The growth of complexity for silicon test as it relates to test data volume and test times is driven by multiple concurrent factors. One dimension is simply the increase in silicon complexity. However, other factors are playing a role as well. These include higher reliability requirements for new applications such as automotive,… Read More




Webinar: From Glass Break Models to Person Detection Systems, Deploying Low-Power Edge AI for Smart Home Security
Moving deep learning from the cloud to the edge is the holy grail when it comes to deploying highly accurate, low-power applications. Market demand for edge AI continues to grow globally as new hardware and software solutions are now more readily available, enabling any sized company to easily implement deep learning solutions… Read More
5G Network Activation Update
As a pilot and semiconductor professional I was a bit shocked to get an Airworthiness Directive due to the 5G rollout. Airworthiness Directives are legally enforceable regulations issued by the FAA to correct an unsafe condition in a product:
“Airworthiness Directive (AD) 2021-23-12 was issued for all fleets in December… Read More
GM’s Super Duper Cruise
It’s one thing to lead an industry. It’s another to anticipate and meet a new challenge well ahead of competitors in an industry. It’s another thing, still, to solve a long-standing problem and receive barely a hint of credit.
Such is the case with General Motors’ semi-autonomous hands-free Super Cruise feature. While many
Podcast EP66: The Data Center Revolution, the Speedata Point of View
Dan is joined by Jonathan Friedmann, a serial entrepreneur and the CEO and co-founder of Speedata. Jonathan discusses the current challenges of big data analytics and how Speedata fits into the landscape.
The views, thoughts, and opinions expressed in these podcasts belong solely to the speaker, and not to the speaker’s employer,… Read More
CEO Interview: Frankwell Lin, Chairman and CEO of Andes Technology
Frankwell Lin, Chairman of Andes Technology, started his career being as application engineer in United Microelectronics Corporation (UMC) while UMC was an IDM with its own chip products, he experienced engineering, product planning, sales, and marketing jobs with various product lines in UMC. In 1995, after four years working… Read More
Getting to Faster Closure through AI/ML, DVCon Keynote
Manish Pandey, VP R&D and Fellow at Synopsys, gave the keynote this year. His thesis is that given the relentless growth of system complexity, now amplified by multi-chiplet systems, we must move the verification efficiency needle significantly. In this world we need more than incremental advances in performance. We need… Read More
5G Requires Rethinking Deployment Strategies
5G’s Departure from Its Predecessors
In each move from 1G to 4G people became accustomed to seeing the new generation as primarily offering increased bandwidth and efficiency. It would be a mistake to view the transition to 5G along these same lines. 5G takes Radio Area Networks (RANs) from a use model primarily for cell phone communications… Read More
Semiconductor Packaging History and Primer
From DIP to Advanced, semiconductor packaging has become strategic
For ease of reading – I am going to be splitting this primer into two parts. First is the technical overview of everything. Next will be the company-specific writeups that follow over time – specifically Teradyne, Formfactor, Advantest, and Camtek
How Intel will Beat Samsung
Now that Intel is back in the foundry business, and with the Tower Semiconductor acquisition they are definitely back in the foundry business, Samsung will be the biggest foundry loser here.
You can break the IDM foundry business into two parts: First, and foremost, the NOT TSMC Business. Second is the the Better PPA (Power/Performance,… Read More
Intel’s Pearl Harbor Moment