I have written before about an inter-chiplet communication challenge to realizing the dream of multi-die designs built around open-market chiplets. Still a worthy dream but it’s going to take a journey to get there. Arm recently donated their Foundation Chiplet System Architecture (FCSA) to the Open Compute Project (OCP) as… Read More
WEBINAR: How PCIe Multistream Architecture is Enabling AI ConnectivityIn the race to power ever-larger AI models,…Read More
A Six-Minute Journey to Secure Chip Design with CaspiaHardware-level chip security has become an important topic…Read More
Lessons from the DeepChip Wars: What a Decade-old Debate Teaches Us About Tech EvolutionThe competitive landscape of hardware-assisted verification (HAV) has…Read More
Think Quantum Computing is Hype? Mastercard Begs to DisagreeJust got an opportunity to write a blog…Read More
TSMC Kumamoto: Pioneering Japan's Semiconductor RevivalIn the lush landscapes of Kumamoto Prefecture, on…Read MoreBoosting SoC Design Productivity with IP-XACT
IP-XACT, defined by IEEE 1685, is a standard that pulls together IP packaging, integration, and reuse. For anyone building modern SoCs (Systems on Chip), IP-XACT isn’t just another XML schema: it is a productivity multiplier and a risk-reduction tool that brings order to your electronic system design.
What is IP-XACT?
IP-XACT… Read More
Revolution EDA: A New EDA Mindset for a New Era
Murat Eskiyerli, PhD, is the founder of Revolution EDA
Modern software development environments have evolved dramatically. A developer can download Visual Studio Code, install a few plugins, and be productive within minutes. The cost? Perhaps a few hundred dollars per month for cloud development resources. Compare that to… Read More
CEO Interview with Roy Barnes of TPC
Roy Barnes is the group president of The Partner Companies (TPC), a specialty manufacturer, overseeing TPC’s photochemical etching companies: Elcon, E-Fab, Fotofab, Microphoto and PEI.
Roy is an experienced leader known for building strong teams, driving change and inspiring people to succeed. Throughout his career, he … Read More
CEO Interview with Mr. Shoichi Teshiba of Macnica ATD
With over 30 years of experience in sales and marketing of semiconductors and electronic components, Mr. Shoichi Teshiba has worked across a broad range of industries including storage, servers, networking, consumer electronics, industrial equipment, and automotive. Combining deep insight into both domestic and global… Read More
Podcast EP317: A Broad Overview of Design Data Management with Keysight’s Pedro Pires
Daniel is joined by Pedro Pires, a product and technology leader with a strong background in IP and data management within the EDA industry. Currently a product manager at Keysight Technologies, he drives the roadmap for the AI-driven data management solutions. Pedro’s career spans roles in software engineering and data science… Read More
Silicon Catalyst on the Road to $1 Trillion Industry
There were quite a few announcements at the Silicon Catalyst event at the Computer History Museum last week. The event itself was eventful with semiconductor legends in the audience and on the stage. First let’s talk about the announcements Silicon Catalyst made then we will talk about the event itself.
In addition to expanding… Read More
WEBINAR: Revolutionizing Electrical Verification in IC Design
In the complex world of IC design, electrical verification has emerged as a critical yet often overlooked bottleneck. Aniah’s upcoming webinar on December 4, 2025, titled “Electrical Verification: The Invisible Bottleneck in IC Design,” sheds light on this issue, introducing their groundbreaking OneCheck® solution. … Read More
Hierarchically defining bump and pin regions overcomes 3D IC complexity
By Todd Burkholder and Per Viklund, Siemens EDA
The landscape of advanced IC packaging is rapidly evolving, driven by the imperative to support innovation on increasingly complex and high-capacity products. The broad industry trend toward heterogeneous integration of diverse die and chiplets into advanced semiconductor… Read More
CDC Verification for Safety-Critical Designs – What You Need to Know
Verification is always a top priority for any chip project. Re-spins result in lost time-to-market and significant cost overruns. Chip bugs that make it to the field present another level of lost revenue, lost brand confidence and potential costly litigation. If the design is part of the avionics or control for an aircraft, the… Read More


AI RTL Generation versus AI RTL Verification