Chips&Media WAVE-J is a high-performance JPEG codec intellectual property core designed for advanced imaging systems that require very large image support, high throughput, flexible pixel formats, and integrated pre- and post-processing. It succeeds the CODAJ12V architecture while retaining compatibility with … Read More
CEO Interview with Ann Wu and Akash Levy of SilimateAnn Wu is Co-founder & CEO of Silimate.…Read More
From Process Learning to Production Control: Characterization for the Era of Heterogeneous SystemsEvery generation of semiconductor innovation has relied on…Read More
Five Myths about the Current Memory BoomThe current semiconductor memory boom is mainly an…Read More
How Fast Can a Performance Model Actually Be Built?By Thang Tran, CEO of Simplex Micro and…Read MoreCEO Interview with Joseph Krause of Radical AI
Joseph F. Krause is an American materials scientist, entrepreneur, and U.S. Army National Guard veteran. He is the cofounder and CEO of Radical AI, a New York deep-tech startup founded to accelerate the discovery of advanced materials.
Before Radical AI, Krause conducted nanomaterials research at Rice University, worked on… Read More
CEO Interview with Chuck McClish of of Lattrex Inc.
Chuck McClish is the founder of Lattrex Inc., a fabless semiconductor startup building Kyttar, an asynchronous, clockless reconfigurable processor for real-time signal processing. He spent 15 years at Microchip Technology in chip design and verification, working across RTL design, UVM verification, synthesis, place-and-route,… Read More
Podcast EP358: How Custom Silicon Development Allowed Cisco to Fuel New Innovation for Its Customers
Daniel is joined by Nick Kucharewski Senior Vice President and General Manager for Cisco’s silicon development organization. In this role he is responsible for the end-to-end strategy, cross-functional execution, organization alignment, and product roadmap for Silicon One, Cisco’s uniquely scalable and programmable … Read More
DAC 2026: The Trouble with John Cooley’s Troublemaker Panel
For quite a few years, John Cooley has hosted the Troublemaker Panel at DAC. The event consists of a panel of senior executives from the EDA industry. John Cooley asks his readers for “edgy” questions to ask the panelists and on event day, he does just that. Those with complete responses that are backed with real data from real customers… Read More
The Difference Between TSMC CoWoS-S and CoWoS-R
CoWoS-S and CoWoS-R are two versions of TSMC’s Chip-on-Wafer-on-Substrate advanced packaging platform. Both technologies are designed to combine high-performance processors, chiplets and high-bandwidth memory, or HBM, within a single package. This shortens the electrical connections between computing and memory components,… Read More
From Photonics Precision to Repeatable Evidence
Why Optical Probing Is Becoming a Manufacturing Boundary for Silicon Photonics
Silicon photonics has already shown that extremely precise optical alignment is possible.
In controlled laboratory environments, engineers can align fibers, waveguides, grating couplers, edge couplers, modulators, detectors, and electrical… Read More
Industry’s First Certified Automotive Grade PUF for Software Defined Vehicles
Software defined vehicles (SDVs) are transforming the automotive industry. Today’s vehicles are connected computing platforms that rely on advanced processors, artificial intelligence (AI), over the air (OTA) software updates, cloud services, and vehicle to everything (V2X) communications. Every electronic … Read More
Formal Acceleration on FPGA. Innovation in Verification
Extending hardware acceleration to formal verification is a powerful idea to extend hardware acceleration to a verification domain that has not got much attention for acceleration. Paul Cunningham (GM, Verification at Cadence), Raúl Camposano (Silicon Catalyst, entrepreneur, former Synopsys CTO and lecturer at Stanford,… Read More
Previewing FMS 2026: The Next Frontier of Enterprise Memory, CXL, and AI-Era Storage
For anyone tracking enterprise infrastructure, the storage landscape is moving at a breakneck pace. The explosive growth of generative AI, multi-million token context windows, and massive data-centric workloads have pushed traditional memory and storage architectures to their absolute limits.
This August, the industry… Read More



TSMC CoPoS Versus Intel EMIB Semiconductor Packaging