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The Evolution of the Extension Implant Part I

The Evolution of the Extension Implant Part I
by Daniel Nenni on 04-29-2019 at 7:00 am

The 3D character of FinFET transistor structures pose a range of unique fabrication problems that can make it challenging to get these devices to yield. This is especially true for the all-important Extension implant that is put in place just prior to the nitride spacer formation.

The Extension implant is a central component of… Read More


EDA Update 2019

EDA Update 2019
by Daniel Nenni on 04-26-2019 at 12:00 pm

Over the last six years EDA has experienced yet another disruption not unlike the Synopsys acquisition of Avant! in 2001 which positioned Synopsys for the EDA lead they still enjoy today. Or the hiring of famed venture capitalist Lip-Bu Tan in 2009 to be the CEO of struggling EDA pioneer Cadence Design Systems. Under Lip-Bu’s… Read More


A Quick TSMC 2019 Tech Symposium Overview

A Quick TSMC 2019 Tech Symposium Overview
by Daniel Nenni on 04-26-2019 at 7:00 am

This year TSMC did a FinFET victory lap with the success of 16nm, 12nm, 10nm, and 7nm. It really is well deserved. Even though TSMC credits the ecosystem and customers, I credit TSMC and their relationship with Apple since it has pushed us all much harder than ever before. TSMC CEO C.C. Wei summed it up nicely in his keynote: Innovation,… Read More


Deep Learning, Reshaping the Industry or Holding to the Status Quo

Deep Learning, Reshaping the Industry or Holding to the Status Quo
by Daniel Payne on 04-25-2019 at 12:00 pm

AI, Machine Learning, Deep Learning and neural networks are all hot industry topics in 2019, but you probably want to know if these concepts are changing how we actually design or verify an SoC. To answer that question what better place to get an answer than from a panel of industry experts who recently gathered at DVcon with moderator… Read More


Semiconductor Equipment Revenues To Drop 17% In 2019 On 29% Capex Spend Cuts

Semiconductor Equipment Revenues To Drop 17% In 2019 On 29% Capex Spend Cuts
by Robert Castellano on 04-25-2019 at 7:00 am

The semiconductor equipment market grew 37.3% in 2017 on the heels of capex spend by memory companies in order to increase bit capacity and move to more sophisticated products with smaller nanometer dimensions. Unfortunately these companies overspent resulting in excessive oversupply of memory chips. As memory prices started… Read More


A Brief History of IP Management

A Brief History of IP Management
by Daniel Nenni on 04-24-2019 at 12:00 pm

As RTL design started to increase in the late 1980’s and early 1990’s, it was becoming apparent that some amount of management was needed to keep track of all the design files and their associated versions. Because of the parallels to software development, design teams looked to the tools and methodologies that were in use by software… Read More


Foundational Excellence in a Laid-Back Style

Foundational Excellence in a Laid-Back Style
by Bernard Murphy on 04-24-2019 at 7:00 am

I recently had a call with Rob Dekker, Founder and CTO of Verific. If you’re in EDA or semiconductor CAD, chances are high that you know who they are. They’re king of the hill in parser software for SystemVerilog and VHDL. When you hear a line like that, you assume a heavy dose of marketing spin, but here it really is fact. I don’t know of… Read More


Rambus Take on AI in the Era of Connectivity at Linley Processor Conference

Rambus Take on AI in the Era of Connectivity at Linley Processor Conference
by Camille Kokozaki on 04-23-2019 at 12:00 pm

Steven Woo, Fellow and Distinguished Inventor presented at the just concluded Linley Spring Processor Conference a talk about AI in the Era of Connectivity. As he put it, the world is becoming increasingly connected, with a marked surge of digital data, causing a dependence on said data. With the explosion of digital data and AI,… Read More


IC Implementation Improved by Hyperconvergence of Tools

IC Implementation Improved by Hyperconvergence of Tools
by Daniel Payne on 04-23-2019 at 7:00 am

Physical IC design is a time consuming and error prone process that begs for automation in the form of clever EDA tools that understand the inter-relationships between logic synthesis, IC layout, test and sign-off analysis. There’s even an annual conference called ISPDInternational Symposium on Physical DesignRead More


Customizing and Standardizing IP with eSilicon at the Linley Conference

Customizing and Standardizing IP with eSilicon at the Linley Conference
by Camille Kokozaki on 04-22-2019 at 12:00 pm

During the SoC Design Session at the just concluded Linley Spring Processor Conference in Santa Clara, Carlos Macian, Senior Director AI Strategy and Products at eSilicon, held a talk entitled ‘Opposites Attract: Customizing and Standardizing IP Platforms for ASIC Differentiation’.

Standardization is key to IP in modern … Read More