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VLSI Symposium 2020 – Imec Monolithic CFET

VLSI Symposium 2020 – Imec Monolithic CFET
by Scotten Jones on 09-13-2020 at 10:00 am

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The 2020 VLSI Technology Symposium was held as a virtual conference from June 14th through June 19th. At the symposium Imec gave an interesting paper on Monolithic CFET and I had a chance to interview one of the authors, Hiroaki Arimura.

It is well known in the industry that FinFETs (FF) are reaching the end of their scaling life. Samsung… Read More


The Cloud Changes Connected Cars

The Cloud Changes Connected Cars
by Roger C. Lanctot on 09-13-2020 at 8:00 am

The Cloud Changes Connected Cars

Rare is the auto maker today that views connectivity as an option when designing a car. Connectivity is essential even if it is not yet universally available.

Strategy Analytics interviewed a selection of automotive executives in connection with a white paper prepared for Ericsson to explore this proposition. (“Connected Read More


Could loss of SMIC lead to loss of most of China?

Could loss of SMIC lead to loss of most of China?
by Robert Maire on 09-13-2020 at 6:00 am

SMIC Banned

Is the US finally getting truly tough on China? or just a bluff?
Could lead to a global reset of the industry & 10 year retreat?
Tech stocks wings have melted after super heated stock run?
SMIC added to the “naughty” list?

There have been numerous reports that the US is considering adding SMIC to the China “naughty”… Read More


Online Verification Meet-up With Intel and Arm!

Online Verification Meet-up With Intel and Arm!
by Daniel Nenni on 09-11-2020 at 10:00 am

Online meetup sep semiwiki

Veriest is headquartered in Israel with engineering sites in Serbia & Hungary. The team has accumulated a wealth of experience through involvement in projects in the forefront of semiconductor technology.

Veriest maintains unrivaled quality standards in terms of both service and knowledge. With the ability to take on … Read More


Samtec Delivers Ultra-High Density with Direct Connect™ to IC Package Technology

Samtec Delivers Ultra-High Density with Direct Connect™ to IC Package Technology
by Mike Gianfagna on 09-11-2020 at 6:00 am

Samtec Direct Connect to IC Package Technology

We all know the signal integrity and power integrity challenges of high-performance system design.  It used to be enough to design a robust chip. Now, the interaction between the chip, the substrate/package and the PCB all matter. If your design is 2.5D, as many are these days, the problems just gets worse. Chiplets are becoming… Read More


How HCL VersionVault Works – Directory Versioning

How HCL VersionVault Works – Directory Versioning
by Mike Gianfagna on 09-10-2020 at 10:00 am

Pieter Gosselink Senior Technical Support Engineer HCL Technologies

Last month, I discussed a webinar about HCL VersionVault – HCL VersionVault Delivers Version Control and More. This webinar introduced the HCL VersionVault product. This post will discuss a new video entitled “How HCL VersionVault Works – Directory Versioning.”

To recap, VersionVault delivers a lot of … Read More


Emulation as a Service Benefits New AI Chip

Emulation as a Service Benefits New AI Chip
by Bernard Murphy on 09-10-2020 at 6:00 am

Emulation as a Service

It’s no secret that innovation in AI chip architectures is on a tear. When you put together the spatial complexity of highly parallelized algorithms with the need to localize memory accesses on-chip to the greatest extent possible, we’re seeing a proliferation of all kinds of domain-specific architectures. Which in the normal… Read More


Analog Bits at TSMC OIP – A Complete On-Die Clock Subsystem for PCIe Gen 5

Analog Bits at TSMC OIP – A Complete On-Die Clock Subsystem for PCIe Gen 5
by Mike Gianfagna on 09-09-2020 at 10:00 am

Design Integration of Complete On die Clock Subsystem for PCIe Gen 5

This is another installment covering TSMC’s very popular Open Innovation Platform event (OIP), held on August 25. This event presents a diverse and high-impact series of presentations describing how TSMC’s vast ecosystem collaborates with each other and with TSMC.  The talk covered here focuses on a complete on-die clock … Read More


Highlights of the TSMC Technology Symposium – Part 3

Highlights of the TSMC Technology Symposium – Part 3
by Tom Dillinger on 09-09-2020 at 8:00 am

CoWoS features

Recently, TSMC held their 26th annual Technology Symposium, which was conducted virtually for the first time.  This article is the last of three that attempts to summarize the highlights of the presentations.  This article focuses on the technology design enablement roadmap, as described by Cliff Hou, SVP, R&D.

Key TakeawaysRead More


Blue Cheetah Technology Catalyzes Chiplet Ecosystem

Blue Cheetah Technology Catalyzes Chiplet Ecosystem
by Tom Simon on 09-09-2020 at 6:00 am

Blue Cheetah Ecosystem

There are many reasons today for dividing up large monolithic SoCs into chiplets that are connected together inside a single package. Let’s look at just some of these reasons. Many SoCs share a common processing core with application specific interfaces and specialized processing engines. Using chiplets would mean that it is… Read More