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Thermal Reliability and Robustness of CMOS-Compatible GaN-on-Si MIS-HEMTs Under High-Temperature Stress

Thermal Reliability and Robustness of CMOS-Compatible GaN-on-Si MIS-HEMTs Under High-Temperature Stress
by Daniel Nenni on 05-22-2026 at 10:00 am

Thermal Robustness of a CMOS compatible

The continued evolution of semiconductor technologies has created a growing demand for devices capable of operating reliably under extreme conditions, particularly high temperatures. Among the most promising candidates for such applications are gallium nitride (GaN)-based high electron mobility transistors (HEMTs).… Read More


ASML High-NA EUV is Not Ready for High-Volume Production

ASML High-NA EUV is Not Ready for High-Volume Production
by Daniel Nenni on 05-22-2026 at 8:00 am

ASML Elephant High NA EUV

Contrary to the popular press, ASML High-NA EUV is not ready for logic production yet—and it may never be, at least not in the form originally envisioned. If you remember how long it took conventional EUV to become production-worthy—arguably 5–10 years—this should not come as a surprise. More importantly, this is no longer just… Read More


What Winemakers and Chip Designers Have in Common

What Winemakers and Chip Designers Have in Common
by Daniel Nenni on 05-22-2026 at 7:00 am

What Winemakers and Chip Designers Have in Common

Consider this a standout presentation at the Silicon Catalyst Spring Portfolio Update Meeting held yesterday at the Computer History Museum. Mahesh Tirupattur, CEO of Analog Bits, is a modern-day, multidimensional semiconductor hero and one of my trusted few. Analog Bits is a premier member of the semiconductor ecosystem,… Read More


Podcast EP347: Agentic Workflows from Caspia Technologies for Advanced Chip Security Verification with Stuart Audley

Podcast EP347: Agentic Workflows from Caspia Technologies for Advanced Chip Security Verification with Stuart Audley
by Daniel Nenni on 05-22-2026 at 6:00 am

Daniel is joined by Stuart Audley, vice president and general manager of product management at Caspia Technologies, where he focuses on agentic security workflows. He has decades of experience designing and deploying cryptographic hardware and security IP for top defense and leading semiconductor companies. He previously… Read More


Semiconductors Historic Start to 2026

Semiconductors Historic Start to 2026
by Bill Jewell on 05-21-2026 at 2:00 pm

2026 Semiconductor Revenue Forecast

The global semiconductor market grew 25% in the 1st quarter of 2026 from the 4th quarter of 2025 to reach $299 billion, according to WSTS. The 1st quarter of 2026 was up 79% from a year earlier. The 25% quarter-to-quarter growth was the highest in the over 40-year history of WSTS data, surpassing the 20% growth in the 2nd quarter of 2009.… Read More


If You Struggle with Up-To-Date Documentation llmda.ai Can Help

If You Struggle with Up-To-Date Documentation llmda.ai Can Help
by Mike Gianfagna on 05-21-2026 at 10:00 am

If You Struggle with Up To Date Documentation llmda.ai Can Help

Accurate, complete, and consistent technical documentation is a critical element of success for any embedded system design project. This includes IP, SoCs, and the associated hardware and software infrastructure. When documentation contains errors, the consequences go beyond engineering inefficiency. Errors that drive… Read More


Bronco AI Webinar: Full-Chip SoC Debug in 15 Minutes

Bronco AI Webinar: Full-Chip SoC Debug in 15 Minutes
by Daniel Nenni on 05-21-2026 at 8:00 am

BroncoBlogPostDetective

A single bug on a full-chip SoC can pull engineers off roadmap work for days or even weeks. It involves massive waveforms, thousands of files of RTL and UVM, and dense specs that aren’t always perfect. Finding these bugs have always been a matter of engineer-hours and how well knowledge diffuses through the organization.

Bronco … Read More


Europe is Getting Serious About ASIC Innovation

Europe is Getting Serious About ASIC Innovation
by Bernard Murphy on 05-21-2026 at 6:00 am

European ASIC Startups

I was born in the UK (then still a part of Europe), so always eager to see them succeed. But I must admit that past behavior has reinforced the view that the EU’s only active “contribution” to progress is regulation. However this seems to be changing in multiple interesting ways. On a grand scale, the Nordic economic model is taking … Read More


Siemens EDA Expands AI and Advanced Packaging Collaboration with TSMC

Siemens EDA Expands AI and Advanced Packaging Collaboration with TSMC
by Daniel Nenni on 05-20-2026 at 10:00 am

SIemens EDA TSMC Teshnical Symposium 2026

At the recent TSMC Technology Symposium 2026, Siemens EDA reinforced its position as one of the key ecosystem partners supporting TSMC in the race toward AI-driven semiconductor design, advanced packaging, and next-generation process technologies. The annual forum has become one of the semiconductor industry’s most important… Read More


Semidynamics Secures a Strategic Investment to Advance Memory-Centric AI Inference Chips

Semidynamics Secures a Strategic Investment to Advance Memory-Centric AI Inference Chips
by Daniel Nenni on 05-20-2026 at 8:00 am

Semidynamics Secures a Strategic Investment

In the rapidly evolving world of artificial intelligence hardware, memory bandwidth and data movement have become just as important as raw compute power. Addressing this challenge head-on, Semidynamics has announced a strategic investment aimed at accelerating the development of its next-generation memory-centric AI … Read More