Bronco Webinar SemiWiki

Agentrys Shows You How to Build a Multi-Agent System in 30 Minutes

Agentrys Shows You How to Build a Multi-Agent System in 30 Minutes
by Mike Gianfagna on 08-20-2026 at 2:00 pm

Agentrys Shows You How to Build a Multi Agent System in 30 Minutes

Agentrys believes that a purpose-built multi-agent system for chip design shouldn’t be a quarter-long project. Agentic AI systems are becoming quite popular to cut design time and increase quality for complex chip design projects. The challenge is finding the right agentic flow for a particular application. There are… Read More


Questa One Updated at DAC 2026

Questa One Updated at DAC 2026
by Daniel Payne on 08-20-2026 at 10:00 am

questa one dac2026

Abhi Kolpekwar, VP & General Manager, Digital Verification Technologies at Siemens EDA met with me at #DAC2026 to provide the big picture on smart verification tools, something they call Questa One. Their verification tools are infused with AI to improve productivity on projects like SoCs, 3D IC and chiplets. Abhi shared… Read More


The Fab Is Not the Finish Line

The Fab Is Not the Finish Line
by Moh Kolb on 08-20-2026 at 6:00 am

FAb is not the finish line (1)

AI may close the design. The fab may finish the silicon. Production still has to realize the system.

Semiconductor engineering is becoming extraordinarily capable.

EDA platforms are expanding from individual design tasks toward increasingly complete system analysis.

Multiphysics simulation is connecting electrical, … Read More


Hot Chips 2026: Architectures for the Agentic Computing Era

Hot Chips 2026: Architectures for the Agentic Computing Era
by Daniel Nenni on 08-19-2026 at 2:00 pm

Hot Chips 2026 Agentrys Quadric SemiWiki

Hot Chips 2026, formally the thirty-eighth Symposium on High Performance Chips, arrives at Stanford’s Memorial Auditorium from August 23 through 25 with a program that captures a decisive shift in computer architecture. Peak arithmetic throughput remains important, but the conference is increasingly about system balance:… Read More


Latest Savage on Security Webinar Focuses on Gen-AI for Chip Design and Security

Latest Savage on Security Webinar Focuses on Gen-AI for Chip Design and Security
by Admin on 08-19-2026 at 10:00 am

Savage on Security 3 SemiWiki 400 (1)

Key Takeaways from the webinar:

Multi-agent intelligent assistant systems of the future will be architected to automate and augment SoC design and security verification and redefining semiconductor innovation, reshaping design, verification and security for the next generation of trusted silicon.

The ESD Alliance is delighted… Read More


Meet Quadric on the Road: Three Must-Attend AI Events

Meet Quadric on the Road: Three Must-Attend AI Events
by Daniel Nenni on 08-19-2026 at 6:00 am

Catch Quadric Hot Chips AI Infra

This late summer, Quadric is taking its vision for programmable, on-device AI to three of the industry’s most influential gatherings. From advanced processor design at HotChips to scalable deployment at the AI Infra Summit and physical AI at Embedded World North America, each stop offers a different opportunity to see how the… Read More


PDF Solutions’ Exensio Was Built for Semiconductor Analytics. The New Exensio Aurora Architecture Is Built for Semiconductor Intelligence.

PDF Solutions’ Exensio Was Built for Semiconductor Analytics. The New Exensio Aurora Architecture Is Built for Semiconductor Intelligence.
by Kalar Rajendiran on 08-18-2026 at 2:00 pm

PDF Solutions Direct Connect Block

The semiconductor industry doesn’t have a shortage of data. It has a shortage of ways to turn that data into useful manufacturing insights quickly enough to matter.

That is the problem PDF Solutions’ Exensio solution has addressed for years. Built specifically for semiconductor manufacturing, Exensio brings … Read More


Beyond Moore: Co-Optimizing AI from Systems to Materials

Beyond Moore: Co-Optimizing AI from Systems to Materials
by Daniel Nenni on 08-18-2026 at 10:00 am

Beyond Moore AI from manufacturing to Systems

At the OCP APAC Summit in Taiwan, August 11–12, 2026, Applied Materials’ Subi Kengeri framed artificial intelligence as the semiconductor industry’s largest inflection point. AI demand is accelerating the industry toward one trillion dollars in annual revenue, but the keynote’s central message was more consequential than… Read More


Focusing on the AI Big Picture with Moores Lab AI at DAC 2026

Focusing on the AI Big Picture with Moores Lab AI at DAC 2026
by Mike Gianfagna on 08-18-2026 at 6:00 am

Focusing on the AI Big Picture with Moores Lab AI at DAC 2026

DAC 2026 proved that agentic AI design flows are here to stay. The news was conveyed both by familiar companies who we’ve seen at DAC many times before as well as new entrants to the show and the industry. Many of the solutions that were presented focused on a specific part of the design flow. Others took a broader view of the problem and… Read More


Podcast EP361: An Overview of the AI Infra Summit with Ed Nelson

Podcast EP361: An Overview of the AI Infra Summit with Ed Nelson
by Daniel Nenni on 08-17-2026 at 2:00 pm

Daniel is joined by Ed Nelson, Strategy Director and Co-Founder of AI Infra Summit. He co-leads the production team and specializes in product strategy and management, keynote speaker acquisition and VIP network development. Ed started the summit in 2018 and has spent nearly ten years as part of the team building AI Infra Summit… Read More