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WEBINAR: Outrunning the Data Wave – Why we need to keep pace with the coming 400% data surge 

WEBINAR: Outrunning the Data Wave – Why we need to keep pace with the coming 400% data surge 
by Daniel Nenni on 03-12-2026 at 10:00 am

A Practical Blueprint for Scaling the Digital Foundation of Silicon Photonics and Co Packaged Optics (1)

The semiconductor manufacturing industry has hit a new era of data intensity. We know that we need to look at alternatives to silicon and that electrical interconnects are unable to keep pace. We know we need to design more chiplets and alter microchip architecture. But how much data are we talking specifically, and how much

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Ravi Subramanian on Trends that are Shaping AI at Synopsys

Ravi Subramanian on Trends that are Shaping AI at Synopsys
by Daniel Nenni on 03-12-2026 at 8:00 am

Ravi Interview Synopsys Converge

Right before the Synopsys Converge Keynote I caught an interview with Ravi Subramanian, Chief Product Management Officer at Synopsys, which highlights several important trends shaping the future of AI, semiconductor technology, and engineering. His discussion focuses on how the worlds of silicon design and system engineering… Read More


Axiomise Introduces nocProve to Transform NoC Design Verification

Axiomise Introduces nocProve to Transform NoC Design Verification
by Daniel Nenni on 03-12-2026 at 6:00 am

Axiomise Launches nocProve for NoC Verification

Axiomise has recently launched a new verification tool called nocProve which will transform how Network-on-Chip designs are validated in modern hardware development, absolutely.

The tool is designed to be the first configurable formal verification application specifically created for NoC implementations. It addresses… Read More


Qnity and Silicon Catalyst Light a Path to Success at the Chiplet Summit

Qnity and Silicon Catalyst Light a Path to Success at the Chiplet Summit
by Mike Gianfagna on 03-11-2026 at 10:00 am

Qnity and Silicon Catalyst Light a Path to Success at the Chiplet Summit

The Chiplet Summit recently concluded. Multi-die heterogeneous design is a hot topic these days and chiplets are a key enabler for this trend. The conference was noticeably larger this year. There were many presentations and exhibits that focused on areas such as how to design chiplets, what standards are important, how to integrate… Read More


Intel Foundry: How They Got Here and Scenarios for Improvement

Intel Foundry: How They Got Here and Scenarios for Improvement
by Mark Webb on 03-11-2026 at 8:00 am

Intel Foundry How They Got Here and Scenarios for Improvement

How do you get a shortage while not growing???

Intel Announced earnings in January. Then David Zinsner presented updates on business this week. David is open when talking and always shares 2-3 things he probably should not share. Often he shares things some of us know, but we cannot present because it is not public. Then he makes it… Read More


The Next Hurdle AI Systems Must Clear

The Next Hurdle AI Systems Must Clear
by Bernard Murphy on 03-11-2026 at 6:00 am

datacenter surrounded by power plants

AI isn’t having an easy ride. The media and Wall Street swing wildly between extremes on any hint of a shift in AI sentiment. Dickens saw this coming: “It was the best of times, it was the worst of times, it was the age of wisdom, it was the age of foolishness, it was the epoch of belief, it was the epoch of incredulity, it was the season of Read More


Why Your LLM-Generated Testbench Compiles But Doesn’t Verify: The Verification Gap Problem

Why Your LLM-Generated Testbench Compiles But Doesn’t Verify: The Verification Gap Problem
by Admin on 03-10-2026 at 10:00 am

fig1 vg chart

By Vikash Kumar, Senior Verification Architect | Arm | IEEE Senior Member. 

The Problem Every Verification Engineer Recognizes

You ask an LLM to generate a UVM testbench. It produces 25 files. Everything compiles. You run the simulation — and nothing happens. The scoreboard reports zero checks. The slave driver stops after 10… Read More


Advanced Architectures for Hybrid III-V/Silicon Quantum Cascade Lasers

Advanced Architectures for Hybrid III-V/Silicon Quantum Cascade Lasers
by Daniel Nenni on 03-10-2026 at 8:00 am

CAE INL 2025

Mid-infrared (MIR) photonic integrated circuits are emerging as a key technology for applications ranging from environmental monitoring and medical diagnostics to defense and industrial process control. The MIR spectral region, often referred to as the molecular “fingerprint” region, exhibits strong absorption features… Read More


Efficient Bump and TSV Planning for Multi-Die Chip Designs

Efficient Bump and TSV Planning for Multi-Die Chip Designs
by Daniel Nenni on 03-10-2026 at 6:00 am

Efficient Bump and TSV Planning for Multi Die Chip Designs

The semiconductor industry has experienced rapid advancements in recent years, particularly with the increasing demand for high-performance computing, artificial intelligence, and advanced automotive systems. Traditional single-die chip designs are often unable to meet modern PPA requirements. As a result, engineers… Read More


The Evolution of RISC-V and the Role of Andes Technology in Building a Global Ecosystem

The Evolution of RISC-V and the Role of Andes Technology in Building a Global Ecosystem
by Daniel Nenni on 03-09-2026 at 10:00 am

RISC V Now Andes Conference

During my frequent trips to Taiwan as a foundry relationship professional I remember meeting Frankwell Lin, CEO of Andes, in Taiwan 15+ years ago. As I walked to TSMC HQ from the Hotel Royal (my second home for many years) Andes was about mid point and Frankwell’s door was always open. Sometimes just tea, sometimes technology,… Read More