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Semiconductor Expert Forum

Podcast EP356: An Oveview of the Unique Skills and Broad Impact of Alphacore with Andrew Levy

Podcast EP356: An Oveview of the Unique Skills and Broad Impact of Alphacore with Andrew Levy
by Daniel Nenni on 07-17-2026 at 2:00 pm
Categories: Alphacore, IP

Daniel is joined by Andrew Levy, Vice President of Business Development, IP & ASIC at Alphacore. Andrew leads strategic growth initiatives, customer engagement, technology commercialization, and business development activities for the company’s semiconductor IP, ASIC design services, and advanced microelectronics… Read More

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CEO Interview with Madhulima Tewari of VerifAIX

CEO Interview with Madhulima Tewari of VerifAIX
by Daniel Nenni on 07-17-2026 at 10:00 am
Categories: AI, CEO Interviews

MadhulimaTewariHeadshot

Madhulima Tewari is the CEO and founder of VerifAIX. After two decades building EDA tools, taping out chips, and working on distributed systems, cloud infrastructure, and enterprise AI applications, she teamed up with chip design and methodology leaders and university researchers to build an agentic AI system aimed at helping… Read More

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TSMC CoWoS versus Intel EMIB Semiconductor Packaging

TSMC CoWoS versus Intel EMIB Semiconductor Packaging
by Daniel Nenni on 07-17-2026 at 8:00 am
Categories: 3D IC, Intel Foundry, Semiconductor, TSMC
1 Comment

TSMC CoWoS verus Intel EMIB

There has been talk at the latest conferences about TSMC customers taking wafers to Intel for packaging. The question is why? Is it competitive pricing? Capacity? Supply chain diversity? CC Wei was asked about this during the last investor call and his perfect response was:

Jeff Su: I guess very simply put, EMIB-T, in his view, is… Read More

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TSMC’s Raises the Bar on CAPEX!

TSMC’s Raises the Bar on CAPEX!
by Daniel Nenni on 07-17-2026 at 6:00 am
Categories: AI, Semiconductor, TSMC

TSMC CAPEX 2026 SemiWiki

On the latest investor call the big story was the increase in CAPEX for 2026 and the expected CAPEX for 2027. TSMC raised the CAPEX ceiling for 2026 from US$56 billion to US$64 billion. My guess would be US$64 billion will be spent if not more. We have been discussing this in the SemiWiki Forum and my guess for 2027 TSMC CAPEX is and incredible… Read More

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Agentrys a New Paradigm for Semiconductor Engineering at 2026 DAC

Agentrys a New Paradigm for Semiconductor Engineering at 2026 DAC
by Daniel Nenni on 07-16-2026 at 2:00 pm
Categories: Agentrys, EDA, Events

Agentrys DAC Plan

Agentrys is pioneering Agentic Design Automation (ADA), a new paradigm for semiconductor engineering. Electronic Design Automation (EDA) has transformed the industry by automating engineering algorithms. Today, frontier AI can automate many engineering tasks by understanding specifications, generating RTL and … Read More

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WAVE-P: Hardware Acceleration for the APV Professional Video Codec

WAVE-P: Hardware Acceleration for the APV Professional Video Codec
by Daniel Nenni on 07-16-2026 at 10:00 am
Categories: Chips&Media, IP

WAVE P Chips&Media

Professional video workflows demand a difficult combination of image quality, editing responsiveness, high throughput, and manageable silicon cost. Chips&Media’s WAVE-P addresses that combination as a dedicated hardware IP core for the Advanced Professional Video, or APV, codec. Designed for professional and prosumer… Read More

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PCIe 7 Switch IP with Time Division Multiplexing: Powering the Next Generation of AI Connectivity

PCIe 7 Switch IP with Time Division Multiplexing: Powering the Next Generation of AI Connectivity
by Kalar Rajendiran on 07-16-2026 at 6:00 am
Categories: AI, IP, Rambus

PCIe7 Switch with TDM

PCI Express (PCIe), PCIe switches, Time Division Multiplexing (TDM), Network Interface Cards (NICs), and SmartNICs are all well-established technologies that have formed the backbone of computing and networking systems for years. More recently, SuperNICs have emerged as the next generation of networking devices optimized… Read More

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DAC 2026 See Analog Bits TSMC N2P IP portfolio and meet with its engineering experts!

DAC 2026 See Analog Bits TSMC N2P IP portfolio and meet with its engineering experts!
by Daniel Nenni on 07-15-2026 at 2:00 pm
Categories: Analog Bits, Events, GlobalFoundries, Intel Foundry, IP, Samsung Foundry, TSMC

Dac Banner

Analog Bits, Inc. is an established provider of mixed-signal semiconductor IP that integrates into advanced system-on-chip (SoC) designs to enable intelligent energy and power management. Its full portfolio of IP blocks includes precision clocking macros, power and temperature sensors including LDO and regulators, programmable… Read More

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Perforce Enabling Innovation Without Introducing Risk at DAC 2026

Perforce Enabling Innovation Without Introducing Risk at DAC 2026
by Daniel Nenni on 07-15-2026 at 10:00 am
Categories: EDA, Perforce

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Perforce delivers a DevOps Tech Stack for teams building and running high-stakes software systems and revenue-critical applications, where failure is not an option. As a trusted partner helping organizations govern software delivery for AI, Perforce solutions enforce guardrails across code quality, infrastructure, and… Read More

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Arteris at DAC 2026 Connecting Innovation for Silicon Success

Arteris at DAC 2026 Connecting Innovation for Silicon Success
by Daniel Nenni on 07-15-2026 at 6:00 am
Categories: Arteris, Chiplet, Events, IP

Arteris Company banner

The semiconductor industry has entered a new era as AI workloads, chiplets, heterogeneous computing, software-defined vehicles, and intelligent edge devices are transforming how chips are designed.

Silicon success is no longer determined by transistor counts alone, but by how efficiently data moves across increasingly… Read More