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Semiconductor Expert Forum

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MooresLabAI at DAC 2026: Why the Future of Semiconductor Engineering Is Agentic, Not Just Generative

MooresLabAI at DAC 2026: Why the Future of Semiconductor Engineering Is Agentic, Not Just Generative
by Daniel Nenni on 07-08-2026 at 2:00 pm
Categories: EDA, Events, Moores Lab (AI)

DAC MLAI BuildingTheFuture

For decades, semiconductor innovation has been constrained not by imagination, but by engineering capacity. While transistor density has continued to advance, the process of building chips has remained fundamentally manual, fragmented across specifications, RTL, verification, debugging, coverage analysis, and signoff.… Read More

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Caspia Technologies is pioneering a new, agentic chip and system security approach at DAC 2026

Caspia Technologies is pioneering a new, agentic chip and system security approach at DAC 2026
by Daniel Nenni on 07-08-2026 at 10:00 am
Categories: Caspia Technologies, Events, Security

Caspia DAC Plan for SemiWiki

Caspia’s advanced tools and agents blend seamlessly with existing design flows to add expert-level security verification capabilities for all design teams. Founded in 2020 and headquartered in Gainesville, Florida, Caspia brings together expertise in chip design, fabrication, test, and verification with a deep understanding… Read More

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IP Lifecycle Management in the AI Era

IP Lifecycle Management in the AI Era
by Bernard Murphy on 07-08-2026 at 6:00 am
Categories: AI, EDA, Perforce

designer trying to find best IP options in a tangle of choices

Large design enterprises have multiple concurrent activities around IP of various types: software/firmware, blocks defined in RTL or HLS, verification IPs of multiple different types, physical implementations, scripts/files for timing, power management, etc., etc. Each of these continues to evolve and branch to serve … Read More

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See Autonomous Chip Design in Action with ChipAgents at DAC 2026

See Autonomous Chip Design in Action with ChipAgents at DAC 2026
by Daniel Nenni on 07-07-2026 at 2:00 pm
Categories: ChipAgents AI, EDA

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Making the AI wave at DAC 2026 in Long Beach

DAC comes to Long Beach for the first time in 2026, with artificial intelligence expected to be one of the central topics across the conference program and exhibition floor.

For semiconductor design and verification teams, the discussion has moved beyond whether AI can assist engineers.… Read More

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The Packaging PDK Is the Missing Layer for Co-Packaged Optics

The Packaging PDK Is the Missing Layer for Co-Packaged Optics
by Moh Kolb on 07-07-2026 at 10:00 am
Categories: 3D IC, Chiplet
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PKG PDK MISSION CPO JUne26

From Photonic Device Design to Electro-Optical Realization

Co-packaged optics will not scale through photonic device performance alone.

As AI infrastructure pushes bandwidth, power, latency, and reach to new limits, optics is moving closer to the compute engine. The industry is no longer asking only whether a photonic device… Read More

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Demonstrating the EasyAI ECO Suite – An AI-Powered Functional ECO Solution at DAC 2026

Demonstrating the EasyAI ECO Suite – An AI-Powered Functional ECO Solution at DAC 2026
by Daniel Nenni on 07-07-2026 at 6:00 am
Categories: Easy-Logic, EDA

EasylogicECO AI Driven ECO Solution

Easy-Logic, a leading provider of high-performance Engineering Change Order (ECO) solutions in Electronic Design Automation (EDA), will showcase its latest innovation — the EasyAI ECO Suite — at 2026 DAC in Los Angeles, July 27–29, 2026. This intelligent ECO solution integrates AI engines into the entire ECO workflow and systematically… Read More

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The Accidental Infrastructure: How Crypto Miners Built the Foundation of the AI Boom

The Accidental Infrastructure: How Crypto Miners Built the Foundation of the AI Boom
by Jonah McLeod on 07-06-2026 at 2:00 pm
Categories: AI

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Most crypto forty-niners died broke in a warehouse full of their computing rigs. Former Ethereum miner CoreWeave took its gold to Wall Street. On June 22, 2026, it joined the Nasdaq-100 — fifteen months after its IPO, nine years after its founders assembled their first GPU rig in a New Jersey office.

The people who built the physical… Read More

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From Detection to Safety: Reframing Fault Simulation for Functional Safety

From Detection to Safety: Reframing Fault Simulation for Functional Safety
by Lauro Rizzatti on 07-06-2026 at 10:00 am
Categories: EDA, Synopsys

From Detection to Safety Figure 1

In the early 1980s, when computer-aided engineering (CAE), the precursor to modern electronic design automation (EDA), was just taking shape, my professional trajectory shifted in a way that would prove foundational. I joined Teradyne, the Boston-based leader in automated test equipment (ATE), and I encountered for the first… Read More

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Executive Interview with Chris Morrison, VP Product Marketing at Agile Analog

Executive Interview with Chris Morrison, VP Product Marketing at Agile Analog
by Daniel Nenni on 07-06-2026 at 6:00 am
Categories: Agile Analog, CEO Interviews, IP

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Chris Morrison is VP Product Marketing at Agile Analog, the customizable analog IP company. He has over 18 years’ experience of developing strong relationships with key partners across the semiconductor industry and delivering innovative analog, digital, power management and audio products, working for international companies… Read More

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CEO Interview with Brice Cruchon, CEO of Dracula Technologies

CEO Interview with Brice Cruchon, CEO of Dracula Technologies
by Daniel Nenni on 07-03-2026 at 4:00 pm
Categories: CEO Interviews

Brice Cruchon CEO Dracula Technologies Photo 2024

Brice Cruchon is the Founder and CEO of Dracula Technologies, a company he established in 2011 to develop and industrialize organic photovoltaic (OPV) technologies for indoor energy harvesting. He holds a Master’s degree in Chemistry from the University of Nantes (France) and has built a career spanning chemistry, intellectual… Read More