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GLOBALFOUNDRIES ASIC Update!

GLOBALFOUNDRIES ASIC Update!
by Daniel Nenni on 12-15-2016 at 7:00 am

Back in my IP days we spent a lot of time with the ASIC companies chasing multi-million dollar licensing deals. IBM was a fierce ASIC competitor back then with leading edge processes and a silicon proven IP catalog that was unmatched.

Unfortunately that ended at 65nm as the pure-play foundries (TSMC and UMC) and fabless ASIC companies… Read More


Waymo Misses the Boat… Wayless?

Waymo Misses the Boat… Wayless?
by Roger C. Lanctot on 12-14-2016 at 4:00 pm

The big news in the world of transportation today is Alphabet’s spinoff of its automated driving business into a business unit called Waymo. The effort is positioned as Alphabet’s formal attempt to commercialize automated driving technology.

The project has been greeted with much fanfare and rumors of a late 2017… Read More


Cybercriminals Next Targets: Short Term Dangers (part 1 of 2)

Cybercriminals Next Targets: Short Term Dangers (part 1 of 2)
by Matthew Rosenquist on 12-14-2016 at 12:00 pm

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Knowing what cybercriminals are targeting today is easy. Their attacks are loud, impactful, and have the elegance of a herd of bulls crashing through a glassware shop. The tougher challenge is figuring out where they will take aim tomorrow. Knowing where cyber threats will attack in the future, gives the necessary insights to … Read More


An End of Year View of Semi Consolidation

An End of Year View of Semi Consolidation
by Bernard Murphy on 12-14-2016 at 7:00 am

The last couple of years have been tumultuous for the semiconductor market. IC Insights just released a report showing just how much consolidation has concentrated market strength in a small number of companies. The report (which excludes fabs) shows that the 5 top companies – Intel, Samsung, Qualcomm, Broadcom and SK Hynix – … Read More


Advanced Semiconductor Process Cost Trends

Advanced Semiconductor Process Cost Trends
by Scotten Jones on 12-13-2016 at 4:00 pm

The cost trend for leading edge semiconductor technologies is a subject of some controversy in the industry. Cost is a complex issue with many interacting factors and much of the information out in the industry is in my opinion misleading or incorrect. In this article, I will discuss each of the factors as well as present a view of … Read More


#CES2017: Aftermarket to the Rescue

#CES2017: Aftermarket to the Rescue
by Roger C. Lanctot on 12-13-2016 at 12:00 pm

Has it really been 50 years? Listening to a George Hotz Udacity podcast got me to thinking that the upcoming CES 2017 in Las Vegas will be a turning point in automated driving technology. It was just two years ago that Audi was self-driving itself from California to Nevada for CES 2015, but we don’t seem to have come that far in … Read More


Flex Logix is a Different Kind of IP Company!

Flex Logix is a Different Kind of IP Company!
by Daniel Nenni on 12-13-2016 at 7:00 am

The embedded FPGA business has been getting quite a bit of press lately so it is definitely worth a closer look. Intel started it all when they acquired the #2 FPGA company Altera for $16.7B last year. Microsoft is also a big FPGA fan for search and deep learning. In fact, Microsoft’s commitment to FPGAs, specifically Altera FPGAs,… Read More


Performance Analysis for ARM Based SOC’s

Performance Analysis for ARM Based SOC’s
by Tom Simon on 12-12-2016 at 4:00 pm

ARM estimates that many SOC’s designed today have over 200 IP components. This statistic comes from a recent white paper ARM published addressing the topic of system performance analysis. This number is only going to go up. According the ARM this creates a huge challenge in ensuring the system is designed with adequate performance… Read More


Design for Fanout Packaging

Design for Fanout Packaging
by Bernard Murphy on 12-12-2016 at 12:00 pm

In constant pursuit of improved performance, power and cost, chip and system designers always want to integrate more functions together because this minimizes inter-device loads (affecting performance and power) and bill of materials on the board (affecting cost). However it generally isn’t possible to integrate … Read More


CEO Interview: Jack Harding of eSilicon

CEO Interview: Jack Harding of eSilicon
by Daniel Nenni on 12-12-2016 at 7:00 am

I recently spoke with Jack Harding, CEO of eSilicon Corporation and Duy-Loan Le, one of eSilicon’s Board members about eSilicon’s progress in Vietnam, a large design location for the company. eSilicon also gives back in the region through its association with Sunflower Mission, a U.S. based non-profit organization that is committed… Read More