Introduction of 2.5D and 3D multi-die based products are helping extend the boundaries of Moore’s Law, overcoming limitations in speed and capacity for high-end computational tasks. In spite of its critical function within the 3DIC paradigm, the interposer die’s role and related challenges are often neither fully comprehended… Read More
INTERVIEW: Bluespec RISC-V soft cores in Achronix FPGAs
Recently, a partnership between Achronix and Bluespec has been in the news. Bluespec RISC-V processors are available as soft cores in a Speedster®7t FPGA on Achronix’s VectorPath® PCIe development card or in a standalone Speedster7t FPGA. We spoke with executives from Achronix and Bluespec about the impetus for this effort … Read More
Reduce Risk, Ensure Compliance: Hardware-Assisted Verification for Design Certification
Prologue
Peter was running late for two reasons. First, he encountered unexpected heavy traffic and arrived ten minutes late for a crucial meeting with a customer to run a compliance test of his new 6G phone design prototyped on FPGAs. This prototype’s success was pivotal, as it could secure a significant purchase order.… Read More
Automotive Autonomy’s Quiet Advance Through Radar
Given false starts and OEM strategic retreats you could be forgiven for thinking that the autonomous personal car dream is now a lost cause. But that’s not quite true. While moonshot goals have been scaled back or are running under wraps, applications continue to advance, for adaptive cruise control, collision avoidance, automatic… Read More
Something new in High Level Synthesis and High Level Verification
As SoC complexities continue to expand to billions of transistors, the quest for higher levels of design automation also rises. This has led to the adoption of High-Level Synthesis (HLS), using design languages such as C++ and SystemC, which is more productive than traditional RTL design entry methods. In the RTL approach there… Read More
Mastering Atomic Precision – ALD’s Role in Semiconductor Advancements
Atomic layer deposition (ALD) is a thin-film deposition method that continues to enable continuous advances in semiconductor device fabrication. Essentially, it involves exposing substrates sequentially to at least two different vapor phase atmospheres in which self-limiting reactions take place on the surface: the first… Read More
WEBINAR: Redefining Security – The challenges of implementing Post-Quantum Cryptography (PQC)
In the late 1970s, cryptographic history saw the emergence of two seminal algorithms: McEliece and RSA. At that time, quantum threats were theoretical, and the selection criteria for cryptographic algorithms prioritized public key length and execution time, leading to RSA’s prominence while McEliece remained obscure… Read More
How IROC Makes the World a Safer Place with Unique Soft Error Analysis
I recently had an eye-opening discussion regarding the phenomena of soft errors in semiconductor devices. I always knew this could be a problem in space, where there are all kinds of high energy particles. What I didn’t realize is there are two trends that are making this kind of problem relevant on the ground as well as in space. The… Read More
Driving Data Frontiers: High-Performance PCIe® and CXL® in Modern Infrastructures
The increasing demands of data-intensive applications necessitate more efficient storage and memory utilization. The rapid evolution of AI workloads, particularly with Generative AI (GenAI), demands infrastructure that can adapt to diverse computational needs. AI models vary widely in resource requirements, necessitating… Read More
TSMC Advanced Packaging Overcomes the Complexities of Multi-Die Design
The TSMC Technology Symposium provides a worldwide stage for TSMC to showcase its advanced technology impact and the extensive ecosystem that is part of the company’s vast reach. These events occur around the world and the schedule is winding down. TSMC covers many topics at its Technology Symposium, including industry-leading… Read More
Will 50% of New High Performance Computing (HPC) Chip Designs be Multi-Die in 2025?