Events EDA2025 esig 2024 800X100
Semiconductor Expert Forum

Podcast EP213: The Impact of Arteris on Automotive and Beyond with Frank Schirrmeister

Podcast EP213: The Impact of Arteris on Automotive and Beyond with Frank Schirrmeister
by Daniel Nenni on 03-22-2024 at 10:00 am

Dan is joined by Frank Schirrmeister, vice president of solutions and business development at Arteris. He leads activities in the industry verticals including automotive and technology horizontals like artificial intelligence, machine learning, and safety. Before Arteris, Frank held senior leadership positions at Cadence… Read More

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CEO Interview: Ganesh Verma, Founder and Director of MoogleLabs

CEO Interview: Ganesh Verma, Founder and Director of MoogleLabs
by Daniel Nenni on 03-22-2024 at 6:00 am
Categories: AI, CEO Interviews

MicrosoftTeams image (27)

A thought leader with demonstrated history in multiple roles- project life cycles, ideation, implementation, and closing projects delivering business value and delighting stakeholders, crafting technical aspects of the company’s strategy for aligning with the business goals perfectly, discovering and implementing … Read More

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Semiconductor CapEx Down in 2024

Semiconductor CapEx Down in 2024
by Bill Jewell on 03-21-2024 at 2:00 pm
Categories: Semiconductor Intelligence, Semiconductor Services
3 Comments

Delayed Wafer Projects

U.S. President Biden announced on Wednesday an agreement to provide Intel with $8.5 billion in direct funding and $11 billion in loans under the CHIPS and Science Act. Intel will use the funding for wafer fabs in Arizona, Ohio, New Mexico, and Oregon. As reported in our December 2023 newsletter, the CHIPS Act provides a total of $52.7… Read More

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2024 Outlook with John Lee, VP and GM Electronics, Semiconductor and Optics Business Unit at Ansys

2024 Outlook with John Lee, VP and GM Electronics, Semiconductor and Optics Business Unit at Ansys
by Daniel Nenni on 03-21-2024 at 10:00 am
Categories: Ansys, Inc., EDA

John Lee Headshot

We have been working with Ansys since SemiWiki was founded in 2011. It has been a richly rewarding relationship in all regards. I always say the semiconductor industry is filled with the most intelligent people in the world and Ansys is an excellent proof point. I have known John Lee for 30+ years and he is one of my trusted few, absolutely.… Read More

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Simulating the Whole Car with Multi-Domain Simulation

Simulating the Whole Car with Multi-Domain Simulation
by Bernard Murphy on 03-21-2024 at 6:00 am
Categories: Accellera, AI, Automotive

Simulating the Whole Car with Multi-Domain Simulation

Next significant automotive blog in a string I will be posting (see here for the previous blog).

In the semiconductor world, mixed simulation means mixing logic sim, circuit sim, virtual sim (for software running on the hardware we are designing) along with emulation and FPGA prototyping. While that span may seem all-encompassing,… Read More

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QuantumPro unifies superconducting qubit design workflow

QuantumPro unifies superconducting qubit design workflow
by Don Dingee on 03-20-2024 at 10:00 am
Categories: EDA, Keysight EDA, Quantum Computing

Superconducting qubit design workflow in QuantumPro

To create quantum computing chips today, a typical designer must cobble various tools together, switching back and forth between them for different tasks. By contrast, EDA solutions such as Keysight Advanced Design System (ADS) unify a design workflow in a single interface with automated data exchange between features. In … Read More

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sureCore Enables AI with Ultra-Low Power Memory IP

sureCore Enables AI with Ultra-Low Power Memory IP
by Mike Gianfagna on 03-20-2024 at 8:00 am
Categories: AI, IP, sureCore

sureCore Enables AI with Ultra Low Power Memory IP

We all know that AI is becoming pervasive in a wide array of products to make them smarter, safer and feature rich. Just look at the announcements from the recent CES show in Las Vegas to see some examples. These AI workloads demand a lot of compute power. Fueling this trend is the need for significant arrays of embedded memory on chip,… Read More

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Challenge and Response Automotive Keynote at DVCon

Challenge and Response Automotive Keynote at DVCon
by Bernard Murphy on 03-20-2024 at 6:00 am
Categories: Automotive, Cadence, EDA

dvcon 2024 keynote min

Keynotes commonly provide a one-sided perspective of a domain, either customer-centric or supplier-centric. Kudos therefore to Cadence’s Paul Cunningham for breaking the mold in offering the first half of his keynote to Anthony Hill, a TI fellow, to talk about outstanding challenges he sees in verification for automotive … Read More

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Unleash the Power: NVIDIA GPUs, Ansys Simulation

Unleash the Power: NVIDIA GPUs, Ansys Simulation
by Daniel Nenni on 03-19-2024 at 10:00 am
Categories: Ansys, Inc., Chiplet, EDA, Events

Electromagnatic PerceiveEM

In the realm of engineering simulations, the demand for faster, more accurate solutions to complex multiphysics challenges is ever-growing.

Simulation is a vital tool for engineers to design, test, and optimize complex systems and products. It helps engineers reduce costs, improve quality, and accelerate innovation. However,… Read More

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Synopsys Enhances PPA with Backside Routing

Synopsys Enhances PPA with Backside Routing
by Mike Gianfagna on 03-19-2024 at 6:00 am
Categories: EDA, Synopsys

Comparison of frontside and backside PDNs (Source IMEC)

Complexity and density conspire to make power delivery very difficult for advanced SoCs. Signal integrity, power integrity, reliability and heat can seem to present unsolvable problems when it comes to efficient power management. There is just not enough room to get it all done with the routing layers available on the top side… Read More