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Samtec Delivers Ultra-High Density with Direct Connect™ to IC Package Technology

Samtec Delivers Ultra-High Density with Direct Connect™ to IC Package Technology
by Mike Gianfagna on 09-11-2020 at 6:00 am

Samtec Direct Connect to IC Package Technology

We all know the signal integrity and power integrity challenges of high-performance system design.  It used to be enough to design a robust chip. Now, the interaction between the chip, the substrate/package and the PCB all matter. If your design is 2.5D, as many are these days, the problems just gets worse. Chiplets are becoming… Read More


How HCL VersionVault Works – Directory Versioning

How HCL VersionVault Works – Directory Versioning
by Mike Gianfagna on 09-10-2020 at 10:00 am

Pieter Gosselink Senior Technical Support Engineer HCL Technologies

Last month, I discussed a webinar about HCL VersionVault – HCL VersionVault Delivers Version Control and More. This webinar introduced the HCL VersionVault product. This post will discuss a new video entitled “How HCL VersionVault Works – Directory Versioning.”

To recap, VersionVault delivers a lot of … Read More


Emulation as a Service Benefits New AI Chip

Emulation as a Service Benefits New AI Chip
by Bernard Murphy on 09-10-2020 at 6:00 am

Emulation as a Service

It’s no secret that innovation in AI chip architectures is on a tear. When you put together the spatial complexity of highly parallelized algorithms with the need to localize memory accesses on-chip to the greatest extent possible, we’re seeing a proliferation of all kinds of domain-specific architectures. Which in the normal… Read More


Analog Bits at TSMC OIP – A Complete On-Die Clock Subsystem for PCIe Gen 5

Analog Bits at TSMC OIP – A Complete On-Die Clock Subsystem for PCIe Gen 5
by Mike Gianfagna on 09-09-2020 at 10:00 am

Design Integration of Complete On die Clock Subsystem for PCIe Gen 5

This is another installment covering TSMC’s very popular Open Innovation Platform event (OIP), held on August 25. This event presents a diverse and high-impact series of presentations describing how TSMC’s vast ecosystem collaborates with each other and with TSMC.  The talk covered here focuses on a complete on-die clock … Read More


Highlights of the TSMC Technology Symposium – Part 3

Highlights of the TSMC Technology Symposium – Part 3
by Tom Dillinger on 09-09-2020 at 8:00 am

CoWoS features

Recently, TSMC held their 26th annual Technology Symposium, which was conducted virtually for the first time.  This article is the last of three that attempts to summarize the highlights of the presentations.  This article focuses on the technology design enablement roadmap, as described by Cliff Hou, SVP, R&D.

Key TakeawaysRead More


Blue Cheetah Technology Catalyzes Chiplet Ecosystem

Blue Cheetah Technology Catalyzes Chiplet Ecosystem
by Tom Simon on 09-09-2020 at 6:00 am

Blue Cheetah Ecosystem

There are many reasons today for dividing up large monolithic SoCs into chiplets that are connected together inside a single package. Let’s look at just some of these reasons. Many SoCs share a common processing core with application specific interfaces and specialized processing engines. Using chiplets would mean that it is… Read More


S2C Announces 300 Million Gate Prototyping System with Intel® Stratix® 10 GX 10M FPGAs

S2C Announces 300 Million Gate Prototyping System with Intel® Stratix® 10 GX 10M FPGAs
by Daniel Nenni on 09-08-2020 at 10:00 am

10M0904

In 2016 SemiWiki published a book “Prototypical: The Emergence of FPGA-Based Prototyping for SoC Design”. Today we are writing Prototypical II since a LOT of prototyping innovation has happened in the last four years, absolutely.

For example:

Quad 10M Prodigy™ Logic System extends the capacity leadership to simplifyRead More


Combo Wireless. I Want it All, I Want it Now

Combo Wireless. I Want it All, I Want it Now
by Bernard Murphy on 09-08-2020 at 6:00 am

Mixed wireless

When we think of wireless it is natural to wonder “which one – cellular, Wi-Fi, BLE?” Our phones support everything but those are pricey devices. What if we wanted the same combo wireless option in a low-cost IoT device, maybe something that only need to send a small amount of data periodically? Logistics applications are a good example.… Read More


Dolphin Design – Delivering High-Performance Audio Processing with TSMC’s 22ULL Process

Dolphin Design – Delivering High-Performance Audio Processing with TSMC’s 22ULL Process
by Mike Gianfagna on 09-07-2020 at 10:00 am

Dolphin Design – Delivering High Performance Audio Processing with TSMCs 22ULL Process

TSMC held their very popular Open Innovation Platform event (OIP) on August 25. The event was virtual of course and was packed with great presentations from TSMC’s vast ecosystem. One very interesting and relevant presentation was from Dolphin Design, discussing the delivery of high-performance audio processing using TSMC’s… Read More


Highlights of the TSMC Technology Symposium – Part 2

Highlights of the TSMC Technology Symposium – Part 2
by Tom Dillinger on 09-07-2020 at 8:00 am

3D Fabric

Recently, TSMC held their 26th annual Technology Symposium, which was conducted virtually for the first time.  This article is the second of three that attempts to summarize the highlights of the presentations.  This article focuses on the TSMC advanced packaging technology roadmap, as described by Doug Yu, VP, R&D.

KeyRead More