Cloud with Microsoft and Mentor
I cycle for fitness five days per week and use the Strava.com site to post my rides, analyze the ride data and chat with other cyclists, however in February this year the Amazon Web Services went down which crashed Strava, making me sad and nervous at the same time. Of course, there are alternatives to Amazon Web Services and the engineers… Read More
Lip-Bu on Opportunity
Given a chance to talk with someone as connected as Lip-Bu Tan (President and CEO of Cadence and Chairman of the VC firm Walden International), it is tempting to ask all the usual questions about industry growth and directions in cloud, automotive, IIoT, AI and so on. I wanted to try something different. If you make a living (or plan… Read More
Approaches for EM, IR and Thermal Analysis of ICs
As an engineer I’ve learned how to trade off using various EDA tools based on the accuracy requirements and the time available to complete a project. EDA vendors have been offering software tools to help us with reliability concerns like EM, IR drop and thermal analysis for several years now. Last week I attended a webinar … Read More
A Self-Contained Software-Driven Prototype
You’re building an IP, subsystem or SoC and you want to use a prototype together with a software testbench to drive extensive validation testing. I’m not talking here about the software running on the IP/SoC processor(s); the testbench should wrap around the whole DUT. This is a very common requirement. The standard approach to… Read More
3D Product Design Collaboration in MCAD and ECAD Platforms
Consumer electronics demand aggressive mechanical enclosure design — product volume, weight, shape, and connector access are all critical design optimization criteria. Mechanical CAD (MCAD) software platforms are used by product engineers to develop the enclosure definition — the integration of the PCB design… Read More
The CDNLive Keynotes
I’m developing a taste for user-group meetings. In my (fairly) recently assumed role as a member of the media, I’m only allowed into the keynotes, but from what I have seen, vendors work hard to make these fresh and compelling each year through big-bang product updates and industry/academic leaders talking about their work in bleeding-edge… Read More
NetSpeed Taking a Ride with Autonomous Automobiles
The push for autonomous automobiles continues at a rapid pace. Last week a new conference was held in Santa Clara, CA by the Linley Group focused on Autonomous Hardware. The group included presentations from GLOBAL FOUNDRIES, Synopsys, NetSpeed Systems, Arteris, EMBC, Cadence, CEVA, ARM and Trilumina covering ADAS and autonomous… Read More
1.2 Terabit/s C2C Interface? Only with Interlaken!
If you are familiar with high bandwidth networking applications, you probably know this chip-to-chip (C2C) interface protocol. Interlaken architecture, fully flexible, configurable and scalable, is also an elegant answer to the need for very high bandwidth C2C communication. Interlaken is elegant because the protocol … Read More
Attending DAC in Austin for Free
I’ve been attending DAC since the late 1980’s and can tell you that it’s an annual highlight for me and anyone else interested in the EDA, IP and semiconductor industries. Where else can you see most of the big and little vendors of EDA software, semiconductor IP and foundries in one place? I recently blogged about… Read More


Is Intel About to Take Flight?