-ASML reports strong quarter- Orders up 20% Qtr/Qtr
-Customers rush delivery which delays revenue recognition
-Chip makers need hard to get litho tools most of all
-Warning on concerns about consumer chip demand
Good numbers that are even better in reality
ASML reported revenues of Euro5.4B and EPS of Euro3.54. Most importantly… Read More
Dan is joined by Gopi Sirineni, the President & CEO of Axiado, a company that is spearheading unique security technologies with AI in hardware. He is a Silicon Valley veteran with over 25 years of successes in the semiconductor, software and systems industries.
Gopi explains what’s different about the Axiado approach… Read More
Dr. Jaushin Lee is the founder and CEO of Zentera Systems. He is the visionary architect behind the award-winning Zentera CoIP (Cloud over IP) platform that enables enterprises to dramatically accelerate their journey to Zero Trust security. Jaushin brings 20 years of management and executive experience in networking and computer… Read More
There is a major shift in innovation occurring all around us. We see the results every day. We can interact with them in an easier, more intuitive way. They deliver insights about our health and our daily habits. All this can be categorized as a move towards Smart Everything – ubiquitous machine-assisted intelligence for the good… Read More
Artificial intelligence (AI) is reserved for companies with hordes of data scientists, right? There’s plenty of big problems where heavy-duty AI fits. There’s also a space of smaller, well-explored problems where lighter AI can deliver rapid results. Flex Logix is taking that idea a step further, packaging their InferX X1 edge… Read More
In the flood of CPU and GPU announcements in pursuit of new technology advances, it is easy to lose track of another kind of platform – DSPs. Digital signal processors, once a niche platform for specialized applications, are now front and center in some of the hottest technologies. Because their strength in signal processing has… Read More
Universal Chiplet Interconnect Express (UCIe) is an open specification that defines the interconnect between chiplets within a package. The objective is to enable an open chiplet ecosystem. Although the initial specification for UCIe was developed by Intel, a consortium was announced in March with Intel, AMD, Arm, Google,… Read More
At the recent VLSI Symposium on Technology and Circuits, Dr. Y.J. Mii, Senior Vice President of Research and Development at TSMC, gave a plenary talk entitled, “Semiconductor Innovations, from Device to System”. The presentation offered insights into TSMC’s future R&D initiatives, beyond the current roadmap. The associated… Read More
At least once if not more, many of us may have faced the following situation. We download the latest software driver for a device only to find out after installing that it doesn’t work for your hardware. As per the release notes, it should work for your hardware but in reality it does not. We have no choice but to revert back to the earlier… Read More
Clocking for High-Speed SerDesby Tom Dillinger on 07-18-2022 at 6:00 amCategories: Cadence, EDA, Events
The incessant demand for faster data rates across a wide range of end applications has led to the development of the most recent generation of SerDes hardware, achieving 112Gbps. For example, network switches in datacenter architectures are starting to provide 51T throughput utilizing these new 112Gbps implementations (51.2Tbps… Read More
The Importance of Productizing AI. Everyday Examples