Multi-chip modules are now more important than ever, even though the basic concept has been around for decades. With The effects of Moore’s Law and other factors such as yield, power, and process choices, reasons for dividing what once would have been a single SOC into multiple die and integrating them in a single module have become… Read More





Samsung Keynote at IEDM
Kinam Kim is a longtime Samsung technologist who has published many excellent articles over the years. He is now the Chairman of Samsung Electronics, and he gave a very interesting keynote address at IEDM.
He began with some general observations:
The world is experiencing a transformation powered by semiconductors that has been… Read More
Upcoming Webinar: 3DIC Design from Concept to Silicon
Multi-die design is not a new concept. It has been around for a long time and has evolved from 2D level integration on to 2.5D and then to full 3D level implementations. Multiple driving forces have led to this progression. Whether the forces are driven by market needs, product needs, manufacturing technology availability or EDA… Read More
The Hitchhiker’s Guide to HFSS Meshing
Automatic adaptive meshing in Ansys HFSS is a critical component of its finite element method (FEM) simulation process. Guided by Maxwell’s Equations, it efficiently refines a mesh to deliver a reliable solution, guaranteed. Engineers around the world count on this technology when designing cutting-edge electronic products.… Read More
MBIST Power Creates Lurking Danger for SOCs
The old phrase that the cure is worse than the disease is apropos when discussing MBIST for large SOCs where running many MBIST tests in parallel can exceed power distribution network (PDN) capabilities. Memory Built-In Self-Test (MBIST) usually runs automatically during power on events. Due to the desire to speed up test and … Read More
Business Considerations in Traceability
Traceability as an emerging debate around hardware is gaining a lot of traction. As a reminder, traceability is the need to support a disciplined ability to trace from initial OEM requirements down through the value chain to implementation support and confirmed verification in software and hardware. Demand for traceability… Read More
How System Companies are Re-shaping the Requirements for EDA
As the oldest and largest EDA conference, the Design Automation Conference (DAC) brings the best minds together to present, discuss, showcase and debate the latest and greatest advances in EDA. It accomplishes this in the form of technical papers, talks, company booths, product pavilions and panel discussions.
A key aspect … Read More
LIVE Webinar: Bridging Analog and Digital worlds at high speed with the JESD204 serial interface
To meet the increased demand for converter speed and resolution, JEDEC proposed the JESD204 standard describing a new efficient serial interface to handle data converters. In 2006, the JESD204 standard offered support for multiple data converters over a single lane with the following standard revisions; A, B, and C successively… Read More
How France’s Largest Semiconductor Company Got Stolen in Plain Sight
Originally published on Fabricated Knowledge
Soitec is a semiconductor materials company known for its smart cut and Silicon on Insulator (SOI) technologies, which are critical in 5G, Silicon Photonics, and Silicon Carbide (EV) end-markets.
Yesterday, they announced that current CEO Paul Boudre will retire and be replaced… Read More
Musk: Colossus of Roads, with Achilles’ Heel
For Tesla, 2021 was an amazing year. A blindspot looms in 2022.
Critics cheered the National Highway Traffic Safety Administration for opening multiple investigations into fatal and near fatal Tesla crashes. Legislators decried the de facto beta testing of Tesla’s Full Self-Driving beta on public roads. And in December,… Read More
Rapidus, IBM, and the Billion-Dollar Silicon Sovereignty Bet