As I previously wrote about here, Intel is presenting their Intel 4 process at the VLSI Technology conference. Last Wednesday Bernhard Sell (Ben) from Intel gave the press a briefing on the process and provided us with early access to the paper (embargoed until Sunday 6/12).
“Intel 4 CMOS Technology Featuring Advanced FinFET Transistors… Read More
Dan is joined by Sharad Chole, chief scientist & co-founder at Expedera. Sharad is an expert in AI frameworks, power-aware neural network optimizations, and programmable dataflow architectures. Previously, he was an architect at Cisco, Memoir Systems, and Microsoft.
Dan and Shared explore Expedera’s unique AI… Read More
The demands of 5G requires new designs to not only save power but also increase performance and by moving to advance power-saving nodes and by using eFPGAs will help to achieve these goals. This paper will introduce 5G and O-RAN, the complexity of these systems, and how flexibility could be beneficial. Then we will dive into how eFPGA… Read More
The emergence of 2.5D packaging technology for heterogeneous die integration offers significant benefits to system architects. Functional units may be implemented using discrete die – aka “chiplets” – which may be fabricated in different process nodes. The power, performance, and cost for each unit may be optimized separately.… Read More
SLAM – simultaneous localization and mapping – is already a well-established technology in robotics. This generally starts with visual SLAM, using object recognition to detect landmarks and obstacles. VSLAM alone uses a 2D view of a 3D environment, challenging accuracy; improvements depend on complementary sensing inputs… Read More
Dan is joined by semiconductor and EDA industry veteran Douglas Fairbairn. Doug provides details about MegaChips, where he currently heads business development. MegaChips is a large, successful 30-year old semiconductor company based in Japan.
Doug is helping MegaChips launch in the US with a focus on ASIC design and delivery.… Read More
In sports, we’re all familiar with how even a team with the best individual players for every role needs to be coordinated as a team to win a championship. In healthcare, a patient is better served with a well-trained primary physician to coordinate with the various medical specialists. The field of semiconductors involves a series… Read More
RISC-V processor IP is abundant. Open-source code for RISC-V is also widely available, but typically project-based code solves one specific problem. Using only pieces of code, it’s often up to a development team integrate a complete application-ready stack for creating an embedded device. A commercial embedded software development… Read More
Advanced Packaging Analysis at DesignConby Tom Dillinger on 06-07-2022 at 10:00 amCategories: EDA, Xpeedic
The slogan for the DesignCon conference has been “where the chip meets the board”. Traditionally, the conference has provided a breadth of technical presentations covering the design and analysis of high-speed communication interfaces and power integrity evaluations between chip, board, and system.
The recent DesignCon… Read More
To the general public, EUV lithography’s resolution can be traced back to its short wavelengths (13.2-13.8 nm), but the true printed resolution has always been affected by the stochastic behavior of the electrons released by EUV absorption [1-5].
A 0.33 NA EUV system is expected to have a diffraction-limited point spread… Read More
Rapidus, IBM, and the Billion-Dollar Silicon Sovereignty Bet